FR2210080A1 - - Google Patents
Info
- Publication number
- FR2210080A1 FR2210080A1 FR7339437A FR7339437A FR2210080A1 FR 2210080 A1 FR2210080 A1 FR 2210080A1 FR 7339437 A FR7339437 A FR 7339437A FR 7339437 A FR7339437 A FR 7339437A FR 2210080 A1 FR2210080 A1 FR 2210080A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1518—Vertically held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US00314080A US3825164A (en) | 1972-12-11 | 1972-12-11 | Apparatus for soldering printed circuit cards |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2210080A1 true FR2210080A1 (fr) | 1974-07-05 |
FR2210080B1 FR2210080B1 (fr) | 1976-04-30 |
Family
ID=23218471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7339437A Expired FR2210080B1 (fr) | 1972-12-11 | 1973-10-29 |
Country Status (6)
Country | Link |
---|---|
US (1) | US3825164A (fr) |
JP (1) | JPS5319300B2 (fr) |
CA (1) | CA994611A (fr) |
DE (1) | DE2359154C2 (fr) |
FR (1) | FR2210080B1 (fr) |
GB (1) | GB1410306A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2564763A1 (fr) * | 1984-05-25 | 1985-11-29 | Htc Corp | Appareil et procede de soudage, notamment pour circuits imprimes |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE30399E (en) * | 1977-08-19 | 1980-09-09 | Western Electric Co., Inc. | Method for soldering, fusing or brazing |
CH656769A5 (de) * | 1980-09-09 | 1986-07-15 | Sinter Ltd | Vorrichtung zum aufbringen von lot auf leiterplatten. |
GB2120964A (en) * | 1982-03-25 | 1983-12-14 | Alpha Metals | Processes of applying solder |
US4685605A (en) * | 1984-05-25 | 1987-08-11 | The Htc Corporation | Continuous solder system |
US4684054A (en) * | 1985-03-30 | 1987-08-04 | Asahi Chemical Research Laboratory Co., Ltd. | Automatic soldering apparatus and method of using the flux to heat the circuit board |
JPS61238464A (ja) * | 1985-04-13 | 1986-10-23 | Eiichi Miyake | 物品加熱装置 |
DE3539585A1 (de) * | 1985-10-11 | 1987-07-02 | Kaspar Eidenberg | Verfahren zum verloeten der anschluesse von bauteilen mit den leiterbahnen und loetaugen von leiterplatten und vorrichtung zum durchfuehren dieses verfahrens |
DE3607089C1 (de) * | 1986-03-01 | 1987-06-19 | Sachs Ersa Kg | Loetmaschine |
US4766677A (en) * | 1986-05-27 | 1988-08-30 | Detrex Chemical Industries, Inc. | Method and apparatus for vapor phase soldering |
US4778099A (en) * | 1987-12-07 | 1988-10-18 | American Telephone And Telegraph Company, At&T Technologies, Inc. | Soldering method and apparatus |
JPH10125618A (ja) * | 1996-10-23 | 1998-05-15 | Fujitsu Ltd | 半導体装置の製造方法 |
US5964395A (en) * | 1997-06-09 | 1999-10-12 | Ford Motor Company | Predeposited transient phase electronic interconnect media |
JP5762137B2 (ja) * | 2011-05-27 | 2015-08-12 | 上村工業株式会社 | めっき方法 |
CN104014894B (zh) * | 2014-06-18 | 2016-02-03 | 温州市正邦电子设备有限公司 | 全自动浸焊机 |
US10245668B2 (en) * | 2016-10-31 | 2019-04-02 | Kulicke And Soffa Industries, Inc | Fluxing systems, bonding machines including fluxing systems, and methods of operating the same |
CN112004400A (zh) * | 2020-09-07 | 2020-11-27 | 游隼信息技术科技(苏州)有限公司 | 一种基于追剪模式的高精度实时动态追踪系统 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3058441A (en) * | 1956-10-02 | 1962-10-16 | Sanders Associates Inc | Soldering apparatus and method of soldering electrical conductors |
US3553824A (en) * | 1968-05-09 | 1971-01-12 | Western Electric Co | Process for eliminating icicle-like formations on soldered circuit substrates |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3298588A (en) * | 1964-01-23 | 1967-01-17 | Sanders Associates Inc | Printed circuit board and machine for soldering same |
-
1972
- 1972-12-11 US US00314080A patent/US3825164A/en not_active Expired - Lifetime
-
1973
- 1973-10-29 FR FR7339437A patent/FR2210080B1/fr not_active Expired
- 1973-11-06 JP JP12409973A patent/JPS5319300B2/ja not_active Expired
- 1973-11-09 CA CA185,429A patent/CA994611A/en not_active Expired
- 1973-11-28 DE DE2359154A patent/DE2359154C2/de not_active Expired
- 1973-11-29 GB GB5535473A patent/GB1410306A/en not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3058441A (en) * | 1956-10-02 | 1962-10-16 | Sanders Associates Inc | Soldering apparatus and method of soldering electrical conductors |
US3553824A (en) * | 1968-05-09 | 1971-01-12 | Western Electric Co | Process for eliminating icicle-like formations on soldered circuit substrates |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2564763A1 (fr) * | 1984-05-25 | 1985-11-29 | Htc Corp | Appareil et procede de soudage, notamment pour circuits imprimes |
Also Published As
Publication number | Publication date |
---|---|
JPS5319300B2 (fr) | 1978-06-20 |
US3825164A (en) | 1974-07-23 |
JPS4996949A (fr) | 1974-09-13 |
DE2359154C2 (de) | 1982-06-24 |
FR2210080B1 (fr) | 1976-04-30 |
DE2359154A1 (de) | 1974-06-12 |
GB1410306A (en) | 1975-10-15 |
CA994611A (en) | 1976-08-10 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |