FR2166347B1 - - Google Patents

Info

Publication number
FR2166347B1
FR2166347B1 FR7222332A FR7222332A FR2166347B1 FR 2166347 B1 FR2166347 B1 FR 2166347B1 FR 7222332 A FR7222332 A FR 7222332A FR 7222332 A FR7222332 A FR 7222332A FR 2166347 B1 FR2166347 B1 FR 2166347B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7222332A
Other languages
French (fr)
Other versions
FR2166347A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mica Corp
Original Assignee
Mica Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mica Corp filed Critical Mica Corp
Publication of FR2166347A1 publication Critical patent/FR2166347A1/fr
Application granted granted Critical
Publication of FR2166347B1 publication Critical patent/FR2166347B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Non-Adjustable Resistors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
FR7222332A 1972-01-04 1972-06-21 Printed circuit laminate - with resistive under-cladding Granted FR2166347A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21539572A 1972-01-04 1972-01-04

Publications (2)

Publication Number Publication Date
FR2166347A1 FR2166347A1 (en) 1973-08-17
FR2166347B1 true FR2166347B1 (ja) 1977-12-30

Family

ID=22802825

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7222332A Granted FR2166347A1 (en) 1972-01-04 1972-06-21 Printed circuit laminate - with resistive under-cladding

Country Status (2)

Country Link
JP (1) JPS573234B2 (ja)
FR (1) FR2166347A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472468A (en) * 1977-11-21 1979-06-09 Nitto Electric Ind Co Printing circuit substrate with resistance
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
FR2554046B1 (fr) * 1983-10-28 1986-05-09 Gen Electric Stratifie recouvert de metal et procede de fabrication
JPS6199134A (ja) * 1984-10-20 1986-05-17 Fuji Photo Film Co Ltd 蓄積性螢光体シ−ト用消去ユニツト
JPS6413790A (en) * 1987-07-08 1989-01-18 Koa Corp Copper electrode paste
JP3954958B2 (ja) 2002-11-26 2007-08-08 古河テクノリサーチ株式会社 抵抗層付き銅箔及び抵抗層付き回路基板材料
JP4217778B2 (ja) 2003-04-11 2009-02-04 古河電気工業株式会社 抵抗層付き導電性基材、抵抗層付き回路基板及び抵抗回路配線板
JP2006005149A (ja) * 2004-06-17 2006-01-05 Furukawa Circuit Foil Kk 抵抗層付き導電性基材及び抵抗層付き回路基板材料
JP6015445B2 (ja) 2010-08-06 2016-10-26 日立化成株式会社 液状組成物、並びに、それを用いた抵抗体膜、抵抗体膜の製造方法、抵抗体素子及び配線板
CN107675176B (zh) * 2017-08-21 2019-05-17 陕西天元智能再制造股份有限公司 一种微弧氧化与真空熔覆相结合的工件表面强化处理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2662957A (en) * 1949-10-29 1953-12-15 Eisler Paul Electrical resistor or semiconductor
FR1366903A (fr) * 1963-06-04 1964-07-17 Ass Ouvriers Instr Precision Résistances imprimées et leur procédé de fabrication
GB1157618A (en) * 1965-09-13 1969-07-09 Engelhard Ind Ltd Laminate for Use in the Production of Printed Electrical Circuit Elements.
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same

Also Published As

Publication number Publication date
JPS4873762A (ja) 1973-10-04
JPS573234B2 (ja) 1982-01-20
FR2166347A1 (en) 1973-08-17

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse