FR2077628B1 - - Google Patents

Info

Publication number
FR2077628B1
FR2077628B1 FR7102614A FR7102614A FR2077628B1 FR 2077628 B1 FR2077628 B1 FR 2077628B1 FR 7102614 A FR7102614 A FR 7102614A FR 7102614 A FR7102614 A FR 7102614A FR 2077628 B1 FR2077628 B1 FR 2077628B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7102614A
Other versions
FR2077628A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of FR2077628A1 publication Critical patent/FR2077628A1/fr
Application granted granted Critical
Publication of FR2077628B1 publication Critical patent/FR2077628B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/043—Dual dielectric
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/114—Nitrides of silicon
FR7102614A 1970-01-30 1971-01-27 Expired FR2077628B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP45007715A JPS501872B1 (fr) 1970-01-30 1970-01-30

Publications (2)

Publication Number Publication Date
FR2077628A1 FR2077628A1 (fr) 1971-10-29
FR2077628B1 true FR2077628B1 (fr) 1974-04-26

Family

ID=11673421

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7102614A Expired FR2077628B1 (fr) 1970-01-30 1971-01-27

Country Status (4)

Country Link
US (1) US3745428A (fr)
JP (1) JPS501872B1 (fr)
FR (1) FR2077628B1 (fr)
GB (1) GB1291683A (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50120303U (fr) * 1974-02-08 1975-10-01
US3961350A (en) * 1974-11-04 1976-06-01 Hewlett-Packard Company Method and chip configuration of high temperature pressure contact packaging of Schottky barrier diodes
US4091407A (en) * 1976-11-01 1978-05-23 Rca Corporation Combination glass/low temperature deposited Siw Nx Hy O.sub.z
US4097889A (en) * 1976-11-01 1978-06-27 Rca Corporation Combination glass/low temperature deposited Siw Nx Hy O.sub.z
US4091406A (en) * 1976-11-01 1978-05-23 Rca Corporation Combination glass/low temperature deposited Siw Nx Hy O.sub.z
US4412242A (en) * 1980-11-17 1983-10-25 International Rectifier Corporation Planar structure for high voltage semiconductor devices with gaps in glassy layer over high field regions
US4318936A (en) * 1981-01-23 1982-03-09 General Motors Corporation Method of making strain sensor in fragile web
US4472875A (en) * 1983-06-27 1984-09-25 Teletype Corporation Method for manufacturing an integrated circuit device
US4485553A (en) * 1983-06-27 1984-12-04 Teletype Corporation Method for manufacturing an integrated circuit device
US4575921A (en) * 1983-11-04 1986-03-18 General Motors Corporation Silicon nitride formation and use in self-aligned semiconductor device manufacturing method
US5021840A (en) * 1987-08-18 1991-06-04 Texas Instruments Incorporated Schottky or PN diode with composite sidewall
DE3832750A1 (de) * 1988-09-27 1990-03-29 Asea Brown Boveri Leistungshalbleiterbauelement
DE3832732A1 (de) * 1988-09-27 1990-03-29 Asea Brown Boveri Leistungshalbleiterdiode
SE465193B (sv) * 1989-12-06 1991-08-05 Ericsson Telefon Ab L M Foer hoegspaenning avsedd ic-krets
JP3144817B2 (ja) * 1990-03-23 2001-03-12 株式会社東芝 半導体装置
US5424570A (en) * 1992-01-31 1995-06-13 Sgs-Thomson Microelectronics, Inc. Contact structure for improving photoresist adhesion on a dielectric layer
US5523590A (en) * 1993-10-20 1996-06-04 Oki Electric Industry Co., Ltd. LED array with insulating films
JP2871530B2 (ja) * 1995-05-10 1999-03-17 日本電気株式会社 半導体装置の製造方法
KR19980055721A (ko) * 1996-12-28 1998-09-25 김영환 반도체 소자의 보호막 형성 방법
EP0905495A1 (fr) * 1997-09-29 1999-03-31 EM Microelectronic-Marin SA Couche de protection de circuits intégrés, et son procédé de fabrication

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1172491A (en) * 1967-03-29 1969-12-03 Hitachi Ltd A method of manufacturing a semiconductor device
JPS4830786B1 (fr) * 1967-11-06 1973-09-22

Also Published As

Publication number Publication date
GB1291683A (en) 1972-10-04
JPS501872B1 (fr) 1975-01-22
FR2077628A1 (fr) 1971-10-29
US3745428A (en) 1973-07-10

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