FR2046967A1 - - Google Patents
Info
- Publication number
- FR2046967A1 FR2046967A1 FR7022770A FR7022770A FR2046967A1 FR 2046967 A1 FR2046967 A1 FR 2046967A1 FR 7022770 A FR7022770 A FR 7022770A FR 7022770 A FR7022770 A FR 7022770A FR 2046967 A1 FR2046967 A1 FR 2046967A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
- B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19691931335 DE1931335C3 (de) | 1969-06-20 | Verfahren zum Abtrennen eines Körpers von einem scheibenförmigen Kristall und Vorrichtung zur Durchführung dieses Verfahrens |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2046967A1 true FR2046967A1 (fr) | 1971-03-12 |
FR2046967B1 FR2046967B1 (fr) | 1974-09-20 |
Family
ID=5737534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7022770A Expired FR2046967B1 (fr) | 1969-06-20 | 1970-06-19 |
Country Status (9)
Country | Link |
---|---|
US (1) | US3694972A (fr) |
JP (1) | JPS5013510B1 (fr) |
AT (1) | AT315241B (fr) |
CH (1) | CH504783A (fr) |
FR (1) | FR2046967B1 (fr) |
GB (1) | GB1259249A (fr) |
NL (1) | NL7008966A (fr) |
SE (1) | SE351523B (fr) |
ZA (1) | ZA704234B (fr) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3778935A (en) * | 1972-01-26 | 1973-12-18 | Pennwalt Corp | Abrading apparatus with rotary index table |
CH566643A5 (fr) * | 1973-10-11 | 1975-09-15 | Bbc Brown Boveri & Cie | |
US3888054A (en) * | 1973-11-16 | 1975-06-10 | Western Electric Co | Method for abrasive cutting in a liquid |
US3866357A (en) * | 1974-06-06 | 1975-02-18 | Pennwalt Corp | Abrading apparatus |
DE2522346C3 (de) * | 1975-05-20 | 1978-10-26 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum Herstellen von Halbleiterbauelementen |
CA1252711A (fr) * | 1984-09-27 | 1989-04-18 | Richard A. Herrington | Decoupage du verre au jet abrasif sous tres haute pression |
US4702042A (en) * | 1984-09-27 | 1987-10-27 | Libbey-Owens-Ford Co. | Cutting strengthened glass |
US4656791A (en) * | 1984-09-27 | 1987-04-14 | Libbey-Owens-Ford Company | Abrasive fluid jet cutting support |
JPS61159371A (ja) * | 1984-12-28 | 1986-07-19 | Fuji Seiki Seizosho:Kk | Icの基板用シリコンウェーハのブラスト装置 |
US5052155A (en) * | 1989-08-10 | 1991-10-01 | Emc Technology, Inc. | Apparatus for the treatment of articles by high velocity impacting thereof with a particulate abrasive material |
DE4235091C2 (de) * | 1992-10-17 | 2001-09-06 | Trumpf Sachsen Gmbh | Flüssigkeits- und Abrasivmittelzuführung für eine Fluidstrahlschneidanlage |
US6705925B1 (en) * | 2000-10-20 | 2004-03-16 | Lightwave Microsystems | Apparatus and method to dice integrated circuits from a wafer using a pressurized jet |
EP1873824B1 (fr) * | 2002-09-13 | 2009-03-11 | Towa-Intercon Technology, Inc. | Séparation de jet d'un substrat |
US7153186B2 (en) * | 2002-09-13 | 2006-12-26 | Towa Intercon Technology, Inc. | Jet singulation |
ATE425553T1 (de) * | 2002-09-13 | 2009-03-15 | Towa Intercon Technology Inc | Vereinzelung eines substrats mittels strahl |
DE10337920B4 (de) * | 2003-08-18 | 2008-08-28 | Schott Ag | Verfahren zur Herstellung einer Mehrzahl von Bauteilen und Zwischenprodukt in Form eines Schichtverbundes |
US20060180579A1 (en) * | 2005-02-11 | 2006-08-17 | Towa Intercon Technology, Inc. | Multidirectional cutting chuck |
JP4791787B2 (ja) * | 2005-09-22 | 2011-10-12 | Towa株式会社 | アブレイシブウォータジェットを使用した切断装置 |
JP2008284635A (ja) * | 2007-05-16 | 2008-11-27 | Disco Abrasive Syst Ltd | ウォータジェット加工方法 |
JP2008307639A (ja) * | 2007-06-14 | 2008-12-25 | Disco Abrasive Syst Ltd | ウォータジェット加工方法 |
JP6022862B2 (ja) * | 2012-05-08 | 2016-11-09 | 株式会社不二製作所 | 硬質脆性基板の切り出し方法及び切り出し装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US587892A (en) * | 1897-08-10 | M a t iiia s w a l t e k | ||
US1664159A (en) * | 1926-04-23 | 1928-03-27 | Elroy A Chase | Apparatus for producing ornamental background on stone |
GB794528A (en) * | 1955-10-07 | 1958-05-07 | William Howard Mead | Improvements in receivers for particulate material |
US3205104A (en) * | 1961-07-10 | 1965-09-07 | Litton Industries Inc | Fabrication of interdigital delay lines |
US3187412A (en) * | 1963-04-26 | 1965-06-08 | Gen Electric | Method of mounting and aligning transducers on delay lines |
US3262234A (en) * | 1963-10-04 | 1966-07-26 | Int Rectifier Corp | Method of forming a semiconductor rim by sandblasting |
US3453781A (en) * | 1966-03-30 | 1969-07-08 | Ibm | Tailoring microminiature components |
US3516204A (en) * | 1967-08-21 | 1970-06-23 | Pennwalt Corp | Abrading apparatus |
-
1970
- 1970-06-15 CH CH897770A patent/CH504783A/de not_active IP Right Cessation
- 1970-06-17 AT AT546470A patent/AT315241B/de not_active IP Right Cessation
- 1970-06-18 NL NL7008966A patent/NL7008966A/xx unknown
- 1970-06-19 FR FR7022770A patent/FR2046967B1/fr not_active Expired
- 1970-06-19 GB GB1259249D patent/GB1259249A/en not_active Expired
- 1970-06-20 JP JP5399070A patent/JPS5013510B1/ja active Pending
- 1970-06-22 ZA ZA704234A patent/ZA704234B/xx unknown
- 1970-06-22 SE SE08611/70A patent/SE351523B/xx unknown
- 1970-06-26 US US50181A patent/US3694972A/en not_active Expired - Lifetime
Non-Patent Citations (1)
Title |
---|
NEANT * |
Also Published As
Publication number | Publication date |
---|---|
SE351523B (fr) | 1972-11-27 |
US3694972A (en) | 1972-10-03 |
ZA704234B (en) | 1971-03-31 |
GB1259249A (fr) | 1972-01-05 |
JPS5013510B1 (fr) | 1975-05-20 |
DE1931335A1 (de) | 1970-12-23 |
DE1931335B2 (de) | 1976-03-11 |
CH504783A (de) | 1971-03-15 |
AT315241B (de) | 1974-05-10 |
NL7008966A (fr) | 1970-12-22 |
FR2046967B1 (fr) | 1974-09-20 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |