FR2209274A1 - - Google Patents

Info

Publication number
FR2209274A1
FR2209274A1 FR7343043A FR7343043A FR2209274A1 FR 2209274 A1 FR2209274 A1 FR 2209274A1 FR 7343043 A FR7343043 A FR 7343043A FR 7343043 A FR7343043 A FR 7343043A FR 2209274 A1 FR2209274 A1 FR 2209274A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7343043A
Other languages
French (fr)
Other versions
FR2209274B1 (fi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US311206A external-priority patent/US3893409A/en
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of FR2209274A1 publication Critical patent/FR2209274A1/fr
Application granted granted Critical
Publication of FR2209274B1 publication Critical patent/FR2209274B1/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0002—Soldering by means of dipping in a fused salt bath
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR7343043A 1972-12-01 1973-12-03 Expired FR2209274B1 (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31120572A 1972-12-01 1972-12-01
US311206A US3893409A (en) 1972-12-01 1972-12-01 Apparatus for solder coating printed circuit boards

Publications (2)

Publication Number Publication Date
FR2209274A1 true FR2209274A1 (fi) 1974-06-28
FR2209274B1 FR2209274B1 (fi) 1979-05-04

Family

ID=26977779

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7343043A Expired FR2209274B1 (fi) 1972-12-01 1973-12-03

Country Status (4)

Country Link
CA (1) CA984522A (fi)
FR (1) FR2209274B1 (fi)
GB (1) GB1446636A (fi)
NL (1) NL7316549A (fi)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE32982E (en) * 1978-04-18 1989-07-11 Hollis Automation, Inc. Mass soldering system
CH656769A5 (de) * 1980-09-09 1986-07-15 Sinter Ltd Vorrichtung zum aufbringen von lot auf leiterplatten.
US4463891A (en) * 1981-11-18 1984-08-07 Rca Corporation Wave soldering apparatus and method
GB8334122D0 (en) * 1983-12-22 1984-02-01 Lymn P P A Solder leveller
GB2265101B (en) * 1992-03-17 1995-05-10 Sun Ind Coatings Soldering apparatus and method
US6168065B1 (en) 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2021316A5 (en) * 1969-09-19 1970-07-17 Burroughs Corp Finishing process for welded junctions on a - printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2021316A5 (en) * 1969-09-19 1970-07-17 Burroughs Corp Finishing process for welded junctions on a - printed circuit board

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
HEAD FOR SUBSTRATE TINNING', C.P. HAUNGA, PAGE 772.) *
REVUE US 'IBM TECHNICAL DISCLOSURE BULLETIN' VOL 13, N0 3, AOUT 1970, 'DOUBLE INPUT VIBRATION *

Also Published As

Publication number Publication date
GB1446636A (en) 1976-08-18
FR2209274B1 (fi) 1979-05-04
CA984522A (en) 1976-02-24
NL7316549A (fi) 1974-06-05

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Legal Events

Date Code Title Description
ST Notification of lapse