FR2006054A1 - - Google Patents

Info

Publication number
FR2006054A1
FR2006054A1 FR6911069A FR6911069A FR2006054A1 FR 2006054 A1 FR2006054 A1 FR 2006054A1 FR 6911069 A FR6911069 A FR 6911069A FR 6911069 A FR6911069 A FR 6911069A FR 2006054 A1 FR2006054 A1 FR 2006054A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6911069A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wacker Chemie AG
Original Assignee
Wacker Chemie AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemie AG filed Critical Wacker Chemie AG
Publication of FR2006054A1 publication Critical patent/FR2006054A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
FR6911069A 1968-04-11 1969-04-10 Withdrawn FR2006054A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681752163 DE1752163A1 (de) 1968-04-11 1968-04-11 Verfahren zum Polieren von Halbleiteroberflaechen

Publications (1)

Publication Number Publication Date
FR2006054A1 true FR2006054A1 (enrdf_load_stackoverflow) 1969-12-19

Family

ID=5692658

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6911069A Withdrawn FR2006054A1 (enrdf_load_stackoverflow) 1968-04-11 1969-04-10

Country Status (6)

Country Link
US (1) US3877183A (enrdf_load_stackoverflow)
BE (1) BE731353A (enrdf_load_stackoverflow)
CH (1) CH505466A (enrdf_load_stackoverflow)
DE (1) DE1752163A1 (enrdf_load_stackoverflow)
FR (1) FR2006054A1 (enrdf_load_stackoverflow)
GB (1) GB1234894A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2327036A1 (fr) * 1975-10-08 1977-05-06 Du Pont Procede de polissage de materiaux semi-conducteurs de germanium et de silicium

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2531431C3 (de) * 1975-07-14 1979-03-01 Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen Poliermittel zur Herstellung schleierfreier Halbleiteroberflächen
DE2538855A1 (de) * 1975-09-01 1977-03-10 Wacker Chemitronic Verfahren zur herstellung von schleierfreien halbleiteroberflaechen, insbesondere schleierfreien oberflaechen von (111)-orientiertem galliumarsenid
JPS55113700A (en) * 1979-02-19 1980-09-02 Fujimi Kenmazai Kogyo Kk Polishing method for gadolinium gallium garnet single crystal
JPS5935429A (ja) * 1982-08-12 1984-02-27 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 半導体ウエハの製造方法
DE3237235C2 (de) * 1982-10-07 1986-07-10 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zum Polieren von III-V-Halbleiteroberflächen
US4588421A (en) * 1984-10-15 1986-05-13 Nalco Chemical Company Aqueous silica compositions for polishing silicon wafers
US5993685A (en) * 1997-04-02 1999-11-30 Advanced Technology Materials Planarization composition for removing metal films
US6319095B1 (en) * 2000-03-09 2001-11-20 Agere Systems Guardian Corp. Colloidal suspension of abrasive particles containing magnesium as CMP slurry
TWI562234B (en) 2006-12-21 2016-12-11 Entegris Inc Compositions and methods for the selective removal of silicon nitride
WO2013099666A1 (ja) * 2011-12-27 2013-07-04 コニカミノルタ株式会社 研磨材分離方法及び再生研磨材
CN111253910B (zh) * 2020-03-18 2021-07-16 昆山捷纳电子材料有限公司 一种无机聚电解质-氧化硅复合抛光磨粒的制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2275049A (en) * 1942-03-03 Polish
US2375825A (en) * 1941-10-16 1945-05-15 Interchem Corp Polishing compositions
US2375823A (en) * 1941-10-16 1945-05-15 Interchem Corp Polishing composition
US2399237A (en) * 1942-12-15 1946-04-30 William T Maloney Polishing material and process of preparing same
US2955030A (en) * 1959-02-25 1960-10-04 Nat Lead Co Polishing compositions
US3170273A (en) * 1963-01-10 1965-02-23 Monsanto Co Process for polishing semiconductor materials
US3527028A (en) * 1967-09-26 1970-09-08 Bell Telephone Labor Inc Preparation of semiconductor surfaces
US3647381A (en) * 1968-04-08 1972-03-07 Gabriel Reiter Dental-prophylaxis composition
US3541017A (en) * 1969-02-04 1970-11-17 Indiana University Foundation Denture cleanser preparations comprising zirconium silicate and zirconium dioxide
US3754941A (en) * 1971-01-04 1973-08-28 Colgate Palmolive Co Removal of metallic stains from porcelain surfaces

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2327036A1 (fr) * 1975-10-08 1977-05-06 Du Pont Procede de polissage de materiaux semi-conducteurs de germanium et de silicium

Also Published As

Publication number Publication date
DE1752163A1 (de) 1971-05-13
DE1752163B2 (enrdf_load_stackoverflow) 1974-07-25
CH505466A (de) 1971-03-31
GB1234894A (en) 1971-06-09
DE1752163C3 (enrdf_load_stackoverflow) 1975-03-20
US3877183A (en) 1975-04-15
BE731353A (enrdf_load_stackoverflow) 1969-10-10

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Legal Events

Date Code Title Description
ST Notification of lapse