US4009539A
(en)
*
|
1975-06-16 |
1977-03-01 |
Spitfire Tool & Machine Co., Inc. |
Lapping machine with vacuum workholder
|
US4194324A
(en)
*
|
1978-01-16 |
1980-03-25 |
Siltec Corporation |
Semiconductor wafer polishing machine and wafer carrier therefor
|
SE444526B
(sv)
*
|
1978-01-23 |
1986-04-21 |
Western Electric Co |
Sett att i lege och plan placera en substratbricka
|
US4213698A
(en)
*
|
1978-12-01 |
1980-07-22 |
Bell Telephone Laboratories, Incorporated |
Apparatus and method for holding and planarizing thin workpieces
|
USRE31053E
(en)
*
|
1978-01-23 |
1982-10-12 |
Bell Telephone Laboratories, Incorporated |
Apparatus and method for holding and planarizing thin workpieces
|
US4313284A
(en)
*
|
1980-03-27 |
1982-02-02 |
Monsanto Company |
Apparatus for improving flatness of polished wafers
|
US4339297A
(en)
*
|
1981-04-14 |
1982-07-13 |
Seiichiro Aigo |
Apparatus for etching of oxide film on semiconductor wafer
|
US4921564A
(en)
*
|
1988-05-23 |
1990-05-01 |
Semiconductor Equipment Corp. |
Method and apparatus for removing circuit chips from wafer handling tape
|
JPH02174116A
(ja)
*
|
1988-12-26 |
1990-07-05 |
Toshiba Ceramics Co Ltd |
サセプタ
|
US5443416A
(en)
*
|
1993-09-09 |
1995-08-22 |
Cybeq Systems Incorporated |
Rotary union for coupling fluids in a wafer polishing apparatus
|
US6746565B1
(en)
*
|
1995-08-17 |
2004-06-08 |
Semitool, Inc. |
Semiconductor processor with wafer face protection
|
US5857636A
(en)
*
|
1995-09-05 |
1999-01-12 |
M & D Balloons, Inc. |
Method and apparatus for providing securement for toy balloons
|
JP3441879B2
(ja)
*
|
1996-03-29 |
2003-09-02 |
日本碍子株式会社 |
チップ剥離装置
|
US5716258A
(en)
*
|
1996-11-26 |
1998-02-10 |
Metcalf; Robert L. |
Semiconductor wafer polishing machine and method
|
US6425812B1
(en)
|
1997-04-08 |
2002-07-30 |
Lam Research Corporation |
Polishing head for chemical mechanical polishing using linear planarization technology
|
US6244946B1
(en)
|
1997-04-08 |
2001-06-12 |
Lam Research Corporation |
Polishing head with removable subcarrier
|
US6336845B1
(en)
|
1997-11-12 |
2002-01-08 |
Lam Research Corporation |
Method and apparatus for polishing semiconductor wafers
|
US5989104A
(en)
*
|
1998-01-12 |
1999-11-23 |
Speedfam-Ipec Corporation |
Workpiece carrier with monopiece pressure plate and low gimbal point
|
US6203408B1
(en)
*
|
1999-08-26 |
2001-03-20 |
Chartered Semiconductor Manufacturing Ltd. |
Variable pressure plate CMP carrier
|
US6431959B1
(en)
|
1999-12-20 |
2002-08-13 |
Lam Research Corporation |
System and method of defect optimization for chemical mechanical planarization of polysilicon
|
US6666756B1
(en)
|
2000-03-31 |
2003-12-23 |
Lam Research Corporation |
Wafer carrier head assembly
|
US7497767B2
(en)
*
|
2000-09-08 |
2009-03-03 |
Applied Materials, Inc. |
Vibration damping during chemical mechanical polishing
|
US7255637B2
(en)
*
|
2000-09-08 |
2007-08-14 |
Applied Materials, Inc. |
Carrier head vibration damping
|
US6676497B1
(en)
*
|
2000-09-08 |
2004-01-13 |
Applied Materials Inc. |
Vibration damping in a chemical mechanical polishing system
|
US6716084B2
(en)
*
|
2001-01-11 |
2004-04-06 |
Nutool, Inc. |
Carrier head for holding a wafer and allowing processing on a front face thereof to occur
|
TW535198B
(en)
*
|
2002-02-15 |
2003-06-01 |
United Microelectronics Corp |
Membrane for vacuum suction of wafer
|
US7357115B2
(en)
*
|
2003-03-31 |
2008-04-15 |
Lam Research Corporation |
Wafer clamping apparatus and method for operating the same
|
JP5810517B2
(ja)
*
|
2010-12-02 |
2015-11-11 |
富士電機株式会社 |
吸着装置および吸着方法
|
CN103818696A
(zh)
*
|
2014-03-07 |
2014-05-28 |
宇环数控机床股份有限公司 |
一种旋转盘上的气路控制装置
|
CN110834233A
(zh)
*
|
2019-11-01 |
2020-02-25 |
Oppo广东移动通信有限公司 |
待抛光件表面的抛光方法、玻璃件及其应用和抛光治具
|