BE731353A - - Google Patents

Info

Publication number
BE731353A
BE731353A BE731353DA BE731353A BE 731353 A BE731353 A BE 731353A BE 731353D A BE731353D A BE 731353DA BE 731353 A BE731353 A BE 731353A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE731353A publication Critical patent/BE731353A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002Preparing wafers
    • H01L21/02005Preparing bulk and homogeneous wafers
    • H01L21/02008Multistep processes
    • H01L21/0201Specific process step
    • H01L21/02024Mirror polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
BE731353D 1968-04-11 1969-04-10 BE731353A (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681752163 DE1752163A1 (de) 1968-04-11 1968-04-11 Verfahren zum Polieren von Halbleiteroberflaechen

Publications (1)

Publication Number Publication Date
BE731353A true BE731353A (enrdf_load_stackoverflow) 1969-10-10

Family

ID=5692658

Family Applications (1)

Application Number Title Priority Date Filing Date
BE731353D BE731353A (enrdf_load_stackoverflow) 1968-04-11 1969-04-10

Country Status (6)

Country Link
US (1) US3877183A (enrdf_load_stackoverflow)
BE (1) BE731353A (enrdf_load_stackoverflow)
CH (1) CH505466A (enrdf_load_stackoverflow)
DE (1) DE1752163A1 (enrdf_load_stackoverflow)
FR (1) FR2006054A1 (enrdf_load_stackoverflow)
GB (1) GB1234894A (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2531431C3 (de) * 1975-07-14 1979-03-01 Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen Poliermittel zur Herstellung schleierfreier Halbleiteroberflächen
DE2538855A1 (de) * 1975-09-01 1977-03-10 Wacker Chemitronic Verfahren zur herstellung von schleierfreien halbleiteroberflaechen, insbesondere schleierfreien oberflaechen von (111)-orientiertem galliumarsenid
FR2327036A1 (fr) * 1975-10-08 1977-05-06 Du Pont Procede de polissage de materiaux semi-conducteurs de germanium et de silicium
JPS55113700A (en) * 1979-02-19 1980-09-02 Fujimi Kenmazai Kogyo Kk Polishing method for gadolinium gallium garnet single crystal
JPS5935429A (ja) * 1982-08-12 1984-02-27 インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン 半導体ウエハの製造方法
DE3237235C2 (de) * 1982-10-07 1986-07-10 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zum Polieren von III-V-Halbleiteroberflächen
US4588421A (en) * 1984-10-15 1986-05-13 Nalco Chemical Company Aqueous silica compositions for polishing silicon wafers
US5993685A (en) * 1997-04-02 1999-11-30 Advanced Technology Materials Planarization composition for removing metal films
US6319095B1 (en) * 2000-03-09 2001-11-20 Agere Systems Guardian Corp. Colloidal suspension of abrasive particles containing magnesium as CMP slurry
TWI562234B (en) 2006-12-21 2016-12-11 Entegris Inc Compositions and methods for the selective removal of silicon nitride
EP2799185B1 (en) * 2011-12-27 2017-02-01 Konica Minolta, Inc. Method for separating polishing material and regenerated polishing material
CN111253910B (zh) * 2020-03-18 2021-07-16 昆山捷纳电子材料有限公司 一种无机聚电解质-氧化硅复合抛光磨粒的制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2275049A (en) * 1942-03-03 Polish
US2375823A (en) * 1941-10-16 1945-05-15 Interchem Corp Polishing composition
US2375825A (en) * 1941-10-16 1945-05-15 Interchem Corp Polishing compositions
US2399237A (en) * 1942-12-15 1946-04-30 William T Maloney Polishing material and process of preparing same
US2955030A (en) * 1959-02-25 1960-10-04 Nat Lead Co Polishing compositions
US3170273A (en) * 1963-01-10 1965-02-23 Monsanto Co Process for polishing semiconductor materials
US3527028A (en) * 1967-09-26 1970-09-08 Bell Telephone Labor Inc Preparation of semiconductor surfaces
US3647381A (en) * 1968-04-08 1972-03-07 Gabriel Reiter Dental-prophylaxis composition
US3541017A (en) * 1969-02-04 1970-11-17 Indiana University Foundation Denture cleanser preparations comprising zirconium silicate and zirconium dioxide
US3754941A (en) * 1971-01-04 1973-08-28 Colgate Palmolive Co Removal of metallic stains from porcelain surfaces

Also Published As

Publication number Publication date
US3877183A (en) 1975-04-15
GB1234894A (en) 1971-06-09
FR2006054A1 (enrdf_load_stackoverflow) 1969-12-19
DE1752163B2 (enrdf_load_stackoverflow) 1974-07-25
DE1752163A1 (de) 1971-05-13
DE1752163C3 (enrdf_load_stackoverflow) 1975-03-20
CH505466A (de) 1971-03-31

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