FR2096801A1 - Eutectic bonding of semiconductor devices - with aluminium -germanium or aluminium-germanium-zinc - Google Patents

Eutectic bonding of semiconductor devices - with aluminium -germanium or aluminium-germanium-zinc

Info

Publication number
FR2096801A1
FR2096801A1 FR7123966A FR7123966A FR2096801A1 FR 2096801 A1 FR2096801 A1 FR 2096801A1 FR 7123966 A FR7123966 A FR 7123966A FR 7123966 A FR7123966 A FR 7123966A FR 2096801 A1 FR2096801 A1 FR 2096801A1
Authority
FR
France
Prior art keywords
germanium
aluminium
degrees
semiconductor devices
zinc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7123966A
Other languages
English (en)
French (fr)
Other versions
FR2096801B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of FR2096801A1 publication Critical patent/FR2096801A1/fr
Application granted granted Critical
Publication of FR2096801B1 publication Critical patent/FR2096801B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • H10W72/30—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/381—
    • H10W72/59—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Ceramic Products (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR7123966A 1970-06-30 1971-06-30 Eutectic bonding of semiconductor devices - with aluminium -germanium or aluminium-germanium-zinc Granted FR2096801A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5125570A 1970-06-30 1970-06-30
US5125370A 1970-06-30 1970-06-30

Publications (2)

Publication Number Publication Date
FR2096801A1 true FR2096801A1 (en) 1972-02-25
FR2096801B1 FR2096801B1 (enExample) 1976-09-17

Family

ID=26729217

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7123966A Granted FR2096801A1 (en) 1970-06-30 1971-06-30 Eutectic bonding of semiconductor devices - with aluminium -germanium or aluminium-germanium-zinc

Country Status (3)

Country Link
JP (1) JPS5750053B1 (enExample)
DE (1) DE2132254A1 (enExample)
FR (1) FR2096801A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11271132B2 (en) * 2015-07-24 2022-03-08 Artilux, Inc. Multi-wafer based light absorption apparatus and applications thereof
US11316065B2 (en) 2015-07-24 2022-04-26 Artilux, Inc. Multi-wafer based light absorption apparatus and applications thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59146768U (ja) * 1983-03-23 1984-10-01 株式会社東芝 水質計器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3186879A (en) * 1959-07-24 1965-06-01 Philco Corp Semiconductor devices utilizing cadmium alloy regions

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3186879A (en) * 1959-07-24 1965-06-01 Philco Corp Semiconductor devices utilizing cadmium alloy regions

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11271132B2 (en) * 2015-07-24 2022-03-08 Artilux, Inc. Multi-wafer based light absorption apparatus and applications thereof
US11316065B2 (en) 2015-07-24 2022-04-26 Artilux, Inc. Multi-wafer based light absorption apparatus and applications thereof

Also Published As

Publication number Publication date
FR2096801B1 (enExample) 1976-09-17
JPS5750053B1 (enExample) 1982-10-25
DE2132254A1 (de) 1972-01-05

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