FR2146223B1 - - Google Patents
Info
- Publication number
- FR2146223B1 FR2146223B1 FR7223004A FR7223004A FR2146223B1 FR 2146223 B1 FR2146223 B1 FR 2146223B1 FR 7223004 A FR7223004 A FR 7223004A FR 7223004 A FR7223004 A FR 7223004A FR 2146223 B1 FR2146223 B1 FR 2146223B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/40—Structural association with built-in electric component, e.g. fuse
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
- H01F2027/295—Surface mounted devices with flexible terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Casings For Electric Apparatus (AREA)
- Details Of Resistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1971063683U JPS4821146U (sv) | 1971-07-19 | 1971-07-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2146223A1 FR2146223A1 (sv) | 1973-03-02 |
FR2146223B1 true FR2146223B1 (sv) | 1975-03-07 |
Family
ID=13236401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7223004A Expired FR2146223B1 (sv) | 1971-07-19 | 1972-06-26 |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS4821146U (sv) |
AU (1) | AU450962B2 (sv) |
BE (1) | BE786070A (sv) |
FR (1) | FR2146223B1 (sv) |
GB (1) | GB1335159A (sv) |
NL (1) | NL7208649A (sv) |
SE (1) | SE396686B (sv) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH631414A5 (de) * | 1978-06-06 | 1982-08-13 | Rieter Ag Maschf | Vorrichtung zum endengleichen sortieren von konischen huelsen fuer textilmaschinen. |
JPS6018837Y2 (ja) * | 1980-03-17 | 1985-06-07 | 松下電器産業株式会社 | チップ状固体電解コンデンサ |
JPS6220968Y2 (sv) * | 1981-03-12 | 1987-05-28 | ||
DE3320257A1 (de) * | 1983-02-28 | 1984-08-30 | Wolfgang Dipl.-Ing. 6800 Mannheim Westermann | Kunststoffolien-wickelkondensator |
ATE29616T1 (de) * | 1983-06-03 | 1987-09-15 | Wolfgang Westermann | Kunststoffolien-wickelkondensator. |
DE3412492A1 (de) * | 1984-04-03 | 1985-10-03 | Siemens AG, 1000 Berlin und 8000 München | Elektrischer kondensator als chip-bauelement |
US4648006A (en) * | 1985-03-26 | 1987-03-03 | Illinois Tool Works Inc. | Plastic chip capacitor for surface mounting |
JPS6246662U (sv) * | 1985-09-09 | 1987-03-23 | ||
EP0218832B1 (de) * | 1985-09-30 | 1990-11-22 | Siemens Aktiengesellschaft | Bauelement für die Oberflächenmontage und Verfahren zur Befestigung eines Bauelements für die Oberflächenmontage |
JPH0651531B2 (ja) * | 1985-11-05 | 1994-07-06 | 積水樹脂株式会社 | 卵の移送装置 |
JPH0831687A (ja) * | 1994-07-19 | 1996-02-02 | Nec Corp | 角型チップ状電子部品 |
-
1971
- 1971-07-19 JP JP1971063683U patent/JPS4821146U/ja active Pending
-
1972
- 1972-06-16 AU AU43509/72A patent/AU450962B2/en not_active Expired
- 1972-06-23 NL NL7208649A patent/NL7208649A/xx unknown
- 1972-06-26 GB GB2975872A patent/GB1335159A/en not_active Expired
- 1972-06-26 FR FR7223004A patent/FR2146223B1/fr not_active Expired
- 1972-07-10 BE BE786070A patent/BE786070A/xx not_active IP Right Cessation
- 1972-07-17 SE SE7209394A patent/SE396686B/sv unknown
Also Published As
Publication number | Publication date |
---|---|
AU450962B2 (en) | 1974-07-09 |
GB1335159A (en) | 1973-10-24 |
AU4350972A (en) | 1973-12-20 |
NL7208649A (sv) | 1973-01-23 |
FR2146223A1 (sv) | 1973-03-02 |
SE396686B (sv) | 1977-09-26 |
BE786070A (fr) | 1972-11-03 |
JPS4821146U (sv) | 1973-03-10 |