CH553530A - CIRCUIT BOARD WITH SINGLE OR DOUBLE SIDES PRINTED CIRCUIT DIAGRAMS FOR ONE OR BOTH SIDED EQUIPMENT. - Google Patents

CIRCUIT BOARD WITH SINGLE OR DOUBLE SIDES PRINTED CIRCUIT DIAGRAMS FOR ONE OR BOTH SIDED EQUIPMENT.

Info

Publication number
CH553530A
CH553530A CH1827072A CH1827072A CH553530A CH 553530 A CH553530 A CH 553530A CH 1827072 A CH1827072 A CH 1827072A CH 1827072 A CH1827072 A CH 1827072A CH 553530 A CH553530 A CH 553530A
Authority
CH
Switzerland
Prior art keywords
circuit board
printed circuit
double sides
sides printed
sided equipment
Prior art date
Application number
CH1827072A
Other languages
German (de)
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH1827072A priority Critical patent/CH553530A/en
Priority to FR7344739A priority patent/FR2210886A3/en
Publication of CH553530A publication Critical patent/CH553530A/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10575Insulating foil under component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189Pressing leads, bumps or a die through an insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
CH1827072A 1972-12-18 1972-12-18 CIRCUIT BOARD WITH SINGLE OR DOUBLE SIDES PRINTED CIRCUIT DIAGRAMS FOR ONE OR BOTH SIDED EQUIPMENT. CH553530A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CH1827072A CH553530A (en) 1972-12-18 1972-12-18 CIRCUIT BOARD WITH SINGLE OR DOUBLE SIDES PRINTED CIRCUIT DIAGRAMS FOR ONE OR BOTH SIDED EQUIPMENT.
FR7344739A FR2210886A3 (en) 1972-12-18 1973-12-14 Plastics foil coated printed circuit board - with the coating on side to which components are to be attached

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1827072A CH553530A (en) 1972-12-18 1972-12-18 CIRCUIT BOARD WITH SINGLE OR DOUBLE SIDES PRINTED CIRCUIT DIAGRAMS FOR ONE OR BOTH SIDED EQUIPMENT.

Publications (1)

Publication Number Publication Date
CH553530A true CH553530A (en) 1974-08-30

Family

ID=4431749

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1827072A CH553530A (en) 1972-12-18 1972-12-18 CIRCUIT BOARD WITH SINGLE OR DOUBLE SIDES PRINTED CIRCUIT DIAGRAMS FOR ONE OR BOTH SIDED EQUIPMENT.

Country Status (2)

Country Link
CH (1) CH553530A (en)
FR (1) FR2210886A3 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0151559A1 (en) * 1984-02-03 1985-08-14 Telefonaktiebolaget L M Ericsson Transient protection unit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0151559A1 (en) * 1984-02-03 1985-08-14 Telefonaktiebolaget L M Ericsson Transient protection unit
WO1985003602A1 (en) * 1984-02-03 1985-08-15 Telefonaktiebolaget Lm Ericsson Transient protection unit

Also Published As

Publication number Publication date
FR2210886B3 (en) 1975-03-21
FR2210886A3 (en) 1974-07-12

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Legal Events

Date Code Title Description
PL Patent ceased