FR2153325B1 - - Google Patents

Info

Publication number
FR2153325B1
FR2153325B1 FR7233253A FR7233253A FR2153325B1 FR 2153325 B1 FR2153325 B1 FR 2153325B1 FR 7233253 A FR7233253 A FR 7233253A FR 7233253 A FR7233253 A FR 7233253A FR 2153325 B1 FR2153325 B1 FR 2153325B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7233253A
Other versions
FR2153325A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2153325A1 publication Critical patent/FR2153325A1/fr
Application granted granted Critical
Publication of FR2153325B1 publication Critical patent/FR2153325B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146—By vapour deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Physical Vapour Deposition (AREA)
FR7233253A 1971-09-23 1972-09-20 Expired FR2153325B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2147573A DE2147573C2 (de) 1971-09-23 1971-09-23 Verfahren zur Herstellung von mikroelektronischen Schaltungen

Publications (2)

Publication Number Publication Date
FR2153325A1 FR2153325A1 (fr) 1973-05-04
FR2153325B1 true FR2153325B1 (fr) 1979-06-15

Family

ID=5820403

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7233253A Expired FR2153325B1 (fr) 1971-09-23 1972-09-20

Country Status (10)

Country Link
US (1) US3840986A (fr)
JP (1) JPS4841257A (fr)
AT (1) AT328018B (fr)
BE (1) BE789174A (fr)
CH (1) CH559000A (fr)
DE (1) DE2147573C2 (fr)
FR (1) FR2153325B1 (fr)
IT (1) IT967732B (fr)
LU (1) LU66129A1 (fr)
NL (1) NL7212864A (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50149974A (fr) * 1974-05-22 1975-12-01
US4271209A (en) * 1980-04-16 1981-06-02 Calspan Corporation Method and apparatus for coating the grooved bottoms of substrates
JPS59215364A (ja) * 1983-05-21 1984-12-05 Asahi Kagaku Kenkyusho:Kk マスキング塗料
JPS60132388A (ja) * 1983-12-20 1985-07-15 凸版印刷株式会社 プリント配線板の製造方法
JPS59150495A (ja) * 1984-01-23 1984-08-28 株式会社東芝 厚膜回路基板の製造方法
DE3545258A1 (de) * 1985-12-20 1987-06-25 Licentia Gmbh Verfahren zur herstellung von schaltungen in duennschichttechnik
JP2604855B2 (ja) * 1989-05-25 1997-04-30 松下電工株式会社 回路板のスルーホール形成方法
US5472592A (en) * 1994-07-19 1995-12-05 American Plating Systems Electrolytic plating apparatus and method
US7556695B2 (en) * 2002-05-06 2009-07-07 Honeywell International, Inc. Apparatus to make nanolaminate thermal barrier coatings
KR100797692B1 (ko) 2006-06-20 2008-01-23 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US7598104B2 (en) 2006-11-24 2009-10-06 Agency For Science, Technology And Research Method of forming a metal contact and passivation of a semiconductor feature
DE102007033488A1 (de) * 2007-07-18 2009-04-30 Samsung Electro - Mechanics Co., Ltd., Suwon-shi Leiterplatte und ihr Fertigungsverfahren
TW201410085A (zh) * 2012-05-02 2014-03-01 Ceramtec Gmbh 製造具充金屬之通路的陶瓷基材的陶瓷電路板的方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1073197B (fr) * 1955-06-28 1960-01-14
US3128205A (en) * 1961-09-11 1964-04-07 Optical Coating Laboratory Inc Apparatus for vacuum coating
US3583363A (en) * 1969-03-05 1971-06-08 Air Reduction Substrate support apparatus
US3656453A (en) * 1969-08-07 1972-04-18 Brodynamics Research Corp Specimen positioning
US3643625A (en) * 1969-10-07 1972-02-22 Carl Herrmann Associates Inc Thin-film deposition apparatus
US3598083A (en) * 1969-10-27 1971-08-10 Varian Associates Complex motion mechanism for thin film coating apparatuses
US3668028A (en) * 1970-06-10 1972-06-06 Du Pont Method of making printing masks with high energy beams

Also Published As

Publication number Publication date
AT328018B (de) 1976-02-25
US3840986A (en) 1974-10-15
ATA460272A (de) 1975-05-15
DE2147573B1 (de) 1972-10-26
LU66129A1 (fr) 1973-01-17
DE2147573C2 (de) 1974-06-12
BE789174A (fr) 1973-01-15
IT967732B (it) 1974-03-11
CH559000A (de) 1975-02-14
NL7212864A (fr) 1973-03-27
FR2153325A1 (fr) 1973-05-04
JPS4841257A (fr) 1973-06-16

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Legal Events

Date Code Title Description
ST Notification of lapse