FR2056295A5 - - Google Patents
Info
- Publication number
- FR2056295A5 FR2056295A5 FR7022951A FR7022951A FR2056295A5 FR 2056295 A5 FR2056295 A5 FR 2056295A5 FR 7022951 A FR7022951 A FR 7022951A FR 7022951 A FR7022951 A FR 7022951A FR 2056295 A5 FR2056295 A5 FR 2056295A5
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/12—Safety or protection arrangements; Arrangements for preventing malfunction for preventing overpressure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/14—Safety or protection arrangements; Arrangements for preventing malfunction for preventing damage by freezing, e.g. for accommodating volume expansion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE1049869 | 1969-07-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2056295A5 true FR2056295A5 (fr) | 1971-05-14 |
Family
ID=20292411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7022951A Expired FR2056295A5 (fr) | 1969-07-25 | 1970-06-22 |
Country Status (3)
Country | Link |
---|---|
US (1) | US3682237A (fr) |
DE (1) | DE2034892A1 (fr) |
FR (1) | FR2056295A5 (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1497538A (en) * | 1974-01-23 | 1978-01-12 | Shell Int Research | Heat pipe device for vapourizing liquid fuel |
GB1447991A (en) * | 1973-09-11 | 1976-09-02 | Shell Int Research | Device for vapourizing liquid fuel |
GB1447992A (en) * | 1973-09-11 | 1976-09-02 | Shell Int Research | Fuel vapourizing device for an internal combustion engine or gas turbine |
JPS5812509B2 (ja) * | 1975-09-20 | 1983-03-08 | 株式会社日立製作所 | カイホウガタフツトウレイキヤクソウチ |
JPS5430552A (en) * | 1977-08-12 | 1979-03-07 | Hitachi Ltd | Boiling cooling apparatus |
JPS55118561A (en) * | 1979-03-05 | 1980-09-11 | Hitachi Ltd | Constant pressure type boiling cooler |
DE3302840C2 (de) * | 1983-01-28 | 1985-06-27 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Einrichtung zur Wärmeabführung von energieelektronischen Bauelementen |
US5458189A (en) * | 1993-09-10 | 1995-10-17 | Aavid Laboratories | Two-phase component cooler |
US5704416A (en) * | 1993-09-10 | 1998-01-06 | Aavid Laboratories, Inc. | Two phase component cooler |
JP3525498B2 (ja) * | 1994-07-13 | 2004-05-10 | 株式会社デンソー | 沸騰冷却装置 |
US5587880A (en) * | 1995-06-28 | 1996-12-24 | Aavid Laboratories, Inc. | Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation |
DE102006058629B3 (de) * | 2006-12-13 | 2008-07-10 | Schuler Pressen Gmbh & Co. Kg | Kühlanordnung für einen Kondensator |
DE102008027773A1 (de) * | 2007-06-28 | 2009-02-26 | Denso Corp., Kariya-shi | Abgaswärme-Rückgewinnungseinrichtung |
JPWO2015008485A1 (ja) * | 2013-07-19 | 2017-03-02 | 日本電気株式会社 | 密閉筐体の冷却構造及びそれを用いた光学装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2040159A (en) * | 1934-11-14 | 1936-05-12 | Foster Vernay Corp | Circulation of heating mediums in vapor heating systems for automotive vehicles |
US2288341A (en) * | 1939-06-02 | 1942-06-30 | Hartford Nat Bank & Trust Co | Blocking layer electrode system |
US2484542A (en) * | 1946-05-15 | 1949-10-11 | Girdler Corp | Anode cooling system |
-
1970
- 1970-06-22 FR FR7022951A patent/FR2056295A5/fr not_active Expired
- 1970-07-14 DE DE19702034892 patent/DE2034892A1/de active Pending
- 1970-07-20 US US56408A patent/US3682237A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US3682237A (en) | 1972-08-08 |
DE2034892A1 (de) | 1971-02-04 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |