FR2176073A1 - Epoxy resin compsn - contg cycloaliphatic amine/silicon - amine hardener - for high voltage insulation - Google Patents

Epoxy resin compsn - contg cycloaliphatic amine/silicon - amine hardener - for high voltage insulation

Info

Publication number
FR2176073A1
FR2176073A1 FR7309189A FR7309189A FR2176073A1 FR 2176073 A1 FR2176073 A1 FR 2176073A1 FR 7309189 A FR7309189 A FR 7309189A FR 7309189 A FR7309189 A FR 7309189A FR 2176073 A1 FR2176073 A1 FR 2176073A1
Authority
FR
France
Prior art keywords
amine
epoxy resin
contg
silicon
high voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7309189A
Other languages
English (en)
French (fr)
Other versions
FR2176073B1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of FR2176073A1 publication Critical patent/FR2176073A1/fr
Application granted granted Critical
Publication of FR2176073B1 publication Critical patent/FR2176073B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5026—Amines cycloaliphatic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
FR7309189A 1972-03-15 1973-03-14 Epoxy resin compsn - contg cycloaliphatic amine/silicon - amine hardener - for high voltage insulation Granted FR2176073A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2635972A JPS5136800B2 (enrdf_load_stackoverflow) 1972-03-15 1972-03-15

Publications (2)

Publication Number Publication Date
FR2176073A1 true FR2176073A1 (en) 1973-10-26
FR2176073B1 FR2176073B1 (enrdf_load_stackoverflow) 1976-11-05

Family

ID=12191274

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7309189A Granted FR2176073A1 (en) 1972-03-15 1973-03-14 Epoxy resin compsn - contg cycloaliphatic amine/silicon - amine hardener - for high voltage insulation

Country Status (3)

Country Link
JP (1) JPS5136800B2 (enrdf_load_stackoverflow)
DE (1) DE2312525A1 (enrdf_load_stackoverflow)
FR (1) FR2176073A1 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2560203A1 (fr) * 1984-02-27 1985-08-30 Gen Electric Compositions de resines epoxy thermodurcissables comportant comme agent de durcissement un polyorganosiloxane a fonction aminoimidonorbornyle
WO1999067316A1 (en) * 1998-06-22 1999-12-29 Minnesota Mining And Manufacturing Company Adhesive compositions

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5940109B2 (ja) * 1978-10-06 1984-09-28 ダイキン工業株式会社 積層体および積層体形成方法
PH27310A (en) * 1988-05-13 1993-05-28 M & T Chemicals Inc Epoxy-aromatic polysiloxane compositions
US8431444B2 (en) * 2011-08-16 2013-04-30 General Electric Company Epoxy encapsulating and lamination adhesive and method of making same
CN117285698A (zh) * 2015-03-26 2023-12-26 亨斯迈先进材料特许（瑞士）有限公司 用于制备室外制品的热固性环氧树脂组合物以及由此获得的制品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1235413A (en) * 1968-01-26 1971-06-16 Dexter Corp Epoxy resin encapsulant compositions for semiconductors

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1235413A (en) * 1968-01-26 1971-06-16 Dexter Corp Epoxy resin encapsulant compositions for semiconductors

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2560203A1 (fr) * 1984-02-27 1985-08-30 Gen Electric Compositions de resines epoxy thermodurcissables comportant comme agent de durcissement un polyorganosiloxane a fonction aminoimidonorbornyle
WO1999067316A1 (en) * 1998-06-22 1999-12-29 Minnesota Mining And Manufacturing Company Adhesive compositions
US6196730B1 (en) 1998-06-22 2001-03-06 3M Innovative Properties Company Fiber optic connector containing a curable adhesive composition

Also Published As

Publication number Publication date
FR2176073B1 (enrdf_load_stackoverflow) 1976-11-05
JPS5136800B2 (enrdf_load_stackoverflow) 1976-10-12
DE2312525A1 (de) 1973-10-04
JPS4893699A (enrdf_load_stackoverflow) 1973-12-04

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Legal Events

Date Code Title Description
ST Notification of lapse