FR2204895A1 - - Google Patents

Info

Publication number
FR2204895A1
FR2204895A1 FR7338611A FR7338611A FR2204895A1 FR 2204895 A1 FR2204895 A1 FR 2204895A1 FR 7338611 A FR7338611 A FR 7338611A FR 7338611 A FR7338611 A FR 7338611A FR 2204895 A1 FR2204895 A1 FR 2204895A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7338611A
Other languages
French (fr)
Other versions
FR2204895B1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19722253489 external-priority patent/DE2253489C3/de
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2204895A1 publication Critical patent/FR2204895A1/fr
Application granted granted Critical
Publication of FR2204895B1 publication Critical patent/FR2204895B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/4901—Structure
    • H01L2224/4903—Connectors having different sizes, e.g. different diameters
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01014—Silicon [Si]
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    • H01L2924/01015—Phosphorus [P]
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    • H01L2924/01028—Nickel [Ni]
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    • H01L2924/01029—Copper [Cu]
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    • H01L2924/01047—Silver [Ag]
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    • H01L2924/0105—Tin [Sn]
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    • H01L2924/01058—Cerium [Ce]
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thyristors (AREA)
FR7338611A 1972-10-31 1973-10-30 Expired FR2204895B1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722253489 DE2253489C3 (de) 1972-10-31 Thyristor und Verfahren zu seiner Herstellung

Publications (2)

Publication Number Publication Date
FR2204895A1 true FR2204895A1 (es) 1974-05-24
FR2204895B1 FR2204895B1 (es) 1978-02-10

Family

ID=5860568

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7338611A Expired FR2204895B1 (es) 1972-10-31 1973-10-30

Country Status (5)

Country Link
JP (1) JPS5547469B2 (es)
BE (1) BE806821A (es)
CH (1) CH553480A (es)
FR (1) FR2204895B1 (es)
IT (1) IT998994B (es)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2382100A1 (fr) * 1977-02-25 1978-09-22 Nippon Electric Co Structure de brasage d'un conducteur sur un dispositif semi-conducteur

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1445855A (fr) * 1964-08-12 1966-07-15 Siemens Schcukertwerke Ag élément redresseur commandé à semiconducteur pour courants forts
FR1551485A (es) * 1967-01-25 1968-12-27
DE1917013A1 (de) * 1968-04-11 1969-10-23 Westinghouse Electric Corp Halbleitervierschichttriode
GB1199266A (en) * 1968-05-06 1970-07-22 Rca Corp Formerly Radio Corp O Power Transistor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1445855A (fr) * 1964-08-12 1966-07-15 Siemens Schcukertwerke Ag élément redresseur commandé à semiconducteur pour courants forts
FR1551485A (es) * 1967-01-25 1968-12-27
DE1917013A1 (de) * 1968-04-11 1969-10-23 Westinghouse Electric Corp Halbleitervierschichttriode
GB1199266A (en) * 1968-05-06 1970-07-22 Rca Corp Formerly Radio Corp O Power Transistor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2382100A1 (fr) * 1977-02-25 1978-09-22 Nippon Electric Co Structure de brasage d'un conducteur sur un dispositif semi-conducteur

Also Published As

Publication number Publication date
DE2253489B2 (de) 1977-04-28
IT998994B (it) 1976-02-20
JPS5547469B2 (es) 1980-11-29
CH553480A (de) 1974-08-30
JPS4978489A (es) 1974-07-29
FR2204895B1 (es) 1978-02-10
BE806821A (fr) 1974-02-15
DE2253489A1 (de) 1974-05-02

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