BE782635A - Dispositif semi-conducteur - Google Patents

Dispositif semi-conducteur

Info

Publication number
BE782635A
BE782635A BE782635A BE782635A BE782635A BE 782635 A BE782635 A BE 782635A BE 782635 A BE782635 A BE 782635A BE 782635 A BE782635 A BE 782635A BE 782635 A BE782635 A BE 782635A
Authority
BE
Belgium
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
BE782635A
Other languages
English (en)
French (fr)
Inventor
C S Planzo
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of BE782635A publication Critical patent/BE782635A/xx

Links

Classifications

    • H10W76/157—
    • H10W70/60—
    • H10W90/701—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
BE782635A 1971-04-26 1972-04-25 Dispositif semi-conducteur BE782635A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13720671A 1971-04-26 1971-04-26

Publications (1)

Publication Number Publication Date
BE782635A true BE782635A (fr) 1972-08-16

Family

ID=22476267

Family Applications (1)

Application Number Title Priority Date Filing Date
BE782635A BE782635A (fr) 1971-04-26 1972-04-25 Dispositif semi-conducteur

Country Status (8)

Country Link
US (1) US3659035A (show.php)
JP (1) JPS51429B1 (show.php)
BE (1) BE782635A (show.php)
CA (1) CA961173A (show.php)
DE (1) DE2217647B2 (show.php)
FR (1) FR2134517B1 (show.php)
GB (1) GB1371997A (show.php)
IT (1) IT953730B (show.php)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1327352A (en) * 1971-10-02 1973-08-22 Kyoto Ceramic Semiconductor device
US3730969A (en) * 1972-03-06 1973-05-01 Rca Corp Electronic device package
US3778685A (en) * 1972-03-27 1973-12-11 Nasa Integrated circuit package with lead structure and method of preparing the same
CA1032276A (en) * 1973-12-03 1978-05-30 Andrew Koutalides Package for semiconductor beam lead devices
US3959874A (en) * 1974-12-20 1976-06-01 Western Electric Company, Inc. Method of forming an integrated circuit assembly
US4056681A (en) * 1975-08-04 1977-11-01 International Telephone And Telegraph Corporation Self-aligning package for integrated circuits
US4303934A (en) * 1979-08-30 1981-12-01 Burr-Brown Research Corp. Molded lead frame dual in line package including a hybrid circuit
GB2124433B (en) * 1982-07-07 1986-05-21 Int Standard Electric Corp Electronic component assembly
US4924353A (en) * 1985-12-20 1990-05-08 Hughes Aircraft Company Connector system for coupling to an integrated circuit chip
US4902606A (en) * 1985-12-20 1990-02-20 Hughes Aircraft Company Compressive pedestal for microminiature connections
US4843188A (en) * 1986-03-25 1989-06-27 Western Digital Corporation Integrated circuit chip mounting and packaging assembly
JPH0177782U (show.php) * 1987-11-14 1989-05-25
US5061822A (en) * 1988-09-12 1991-10-29 Honeywell Inc. Radial solution to chip carrier pitch deviation
US5008997A (en) * 1988-09-16 1991-04-23 National Semiconductor Gold/tin eutectic bonding for tape automated bonding process
JP2001094227A (ja) * 1999-09-20 2001-04-06 Shinko Electric Ind Co Ltd 半導体チップ実装用の配線基板と該基板を用いた半導体チップの実装方法
USD475021S1 (en) 2001-07-23 2003-05-27 Hewlett Packard Development Company, L.P. Electrical contact
USD472880S1 (en) 2001-07-23 2003-04-08 Hewlett-Packard Company Electrical contact
US20190165108A1 (en) * 2017-11-30 2019-05-30 Raytheon Company Reconstituted wafer structure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE630858A (show.php) * 1962-04-10 1900-01-01
US3388301A (en) * 1964-12-09 1968-06-11 Signetics Corp Multichip integrated circuit assembly with interconnection structure
US3436604A (en) * 1966-04-25 1969-04-01 Texas Instruments Inc Complex integrated circuit array and method for fabricating same

Also Published As

Publication number Publication date
DE2217647B2 (de) 1975-07-03
CA961173A (en) 1975-01-14
GB1371997A (en) 1974-10-30
FR2134517A1 (show.php) 1972-12-08
US3659035A (en) 1972-04-25
DE2217647A1 (de) 1972-11-09
IT953730B (it) 1973-08-10
JPS51429B1 (show.php) 1976-01-08
FR2134517B1 (show.php) 1976-08-06

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