FR2120111A2 - - Google Patents

Info

Publication number
FR2120111A2
FR2120111A2 FR7147295A FR7147295A FR2120111A2 FR 2120111 A2 FR2120111 A2 FR 2120111A2 FR 7147295 A FR7147295 A FR 7147295A FR 7147295 A FR7147295 A FR 7147295A FR 2120111 A2 FR2120111 A2 FR 2120111A2
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7147295A
Other languages
French (fr)
Other versions
FR2120111B2 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of FR2120111A2 publication Critical patent/FR2120111A2/fr
Application granted granted Critical
Publication of FR2120111B2 publication Critical patent/FR2120111B2/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0834—Compounds having one or more O-Si linkage
    • C07F7/0838—Compounds with one or more Si-O-Si sequences
    • C07F7/0872—Preparation and treatment thereof
    • C07F7/0876—Reactions involving the formation of bonds to a Si atom of a Si-O-Si sequence other than a bond of the Si-O-Si linkage
    • C07F7/0878—Si-C bond
    • C07F7/0879—Hydrosilylation reactions
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0834—Compounds having one or more O-Si linkage
    • C07F7/0838—Compounds with one or more Si-O-Si sequences
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
FR7147295A 1970-12-30 1971-12-29 Expired FR2120111B2 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10300470A 1970-12-30 1970-12-30

Publications (2)

Publication Number Publication Date
FR2120111A2 true FR2120111A2 (enExample) 1972-08-11
FR2120111B2 FR2120111B2 (enExample) 1974-06-07

Family

ID=22292844

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7147295A Expired FR2120111B2 (enExample) 1970-12-30 1971-12-29

Country Status (7)

Country Link
US (1) US3671483A (enExample)
JP (1) JPS5314580B1 (enExample)
BE (1) BE777469R (enExample)
CA (1) CA972890A (enExample)
DE (1) DE2160669C3 (enExample)
FR (1) FR2120111B2 (enExample)
GB (1) GB1332840A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2474040A1 (fr) * 1980-01-21 1981-07-24 Toray Silicone Co Compositions de silicones favorisant l'adherence et procede pour faire adherer du caoutchouc de silicone a un support

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4034140A (en) * 1975-07-31 1977-07-05 Dow Corning Corporation Heat-curable silicone elastomers having unprimed adhesion
JPS559123A (en) * 1978-07-04 1980-01-23 Shunpei Morinobu Radiant ray gas monitor
JPS5765758A (en) * 1980-10-09 1982-04-21 Toray Silicone Co Ltd Primer composition for bonding
EP0347049A3 (en) * 1988-06-15 1990-06-13 Dow Corning Corporation Improved primer compositions
US5213617A (en) * 1991-06-13 1993-05-25 Dow Corning Corporation Primer for silicone substrates
US5238708A (en) * 1991-06-13 1993-08-24 Dow Corning Corporation Primer for silicone substrates
US5534610A (en) * 1995-03-08 1996-07-09 General Electric Company Solventless two component primer composition for improved adhesion of RTV silicone elastomers to substrates
US5755866A (en) * 1996-08-13 1998-05-26 General Electric Company Primer composition for 1-part room temperature vulcanizable silicone compositions
US6303811B1 (en) 1998-12-21 2001-10-16 Dow Corning Corporation Cyclic organosilicon endcapper having one aliphatic unsaturation
US6160150A (en) * 1998-12-21 2000-12-12 Dow Corning Corporation Cyclic organosilicon endcapper having one silicon-bonded hydrogen atom
US6013753A (en) * 1998-12-21 2000-01-11 Dow Corning Corporation Organosilicon endcapper having one aliphatic unsaturation
US6265518B1 (en) * 1998-12-21 2001-07-24 Dow Corning Corporation Organosilicon endcapper having one silicon-bonded hydrogen atom
US6127502A (en) * 1998-12-21 2000-10-03 Dow Corning Corporation Polyorganosiloxanes having at least one organofunctional group with multiple hydrolyzable groups
US6235832B1 (en) 1998-12-21 2001-05-22 Dow Corning Corporation RTV silicone compositions with rapid development of green strength
US6231990B1 (en) * 1999-06-21 2001-05-15 General Electric Company Adhesion primer for use with RTV silicones
US6599628B1 (en) 2000-11-15 2003-07-29 Xerox Corporation Organic based titanate primers to bond fluoro-containing compound to silicone rubber
JP2004527626A (ja) * 2001-05-01 2004-09-09 ダウ・コ−ニング・コ−ポレ−ション 保護コーティング組成物
SE530256C2 (sv) * 2005-12-16 2008-04-15 Moelnlycke Health Care Ab Metod för att uppta hål i värmesmältbara material
US9221999B2 (en) 2009-12-23 2015-12-29 Dsm Ip Assets B.V. Method to activate silicone rubber surfaces
CN105086855B (zh) * 2014-05-09 2018-12-21 深圳光启创新技术有限公司 硅橡胶与物件的粘结方法及柔性吸波材料
NL2021916B1 (en) 2018-11-01 2020-05-14 Univ Delft Tech Acoustic Liner
EP3798246B1 (en) 2019-09-27 2024-01-31 Henkel AG & Co. KGaA One component (1k) composition based on modified epoxy resin
EP3831862B1 (en) 2019-12-04 2023-06-28 Henkel AG & Co. KGaA One component (1k) composition based on epoxy resin
EP3831863B1 (en) 2019-12-04 2023-07-05 Henkel AG & Co. KGaA One component (1k) composition based on epoxy resin
EP3916033B1 (en) 2020-05-28 2025-10-29 Henkel AG & Co. KGaA One component (1k) composition based on epoxy resin
WO2021259594A1 (en) 2020-06-22 2021-12-30 Henkel Ag & Co. Kgaa Electrochemically debondable adhesive composition
EP3943564B1 (en) 2020-07-21 2024-07-17 Henkel AG & Co. KGaA Room temperature stable, electrically conductive 1k epoxy formulation
TWI900620B (zh) 2020-08-27 2025-10-11 德商漢高股份有限及兩合公司 導電性單組分型(1k)環氧樹脂調配物
WO2022081271A1 (en) 2020-10-13 2022-04-21 Cabot Corporation Conductive photo-curable compositions for additive manufacturing
CN116640311A (zh) * 2023-06-28 2023-08-25 浙江三元电子科技有限公司 改性含氢硅油、灌封胶及其制备方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2474040A1 (fr) * 1980-01-21 1981-07-24 Toray Silicone Co Compositions de silicones favorisant l'adherence et procede pour faire adherer du caoutchouc de silicone a un support

Also Published As

Publication number Publication date
US3671483A (en) 1972-06-20
DE2160669B2 (de) 1974-12-05
DE2160669A1 (de) 1972-07-06
DE2160669C3 (de) 1975-07-17
GB1332840A (en) 1973-10-03
CA972890A (en) 1975-08-12
JPS5314580B1 (enExample) 1978-05-18
FR2120111B2 (enExample) 1974-06-07
BE777469R (fr) 1972-06-29

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