FR2111969A1 - - Google Patents
Info
- Publication number
 - FR2111969A1 FR2111969A1 FR7139077A FR7139077A FR2111969A1 FR 2111969 A1 FR2111969 A1 FR 2111969A1 FR 7139077 A FR7139077 A FR 7139077A FR 7139077 A FR7139077 A FR 7139077A FR 2111969 A1 FR2111969 A1 FR 2111969A1
 - Authority
 - FR
 - France
 - Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
 - Granted
 
Links
Classifications
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 - H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
 
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 - H01L2924/102—Material of the semiconductor or solid state bodies
 - H01L2924/1025—Semiconducting materials
 - H01L2924/10251—Elemental semiconductors, i.e. Group IV
 - H01L2924/10253—Silicon [Si]
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
 - H01L2924/10—Details of semiconductor or other solid state devices to be connected
 - H01L2924/102—Material of the semiconductor or solid state bodies
 - H01L2924/1025—Semiconducting materials
 - H01L2924/1026—Compound semiconductors
 - H01L2924/1027—IV
 - H01L2924/10271—Silicon-germanium [SiGe]
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
 - H01L2924/10—Details of semiconductor or other solid state devices to be connected
 - H01L2924/102—Material of the semiconductor or solid state bodies
 - H01L2924/1025—Semiconducting materials
 - H01L2924/1026—Compound semiconductors
 - H01L2924/1032—III-V
 - H01L2924/10329—Gallium arsenide [GaAs]
 
 - 
        
- H—ELECTRICITY
 - H01—ELECTRIC ELEMENTS
 - H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
 - H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
 - H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
 - H01L2924/151—Die mounting substrate
 - H01L2924/153—Connection portion
 - H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
 - H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
 
 
Landscapes
- Engineering & Computer Science (AREA)
 - Computer Hardware Design (AREA)
 - Microelectronics & Electronic Packaging (AREA)
 - Power Engineering (AREA)
 - Physics & Mathematics (AREA)
 - Condensed Matter Physics & Semiconductors (AREA)
 - General Physics & Mathematics (AREA)
 - Manufacturing & Machinery (AREA)
 - Die Bonding (AREA)
 - Pressure Welding/Diffusion-Bonding (AREA)
 
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP9612870A JPS4939223B1 (instruction) | 1970-10-30 | 1970-10-30 | |
| JP9767270A JPS4939224B1 (instruction) | 1970-11-05 | 1970-11-05 | |
| JP9767370A JPS4948264B1 (instruction) | 1970-11-05 | 1970-11-05 | |
| JP9860570A JPS4948265B1 (instruction) | 1970-11-07 | 1970-11-07 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| FR2111969A1 true FR2111969A1 (instruction) | 1972-06-09 | 
| FR2111969B1 FR2111969B1 (instruction) | 1974-06-21 | 
Family
ID=27468399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| FR717139077A Expired FR2111969B1 (instruction) | 1970-10-30 | 1971-10-29 | 
Country Status (6)
| Country | Link | 
|---|---|
| US (1) | US3729807A (instruction) | 
| CA (1) | CA920721A (instruction) | 
| DE (1) | DE2154026A1 (instruction) | 
| FR (1) | FR2111969B1 (instruction) | 
| GB (1) | GB1374626A (instruction) | 
| NL (1) | NL7114934A (instruction) | 
Families Citing this family (45)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| GB1389542A (en) * | 1971-06-17 | 1975-04-03 | Mullard Ltd | Methods of securing a semiconductor body to a support | 
| US3890455A (en) * | 1972-06-23 | 1975-06-17 | Ibm | Method of electrolessly plating alloys | 
| US3986251A (en) * | 1974-10-03 | 1976-10-19 | Motorola, Inc. | Germanium doped light emitting diode bonding process | 
| US4065588A (en) * | 1975-11-20 | 1977-12-27 | Rca Corporation | Method of making gold-cobalt contact for silicon devices | 
| JPS5439573A (en) * | 1977-09-05 | 1979-03-27 | Toshiba Corp | Compound semiconductor device | 
| US4293587A (en) * | 1978-11-09 | 1981-10-06 | Zilog, Inc. | Low resistance backside preparation for semiconductor integrated circuit chips | 
| WO1982002457A1 (en) * | 1980-12-30 | 1982-07-22 | Finn John B | Die attachment exhibiting enhanced quality and reliability | 
| US4702941A (en) * | 1984-03-27 | 1987-10-27 | Motorola Inc. | Gold metallization process | 
| US5037778A (en) * | 1989-05-12 | 1991-08-06 | Intel Corporation | Die attach using gold ribbon with gold/silicon eutectic alloy cladding | 
| US5028454A (en) * | 1989-10-16 | 1991-07-02 | Motorola Inc. | Electroless plating of portions of semiconductor devices and the like | 
| DE4107660C2 (de) * | 1991-03-09 | 1995-05-04 | Bosch Gmbh Robert | Verfahren zur Montage von Silizium-Plättchen auf metallischen Montageflächen | 
| JPH05200539A (ja) * | 1992-01-24 | 1993-08-10 | Honda Motor Co Ltd | 半導体基板接合方法 | 
| US6225218B1 (en) * | 1995-12-20 | 2001-05-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and its manufacturing method | 
| DE19639438A1 (de) * | 1996-09-25 | 1998-04-02 | Siemens Ag | Halbleiterkörper mit Lotmaterialschicht | 
| US6118351A (en) * | 1997-06-10 | 2000-09-12 | Lucent Technologies Inc. | Micromagnetic device for power processing applications and method of manufacture therefor | 
| US6440750B1 (en) | 1997-06-10 | 2002-08-27 | Agere Systems Guardian Corporation | Method of making integrated circuit having a micromagnetic device | 
| CN1322282A (zh) | 1998-09-03 | 2001-11-14 | 卢卡斯新星传感器公司 | 正比微机械装置 | 
| US6523560B1 (en) | 1998-09-03 | 2003-02-25 | General Electric Corporation | Microvalve with pressure equalization | 
| US7011378B2 (en) | 1998-09-03 | 2006-03-14 | Ge Novasensor, Inc. | Proportional micromechanical valve | 
| US6255714B1 (en) | 1999-06-22 | 2001-07-03 | Agere Systems Guardian Corporation | Integrated circuit having a micromagnetic device including a ferromagnetic core and method of manufacture therefor | 
| US6845962B1 (en) * | 2000-03-22 | 2005-01-25 | Kelsey-Hayes Company | Thermally actuated microvalve device | 
| US6505811B1 (en) | 2000-06-27 | 2003-01-14 | Kelsey-Hayes Company | High-pressure fluid control valve assembly having a microvalve device attached to fluid distributing substrate | 
| EP1694990A4 (en) * | 2003-11-24 | 2009-12-09 | Microstaq Inc | MICRO-VALVE DEVICE FOR CONTROLLING A VARIABLE DISPLACEMENT COMPRESSOR | 
| US20070251586A1 (en) * | 2003-11-24 | 2007-11-01 | Fuller Edward N | Electro-pneumatic control valve with microvalve pilot | 
| US8011388B2 (en) * | 2003-11-24 | 2011-09-06 | Microstaq, INC | Thermally actuated microvalve with multiple fluid ports | 
| JP2007525630A (ja) * | 2004-02-27 | 2007-09-06 | アルーマナ、マイクロウ、エルエルシー | ハイブリッド・マイクロ/マクロ・プレート弁 | 
| US7803281B2 (en) * | 2004-03-05 | 2010-09-28 | Microstaq, Inc. | Selective bonding for forming a microvalve | 
| US7156365B2 (en) * | 2004-07-27 | 2007-01-02 | Kelsey-Hayes Company | Method of controlling microvalve actuator | 
| EP1836399A1 (en) * | 2005-01-14 | 2007-09-26 | Alumina Micro LLC | System and method for controlling a variable displacement compressor | 
| WO2008076388A1 (en) | 2006-12-15 | 2008-06-26 | Microstaq, Inc. | Microvalve device | 
| DE112008000862T5 (de) | 2007-03-30 | 2010-03-11 | Microstaq, Inc., Austin | Vorgesteuertes Mikroschieberventil | 
| WO2008121365A1 (en) | 2007-03-31 | 2008-10-09 | Microstaq, Inc. | Pilot operated spool valve | 
| WO2010019329A2 (en) * | 2008-08-09 | 2010-02-18 | Microstaq, Inc. | Improved microvalve device | 
| US8113482B2 (en) * | 2008-08-12 | 2012-02-14 | DunAn Microstaq | Microvalve device with improved fluid routing | 
| WO2010065804A2 (en) | 2008-12-06 | 2010-06-10 | Microstaq, Inc. | Fluid flow control assembly | 
| WO2010117874A2 (en) | 2009-04-05 | 2010-10-14 | Microstaq, Inc. | Method and structure for optimizing heat exchanger performance | 
| WO2011022267A2 (en) | 2009-08-17 | 2011-02-24 | Microstaq, Inc. | Micromachined device and control method | 
| US8956884B2 (en) | 2010-01-28 | 2015-02-17 | Dunan Microstaq, Inc. | Process for reconditioning semiconductor surface to facilitate bonding | 
| US9006844B2 (en) | 2010-01-28 | 2015-04-14 | Dunan Microstaq, Inc. | Process and structure for high temperature selective fusion bonding | 
| US8996141B1 (en) | 2010-08-26 | 2015-03-31 | Dunan Microstaq, Inc. | Adaptive predictive functional controller | 
| US8925793B2 (en) | 2012-01-05 | 2015-01-06 | Dunan Microstaq, Inc. | Method for making a solder joint | 
| US9140613B2 (en) | 2012-03-16 | 2015-09-22 | Zhejiang Dunan Hetian Metal Co., Ltd. | Superheat sensor | 
| EP2693465A1 (en) * | 2012-07-31 | 2014-02-05 | Nxp B.V. | Electronic device and method of manufacturing such device | 
| US9188375B2 (en) | 2013-12-04 | 2015-11-17 | Zhejiang Dunan Hetian Metal Co., Ltd. | Control element and check valve assembly | 
| US20160187492A1 (en) * | 2014-10-17 | 2016-06-30 | Landauer, Inc. | Electronic system for measurement of radiation-sensitive mos devices | 
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US3078559A (en) * | 1959-04-13 | 1963-02-26 | Sylvania Electric Prod | Method for preparing semiconductor elements | 
| US3207838A (en) * | 1961-06-30 | 1965-09-21 | Western Electric Co | Substrates having solderable gold films formed thereon, and methods of making the same | 
| US3273979A (en) * | 1964-07-06 | 1966-09-20 | Rca Corp | Semiconductive devices | 
| US3585711A (en) * | 1968-09-06 | 1971-06-22 | Us Navy | Gold-silicon bonding process | 
| GB1256518A (instruction) * | 1968-11-30 | 1971-12-08 | ||
| US3618202A (en) * | 1969-05-12 | 1971-11-09 | Mallory & Co Inc P R | Ceramic chip electrical components | 
| US3673478A (en) * | 1969-10-31 | 1972-06-27 | Hitachi Ltd | A semiconductor pellet fitted on a metal body | 
| US3680199A (en) * | 1970-07-06 | 1972-08-01 | Texas Instruments Inc | Alloying method | 
- 
        1971
        
- 1971-10-25 GB GB4950271A patent/GB1374626A/en not_active Expired
 - 1971-10-28 CA CA126342A patent/CA920721A/en not_active Expired
 - 1971-10-29 FR FR717139077A patent/FR2111969B1/fr not_active Expired
 - 1971-10-29 US US00193956A patent/US3729807A/en not_active Expired - Lifetime
 - 1971-10-29 DE DE19712154026 patent/DE2154026A1/de active Pending
 - 1971-10-29 NL NL7114934A patent/NL7114934A/xx unknown
 
 
Also Published As
| Publication number | Publication date | 
|---|---|
| CA920721A (en) | 1973-02-06 | 
| DE2154026A1 (de) | 1972-05-18 | 
| GB1374626A (en) | 1974-11-20 | 
| US3729807A (en) | 1973-05-01 | 
| NL7114934A (instruction) | 1972-05-03 | 
| FR2111969B1 (instruction) | 1974-06-21 |