FR2026315A1 - - Google Patents
Info
- Publication number
- FR2026315A1 FR2026315A1 FR6939157A FR6939157A FR2026315A1 FR 2026315 A1 FR2026315 A1 FR 2026315A1 FR 6939157 A FR6939157 A FR 6939157A FR 6939157 A FR6939157 A FR 6939157A FR 2026315 A1 FR2026315 A1 FR 2026315A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8581—Means for heat extraction or cooling characterised by their material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07236—Soldering or alloying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/251—Materials
- H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US78431568A | 1968-12-17 | 1968-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2026315A1 true FR2026315A1 (enExample) | 1970-09-18 |
Family
ID=25132054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR6939157A Withdrawn FR2026315A1 (enExample) | 1968-12-17 | 1969-11-14 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3593070A (enExample) |
| JP (1) | JPS493027B1 (enExample) |
| DE (1) | DE1962003A1 (enExample) |
| FR (1) | FR2026315A1 (enExample) |
| GB (1) | GB1270577A (enExample) |
| NL (1) | NL6913858A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2284190A1 (fr) * | 1974-09-06 | 1976-04-02 | Ibm | Assemblage fonctionnel pour systemes electroniques complexes et son procede de fabrication |
| EP0007993A1 (de) * | 1978-07-12 | 1980-02-20 | Siemens Aktiengesellschaft | Leiterplatte zur Halterung und elektrischen Verbindung von Halbleiterchips |
| EP0432044A1 (fr) * | 1989-12-08 | 1991-06-12 | Thomson-Csf | Perfectionnement aux transistors de puissance en matériaux III-V sur substrat silicium, et procédé de fabrication |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3684930A (en) * | 1970-12-28 | 1972-08-15 | Gen Electric | Ohmic contact for group iii-v p-types semiconductors |
| US3769694A (en) * | 1970-12-28 | 1973-11-06 | Gen Electric | Ohmic contact for group iii-v p-type semiconductors |
| JPS546787A (en) * | 1977-06-17 | 1979-01-19 | Matsushita Electric Ind Co Ltd | Luminous element |
| US4165474A (en) * | 1977-12-27 | 1979-08-21 | Texas Instruments Incorporated | Optoelectronic displays using uniformly spaced arrays of semi-sphere light-emitting diodes |
| US4278990A (en) * | 1979-03-19 | 1981-07-14 | General Electric Company | Low thermal resistance, low stress semiconductor package |
| JPS59155804U (ja) * | 1983-04-01 | 1984-10-19 | 松下電器産業株式会社 | キユ−ビクル式受変電装置 |
| US4760440A (en) * | 1983-10-31 | 1988-07-26 | General Electric Company | Package for solid state image sensors |
| US4951123A (en) * | 1988-09-30 | 1990-08-21 | Westinghouse Electric Corp. | Integrated circuit chip assembly utilizing selective backside deposition |
| JP3023883B2 (ja) * | 1991-10-26 | 2000-03-21 | ローム株式会社 | サブマウント型レーザ |
| US5557115A (en) * | 1994-08-11 | 1996-09-17 | Rohm Co. Ltd. | Light emitting semiconductor device with sub-mount |
| RU2161107C2 (ru) * | 1998-05-29 | 2000-12-27 | Зусманович Вениамин Самуилович | Способ перевозки грузов на летательном аппарате |
| US6486499B1 (en) * | 1999-12-22 | 2002-11-26 | Lumileds Lighting U.S., Llc | III-nitride light-emitting device with increased light generating capability |
| US6885035B2 (en) * | 1999-12-22 | 2005-04-26 | Lumileds Lighting U.S., Llc | Multi-chip semiconductor LED assembly |
| US20050047140A1 (en) * | 2003-08-25 | 2005-03-03 | Jung-Chien Chang | Lighting device composed of a thin light emitting diode module |
| EP1911389A4 (en) * | 2005-08-05 | 2009-12-16 | Olympus Medical Systems Corp | LIGHT EMISSION UNIT |
| US7816155B2 (en) * | 2007-07-06 | 2010-10-19 | Jds Uniphase Corporation | Mounted semiconductor device and a method for making the same |
| CN201725809U (zh) * | 2010-03-04 | 2011-01-26 | 广州市海林电子科技发展有限公司 | 一种led器件 |
| CN105612622B (zh) * | 2013-09-27 | 2019-02-22 | 英特尔公司 | 在硅鳍状物上形成led结构 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL299194A (enExample) * | 1962-10-15 | |||
| US3414968A (en) * | 1965-02-23 | 1968-12-10 | Solitron Devices | Method of assembly of power transistors |
| US3361868A (en) * | 1966-08-04 | 1968-01-02 | Coors Porcelain Co | Support for electrical circuit component |
| US3440114A (en) * | 1966-10-31 | 1969-04-22 | Texas Instruments Inc | Selective gold doping for high resistivity regions in silicon |
-
1968
- 1968-12-17 US US784315A patent/US3593070A/en not_active Expired - Lifetime
-
1969
- 1969-08-07 GB GB39557/69A patent/GB1270577A/en not_active Expired
- 1969-09-10 JP JP7129969A patent/JPS493027B1/ja active Pending
- 1969-09-11 NL NL6913858A patent/NL6913858A/xx unknown
- 1969-11-14 FR FR6939157A patent/FR2026315A1/fr not_active Withdrawn
- 1969-12-11 DE DE19691962003 patent/DE1962003A1/de active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2284190A1 (fr) * | 1974-09-06 | 1976-04-02 | Ibm | Assemblage fonctionnel pour systemes electroniques complexes et son procede de fabrication |
| EP0007993A1 (de) * | 1978-07-12 | 1980-02-20 | Siemens Aktiengesellschaft | Leiterplatte zur Halterung und elektrischen Verbindung von Halbleiterchips |
| EP0432044A1 (fr) * | 1989-12-08 | 1991-06-12 | Thomson-Csf | Perfectionnement aux transistors de puissance en matériaux III-V sur substrat silicium, et procédé de fabrication |
| FR2655774A1 (fr) * | 1989-12-08 | 1991-06-14 | Thomson Csf | Perfectionnement aux transistors de puissance en materiaux iii-v sur substrat silicium et procede de fabrication. |
| US5138407A (en) * | 1989-12-08 | 1992-08-11 | Thomson - Csf | Transistor made of 3-5 group semiconductor materials on a silicon substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1270577A (en) | 1972-04-12 |
| US3593070A (en) | 1971-07-13 |
| JPS493027B1 (enExample) | 1974-01-24 |
| NL6913858A (enExample) | 1970-06-19 |
| DE1962003A1 (de) | 1970-07-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |