FR2023314A1 - - Google Patents

Info

Publication number
FR2023314A1
FR2023314A1 FR6933855A FR6933855A FR2023314A1 FR 2023314 A1 FR2023314 A1 FR 2023314A1 FR 6933855 A FR6933855 A FR 6933855A FR 6933855 A FR6933855 A FR 6933855A FR 2023314 A1 FR2023314 A1 FR 2023314A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
FR6933855A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Publication of FR2023314A1 publication Critical patent/FR2023314A1/fr
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302Non-deposition formation processes
    • H10P14/6322Formation by thermal treatments
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302Non-deposition formation processes
    • H10P14/6304Formation by oxidation, e.g. oxidation of the substrate
    • H10P14/6306Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
    • H10P14/6308Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors
    • H10P14/6309Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors of silicon in uncombined form, i.e. pure silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/14Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
    • H10P32/1404Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase using predeposition followed by drive-in of impurities into the semiconductor surface, e.g. predeposition from a gaseous phase
    • H10P32/1406Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase using predeposition followed by drive-in of impurities into the semiconductor surface, e.g. predeposition from a gaseous phase by ion implantation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/17Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
    • H10P32/171Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being group IV material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/914Doping
    • Y10S438/92Controlling diffusion profile by oxidation
FR6933855A 1968-10-04 1969-10-03 Pending FR2023314A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP43071852A JPS4915377B1 (https=) 1968-10-04 1968-10-04

Publications (1)

Publication Number Publication Date
FR2023314A1 true FR2023314A1 (https=) 1970-08-21

Family

ID=13472467

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6933855A Pending FR2023314A1 (https=) 1968-10-04 1969-10-03

Country Status (6)

Country Link
US (1) US3745070A (https=)
JP (1) JPS4915377B1 (https=)
DE (1) DE1950069B2 (https=)
FR (1) FR2023314A1 (https=)
GB (1) GB1239684A (https=)
NL (1) NL6914952A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0017719A1 (en) * 1979-04-23 1980-10-29 Rockwell International Corporation Microelectronic fabrication method minimizing threshold voltage variation

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3895965A (en) * 1971-05-24 1975-07-22 Bell Telephone Labor Inc Method of forming buried layers by ion implantation
FR2209217B1 (https=) * 1972-11-10 1977-12-16 Lignes Telegraph Telephon
US3852119A (en) * 1972-11-14 1974-12-03 Texas Instruments Inc Metal-insulator-semiconductor structures having reduced junction capacitance and method of fabrication
US3966501A (en) * 1973-03-23 1976-06-29 Mitsubishi Denki Kabushiki Kaisha Process of producing semiconductor devices
US3959025A (en) * 1974-05-01 1976-05-25 Rca Corporation Method of making an insulated gate field effect transistor
DE2507613C3 (de) * 1975-02-21 1979-07-05 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung eines invers betriebenen Transistors
US4038106A (en) * 1975-04-30 1977-07-26 Rca Corporation Four-layer trapatt diode and method for making same
US4055443A (en) * 1975-06-19 1977-10-25 Jury Stepanovich Akimov Method for producing semiconductor matrix of light-emitting elements utilizing ion implantation and diffusion heating
US4055444A (en) * 1976-01-12 1977-10-25 Texas Instruments Incorporated Method of making N-channel MOS integrated circuits
US4092209A (en) * 1976-12-30 1978-05-30 Rca Corp. Silicon implanted and bombarded with phosphorus ions
US4168990A (en) * 1977-04-04 1979-09-25 International Rectifier Corporation Hot implantation at 1100°-1300° C. for forming non-gaussian impurity profile
DE3118785A1 (de) * 1981-05-12 1982-12-02 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zum dotieren von halbleitermaterial
JPS6065528A (ja) * 1983-09-21 1985-04-15 Hitachi Ltd pn接合形成法
US4818711A (en) * 1987-08-28 1989-04-04 Intel Corporation High quality oxide on an ion implanted polysilicon surface
AU5779200A (en) 1999-07-01 2001-01-22 E-Ink Corporation Electrophoretic medium provided with spacers
KR100767233B1 (ko) 2000-04-18 2007-10-17 이 잉크 코포레이션 박막 트랜지스터의 제조 공정 및 기판
US7893435B2 (en) 2000-04-18 2011-02-22 E Ink Corporation Flexible electronic circuits and displays including a backplane comprising a patterned metal foil having a plurality of apertures extending therethrough

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1150454B (de) * 1960-11-14 1963-06-20 Licentia Gmbh Verfahren zum Herstellen von pn-UEbergaengen in Siliziumscheiben
US3158505A (en) * 1962-07-23 1964-11-24 Fairchild Camera Instr Co Method of placing thick oxide coatings on silicon and article
NL302630A (https=) * 1963-01-18 1900-01-01
USB421061I5 (https=) * 1964-12-24
US3388009A (en) * 1965-06-23 1968-06-11 Ion Physics Corp Method of forming a p-n junction by an ionic beam

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0017719A1 (en) * 1979-04-23 1980-10-29 Rockwell International Corporation Microelectronic fabrication method minimizing threshold voltage variation

Also Published As

Publication number Publication date
DE1950069B2 (de) 1981-10-08
JPS4915377B1 (https=) 1974-04-15
US3745070A (en) 1973-07-10
DE1950069A1 (de) 1970-04-23
GB1239684A (https=) 1971-07-21
NL6914952A (https=) 1970-04-07

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