FR2081014A1 - - Google Patents

Info

Publication number
FR2081014A1
FR2081014A1 FR7104972A FR7104972A FR2081014A1 FR 2081014 A1 FR2081014 A1 FR 2081014A1 FR 7104972 A FR7104972 A FR 7104972A FR 7104972 A FR7104972 A FR 7104972A FR 2081014 A1 FR2081014 A1 FR 2081014A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7104972A
Other languages
French (fr)
Other versions
FR2081014B1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of FR2081014A1 publication Critical patent/FR2081014A1/fr
Application granted granted Critical
Publication of FR2081014B1 publication Critical patent/FR2081014B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • H01L21/31144Etching the insulating layers by chemical or physical means using masks
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/426Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • H01L21/31105Etching inorganic layers
    • H01L21/31111Etching inorganic layers by chemical means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Weting (AREA)
FR7104972A 1970-02-19 1971-02-15 Expired FR2081014B1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702007693 DE2007693B2 (de) 1970-02-19 1970-02-19 Verfahren zum lokalen abaetzen einer auf einem halbleiterkoerper aufgebrachten siliciumnitridschicht

Publications (2)

Publication Number Publication Date
FR2081014A1 true FR2081014A1 (enrdf_load_stackoverflow) 1971-11-26
FR2081014B1 FR2081014B1 (enrdf_load_stackoverflow) 1977-06-17

Family

ID=5762752

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7104972A Expired FR2081014B1 (enrdf_load_stackoverflow) 1970-02-19 1971-02-15

Country Status (9)

Country Link
JP (1) JPS5514078B1 (enrdf_load_stackoverflow)
AT (1) AT310256B (enrdf_load_stackoverflow)
CA (1) CA949800A (enrdf_load_stackoverflow)
CH (1) CH547867A (enrdf_load_stackoverflow)
DE (1) DE2007693B2 (enrdf_load_stackoverflow)
FR (1) FR2081014B1 (enrdf_load_stackoverflow)
GB (1) GB1310188A (enrdf_load_stackoverflow)
NL (1) NL7102170A (enrdf_load_stackoverflow)
SE (1) SE359232B (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2454399C2 (de) * 1974-11-16 1981-09-24 Merck Patent Gmbh, 6100 Darmstadt Ablösemittel für Fotolacke
US6022751A (en) * 1996-10-24 2000-02-08 Canon Kabushiki Kaisha Production of electronic device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2149269C3 (de) * 1971-10-02 1981-04-09 Daimler-Benz Ag, 7000 Stuttgart Pneumatisch arbeitende Regelvorrichtung zur selbsttätigen Ausrichtung von Kraftfahrzeugscheinwerfern

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
(REVUE AMERICAINE"IBM TECHNICAL DISCLOSURE BULLETIN"VOLUME 13,NO 2,JUILLET 1970,"ETCHING SILICONNITRIDE FILMS,L.A.MUELLER,PAGE 395.) *
NITRIDE FILMS,L.A.MUELLER,PAGE 395.) *
REVUE AMERICAINE"IBM TECHNICAL DISCLOSURE BULLETIN"VOLUME 13,NO 2,JUILLET 1970,"ETCHING SILICON *

Also Published As

Publication number Publication date
DE2007693B2 (de) 1976-12-16
CA949800A (en) 1974-06-25
AT310256B (de) 1973-09-25
NL7102170A (enrdf_load_stackoverflow) 1971-08-23
CH547867A (de) 1974-04-11
GB1310188A (en) 1973-03-14
FR2081014B1 (enrdf_load_stackoverflow) 1977-06-17
DE2007693A1 (de) 1971-09-02
SE359232B (enrdf_load_stackoverflow) 1973-08-27
JPS5514078B1 (enrdf_load_stackoverflow) 1980-04-14

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Legal Events

Date Code Title Description
ST Notification of lapse