FR2140231A1 - - Google Patents

Info

Publication number
FR2140231A1
FR2140231A1 FR7220024A FR7220024A FR2140231A1 FR 2140231 A1 FR2140231 A1 FR 2140231A1 FR 7220024 A FR7220024 A FR 7220024A FR 7220024 A FR7220024 A FR 7220024A FR 2140231 A1 FR2140231 A1 FR 2140231A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7220024A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMF California Inc
Original Assignee
OMF California Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMF California Inc filed Critical OMF California Inc
Publication of FR2140231A1 publication Critical patent/FR2140231A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/567Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
FR7220024A 1971-05-25 1972-05-23 Withdrawn FR2140231A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14680871A 1971-05-25 1971-05-25

Publications (1)

Publication Number Publication Date
FR2140231A1 true FR2140231A1 (enrdf_load_stackoverflow) 1973-01-12

Family

ID=22519083

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7220024A Withdrawn FR2140231A1 (enrdf_load_stackoverflow) 1971-05-25 1972-05-23

Country Status (9)

Country Link
US (1) US3671408A (enrdf_load_stackoverflow)
BR (1) BR7203327D0 (enrdf_load_stackoverflow)
CA (1) CA1027892A (enrdf_load_stackoverflow)
CH (1) CH541627A (enrdf_load_stackoverflow)
DE (1) DE2226699A1 (enrdf_load_stackoverflow)
FR (1) FR2140231A1 (enrdf_load_stackoverflow)
GB (1) GB1383850A (enrdf_load_stackoverflow)
IT (1) IT958011B (enrdf_load_stackoverflow)
NL (1) NL7206694A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2200371A1 (enrdf_load_stackoverflow) * 1972-09-21 1974-04-19 Engelhard Ind Ltd

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833487A (en) * 1972-12-22 1974-09-03 Bell Telephone Labor Inc Electrolytic soft gold plating
US4285784A (en) * 1980-07-10 1981-08-25 The United States Of America As Represented By The Secretary Of The Interior Process of electroplating a platinum-rhodium alloy coating
DE3100997C2 (de) * 1981-01-15 1986-08-14 Degussa Ag, 6000 Frankfurt Bad zum galvanischen Abscheiden von Rhodiumüberzügen
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
US6306277B1 (en) 2000-01-14 2001-10-23 Honeywell International Inc. Platinum electrolyte for use in electrolytic plating
US8372744B2 (en) 2007-04-20 2013-02-12 International Business Machines Corporation Fabricating a contact rhodium structure by electroplating and electroplating composition
DE102008050135B4 (de) 2008-10-04 2010-08-05 Umicore Galvanotechnik Gmbh Verfahren zur Abscheidung von Platin-Rhodiumschichten mit verbesserter Helligkeit
CN103397358B (zh) * 2013-08-01 2016-01-20 江苏协鑫软控设备科技发展有限公司 用于铂铑合金热电偶修复的电镀液及修复工艺
CN108130566B (zh) * 2018-01-31 2019-08-27 西北有色金属研究院 用于镍基高温合金表面电镀铂层的电镀液及其电镀方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL123540C (enrdf_load_stackoverflow) * 1958-08-06
US3515651A (en) * 1966-02-07 1970-06-02 Katsuhiro Ohkubo Plating solutions for rhodium and rhodium alloy platings having low internal stress
US3528895A (en) * 1967-07-10 1970-09-15 Sel Rex Corp Plating low stress bright rhodium

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2200371A1 (enrdf_load_stackoverflow) * 1972-09-21 1974-04-19 Engelhard Ind Ltd

Also Published As

Publication number Publication date
NL7206694A (enrdf_load_stackoverflow) 1972-11-28
CA1027892A (en) 1978-03-14
CH541627A (fr) 1973-09-15
DE2226699A1 (de) 1972-12-28
GB1383850A (en) 1974-02-12
US3671408A (en) 1972-06-20
BR7203327D0 (pt) 1973-05-10
IT958011B (it) 1973-10-20

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Legal Events

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