CH553530A - Leiterplatte mit ein- oder doppelseitig aufgedruckten leiterbildern fuer ein- oder beidseitige bestueckung. - Google Patents

Leiterplatte mit ein- oder doppelseitig aufgedruckten leiterbildern fuer ein- oder beidseitige bestueckung.

Info

Publication number
CH553530A
CH553530A CH1827072A CH1827072A CH553530A CH 553530 A CH553530 A CH 553530A CH 1827072 A CH1827072 A CH 1827072A CH 1827072 A CH1827072 A CH 1827072A CH 553530 A CH553530 A CH 553530A
Authority
CH
Switzerland
Prior art keywords
circuit board
printed circuit
double sides
sides printed
sided equipment
Prior art date
Application number
CH1827072A
Other languages
English (en)
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH1827072A priority Critical patent/CH553530A/de
Priority to FR7344739A priority patent/FR2210886A3/fr
Publication of CH553530A publication Critical patent/CH553530A/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10575—Insulating foil under component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
CH1827072A 1972-12-18 1972-12-18 Leiterplatte mit ein- oder doppelseitig aufgedruckten leiterbildern fuer ein- oder beidseitige bestueckung. CH553530A (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CH1827072A CH553530A (de) 1972-12-18 1972-12-18 Leiterplatte mit ein- oder doppelseitig aufgedruckten leiterbildern fuer ein- oder beidseitige bestueckung.
FR7344739A FR2210886A3 (en) 1972-12-18 1973-12-14 Plastics foil coated printed circuit board - with the coating on side to which components are to be attached

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1827072A CH553530A (de) 1972-12-18 1972-12-18 Leiterplatte mit ein- oder doppelseitig aufgedruckten leiterbildern fuer ein- oder beidseitige bestueckung.

Publications (1)

Publication Number Publication Date
CH553530A true CH553530A (de) 1974-08-30

Family

ID=4431749

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1827072A CH553530A (de) 1972-12-18 1972-12-18 Leiterplatte mit ein- oder doppelseitig aufgedruckten leiterbildern fuer ein- oder beidseitige bestueckung.

Country Status (2)

Country Link
CH (1) CH553530A (de)
FR (1) FR2210886A3 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0151559A1 (de) * 1984-02-03 1985-08-14 Telefonaktiebolaget L M Ericsson Schutzanordnung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0151559A1 (de) * 1984-02-03 1985-08-14 Telefonaktiebolaget L M Ericsson Schutzanordnung
WO1985003602A1 (en) * 1984-02-03 1985-08-15 Telefonaktiebolaget Lm Ericsson Transient protection unit

Also Published As

Publication number Publication date
FR2210886A3 (en) 1974-07-12
FR2210886B3 (de) 1975-03-21

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Legal Events

Date Code Title Description
PL Patent ceased