FR2045816A1 - - Google Patents

Info

Publication number
FR2045816A1
FR2045816A1 FR7020318A FR7020318A FR2045816A1 FR 2045816 A1 FR2045816 A1 FR 2045816A1 FR 7020318 A FR7020318 A FR 7020318A FR 7020318 A FR7020318 A FR 7020318A FR 2045816 A1 FR2045816 A1 FR 2045816A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7020318A
Other languages
French (fr)
Other versions
FR2045816B1 (show.php
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of FR2045816A1 publication Critical patent/FR2045816A1/fr
Application granted granted Critical
Publication of FR2045816B1 publication Critical patent/FR2045816B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6548—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by forming intermediate materials, e.g. capping layers or diffusion barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • H10P14/6923—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being boron or phosphorus doped silicon oxides, e.g. BPSG, BSG or PSG
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/003—Anneal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/043—Dual dielectric
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/106—Masks, special
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/144—Shallow diffusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/958—Passivation layer
FR7020318A 1969-06-05 1970-06-03 Expired FR2045816B1 (show.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US83082269A 1969-06-05 1969-06-05

Publications (2)

Publication Number Publication Date
FR2045816A1 true FR2045816A1 (show.php) 1971-03-05
FR2045816B1 FR2045816B1 (show.php) 1975-02-21

Family

ID=25257756

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7020318A Expired FR2045816B1 (show.php) 1969-06-05 1970-06-03

Country Status (7)

Country Link
US (1) US3615942A (show.php)
JP (1) JPS4838098B1 (show.php)
DE (1) DE2027589A1 (show.php)
FR (1) FR2045816B1 (show.php)
GB (1) GB1317331A (show.php)
NL (1) NL7008144A (show.php)
SE (1) SE362537B (show.php)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3755015A (en) * 1971-12-10 1973-08-28 Gen Electric Anti-reflection coating for semiconductor diode array targets
US3839104A (en) * 1972-08-31 1974-10-01 Texas Instruments Inc Fabrication technique for high performance semiconductor devices
US3943015A (en) * 1973-06-29 1976-03-09 International Business Machines Corporation Method for high temperature semiconductor processing
JPS5266377A (en) * 1975-11-29 1977-06-01 Toshiba Corp Manufacture of semiconductor device
JPS5279777A (en) * 1975-12-26 1977-07-05 Toshiba Corp Production of semiconductor device
JPS5530846A (en) * 1978-08-28 1980-03-04 Hitachi Ltd Method for manufacturing fixed memory
JPS5534444A (en) * 1978-08-31 1980-03-11 Fujitsu Ltd Preparation of semiconductor device
NL8701357A (nl) * 1987-06-11 1989-01-02 Philips Nv Halfgeleiderinrichting bevattende een condensator en een begraven passiveringslaag.
EP1190446A1 (de) * 1999-06-28 2002-03-27 Unaxis Balzers Aktiengesellschaft Bauteil und verfahren zu dessen herstellung
US6582633B2 (en) 2001-01-17 2003-06-24 Akzo Nobel N.V. Process for producing objects
SG10202010798QA (en) * 2019-11-08 2021-06-29 Tokyo Electron Ltd Etching method and plasma processing apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1501444A (fr) * 1965-11-23 1967-11-10 Siemens Ag Procédé pour fabriquer des micro-composants à semi-conducteurs par la technique planar
FR1516618A (fr) * 1966-03-23 1968-03-08 Matsushita Electronics Corp Procédé pour la fabrication d'un élément semi-conducteur
FR1543785A (fr) * 1966-12-28 1968-09-16 Ibm Attaque des revêtements de semi-conducteur

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1501444A (fr) * 1965-11-23 1967-11-10 Siemens Ag Procédé pour fabriquer des micro-composants à semi-conducteurs par la technique planar
FR1516618A (fr) * 1966-03-23 1968-03-08 Matsushita Electronics Corp Procédé pour la fabrication d'un élément semi-conducteur
FR1543785A (fr) * 1966-12-28 1968-09-16 Ibm Attaque des revêtements de semi-conducteur

Also Published As

Publication number Publication date
JPS4838098B1 (show.php) 1973-11-15
SE362537B (show.php) 1973-12-10
GB1317331A (en) 1973-05-16
US3615942A (en) 1971-10-26
FR2045816B1 (show.php) 1975-02-21
DE2027589A1 (de) 1970-12-10
NL7008144A (show.php) 1970-12-08

Similar Documents

Publication Publication Date Title
AU2270770A (show.php)
AU465452B2 (show.php)
AU4221168A (show.php)
FR2045816B1 (show.php)
AU450150B2 (show.php)
AU442375B2 (show.php)
AU2355770A (show.php)
AU427401B2 (show.php)
AU442535B2 (show.php)
AU470661B1 (show.php)
AU428131B2 (show.php)
AU428074B2 (show.php)
AU438128B2 (show.php)
AU410358B2 (show.php)
AU442285B2 (show.php)
AU442322B2 (show.php)
AU442357B2 (show.php)
AU425297B2 (show.php)
AU442380B2 (show.php)
AU442463B2 (show.php)
AU417208B2 (show.php)
AU442538B2 (show.php)
AU442554B2 (show.php)
AU414607B2 (show.php)
AU5228269A (show.php)

Legal Events

Date Code Title Description
ST Notification of lapse