FR2134517B1 - - Google Patents
Info
- Publication number
- FR2134517B1 FR2134517B1 FR7214721A FR7214721A FR2134517B1 FR 2134517 B1 FR2134517 B1 FR 2134517B1 FR 7214721 A FR7214721 A FR 7214721A FR 7214721 A FR7214721 A FR 7214721A FR 2134517 B1 FR2134517 B1 FR 2134517B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W76/157—
-
- H10W70/60—
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- H10W90/701—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13720671A | 1971-04-26 | 1971-04-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2134517A1 FR2134517A1 (show.php) | 1972-12-08 |
| FR2134517B1 true FR2134517B1 (show.php) | 1976-08-06 |
Family
ID=22476267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7214721A Expired FR2134517B1 (show.php) | 1971-04-26 | 1972-04-25 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3659035A (show.php) |
| JP (1) | JPS51429B1 (show.php) |
| BE (1) | BE782635A (show.php) |
| CA (1) | CA961173A (show.php) |
| DE (1) | DE2217647B2 (show.php) |
| FR (1) | FR2134517B1 (show.php) |
| GB (1) | GB1371997A (show.php) |
| IT (1) | IT953730B (show.php) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1327352A (en) * | 1971-10-02 | 1973-08-22 | Kyoto Ceramic | Semiconductor device |
| US3730969A (en) * | 1972-03-06 | 1973-05-01 | Rca Corp | Electronic device package |
| US3778685A (en) * | 1972-03-27 | 1973-12-11 | Nasa | Integrated circuit package with lead structure and method of preparing the same |
| CA1032276A (en) * | 1973-12-03 | 1978-05-30 | Andrew Koutalides | Package for semiconductor beam lead devices |
| US3959874A (en) * | 1974-12-20 | 1976-06-01 | Western Electric Company, Inc. | Method of forming an integrated circuit assembly |
| US4056681A (en) * | 1975-08-04 | 1977-11-01 | International Telephone And Telegraph Corporation | Self-aligning package for integrated circuits |
| US4303934A (en) * | 1979-08-30 | 1981-12-01 | Burr-Brown Research Corp. | Molded lead frame dual in line package including a hybrid circuit |
| GB2124433B (en) * | 1982-07-07 | 1986-05-21 | Int Standard Electric Corp | Electronic component assembly |
| US4924353A (en) * | 1985-12-20 | 1990-05-08 | Hughes Aircraft Company | Connector system for coupling to an integrated circuit chip |
| US4902606A (en) * | 1985-12-20 | 1990-02-20 | Hughes Aircraft Company | Compressive pedestal for microminiature connections |
| US4843188A (en) * | 1986-03-25 | 1989-06-27 | Western Digital Corporation | Integrated circuit chip mounting and packaging assembly |
| JPH0177782U (show.php) * | 1987-11-14 | 1989-05-25 | ||
| US5061822A (en) * | 1988-09-12 | 1991-10-29 | Honeywell Inc. | Radial solution to chip carrier pitch deviation |
| US5008997A (en) * | 1988-09-16 | 1991-04-23 | National Semiconductor | Gold/tin eutectic bonding for tape automated bonding process |
| JP2001094227A (ja) * | 1999-09-20 | 2001-04-06 | Shinko Electric Ind Co Ltd | 半導体チップ実装用の配線基板と該基板を用いた半導体チップの実装方法 |
| USD475021S1 (en) | 2001-07-23 | 2003-05-27 | Hewlett Packard Development Company, L.P. | Electrical contact |
| USD472880S1 (en) | 2001-07-23 | 2003-04-08 | Hewlett-Packard Company | Electrical contact |
| US20190165108A1 (en) * | 2017-11-30 | 2019-05-30 | Raytheon Company | Reconstituted wafer structure |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE630858A (show.php) * | 1962-04-10 | 1900-01-01 | ||
| US3388301A (en) * | 1964-12-09 | 1968-06-11 | Signetics Corp | Multichip integrated circuit assembly with interconnection structure |
| US3436604A (en) * | 1966-04-25 | 1969-04-01 | Texas Instruments Inc | Complex integrated circuit array and method for fabricating same |
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1971
- 1971-04-26 US US137206A patent/US3659035A/en not_active Expired - Lifetime
-
1972
- 1972-03-29 CA CA138,497A patent/CA961173A/en not_active Expired
- 1972-04-12 DE DE2217647A patent/DE2217647B2/de not_active Withdrawn
- 1972-04-21 GB GB1857572A patent/GB1371997A/en not_active Expired
- 1972-04-22 IT IT23445/72A patent/IT953730B/it active
- 1972-04-25 BE BE782635A patent/BE782635A/xx unknown
- 1972-04-25 FR FR7214721A patent/FR2134517B1/fr not_active Expired
- 1972-04-26 JP JP47042122A patent/JPS51429B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE2217647B2 (de) | 1975-07-03 |
| BE782635A (fr) | 1972-08-16 |
| CA961173A (en) | 1975-01-14 |
| GB1371997A (en) | 1974-10-30 |
| FR2134517A1 (show.php) | 1972-12-08 |
| US3659035A (en) | 1972-04-25 |
| DE2217647A1 (de) | 1972-11-09 |
| IT953730B (it) | 1973-08-10 |
| JPS51429B1 (show.php) | 1976-01-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |