FR2000669B1 - - Google Patents

Info

Publication number
FR2000669B1
FR2000669B1 FR696901317A FR6901317A FR2000669B1 FR 2000669 B1 FR2000669 B1 FR 2000669B1 FR 696901317 A FR696901317 A FR 696901317A FR 6901317 A FR6901317 A FR 6901317A FR 2000669 B1 FR2000669 B1 FR 2000669B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR696901317A
Other languages
French (fr)
Other versions
FR2000669A1 (xx
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of FR2000669A1 publication Critical patent/FR2000669A1/fr
Application granted granted Critical
Publication of FR2000669B1 publication Critical patent/FR2000669B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J19/00—Details of vacuum tubes of the types covered by group H01J21/00
    • H01J19/28—Non-electron-emitting electrodes; Screens
    • H01J19/32—Anodes
    • H01J19/36—Cooling of anodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22—STEAM GENERATION
    • F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
    • F22B27/00—Instantaneous or flash steam boilers
    • F22B27/14—Instantaneous or flash steam boilers built-up from heat-exchange elements arranged within a confined chamber having heat-retaining walls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H1/00—Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
    • F24H1/10—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
    • F24H1/12—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium
    • F24H1/14—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium by tubes, e.g. bent in serpentine form
    • F24H1/145—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium by tubes, e.g. bent in serpentine form using fluid fuel
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H1/00—Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
    • F24H1/10—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
    • F24H1/12—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium
    • F24H1/14—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium by tubes, e.g. bent in serpentine form
    • F24H1/16—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium by tubes, e.g. bent in serpentine form helically or spirally coiled
    • F24H1/165—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium by tubes, e.g. bent in serpentine form helically or spirally coiled using fluid fuel
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00—Discharge tubes and lamps
    • H01J2893/0001—Electrodes and electrode systems suitable for discharge tubes or lamps
    • H01J2893/0012—Constructional arrangements
    • H01J2893/0027—Mitigation of temperature effects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dispersion Chemistry (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Laminated Bodies (AREA)
  • Gas Burners (AREA)
  • Details Of Fluid Heaters (AREA)
FR696901317A 1968-01-24 1969-01-24 Expired FR2000669B1 (xx)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70019268A 1968-01-24 1968-01-24
US73713568A 1968-06-14 1968-06-14

Publications (2)

Publication Number Publication Date
FR2000669A1 FR2000669A1 (xx) 1969-09-12
FR2000669B1 true FR2000669B1 (xx) 1974-02-22

Family

ID=27106564

Family Applications (1)

Application Number Title Priority Date Filing Date
FR696901317A Expired FR2000669B1 (xx) 1968-01-24 1969-01-24

Country Status (12)

Country Link
JP (1) JPS5113909B1 (xx)
AT (1) AT327244B (xx)
BE (1) BE734306A (xx)
CA (1) CA1040025A (xx)
CH (1) CH514114A (xx)
DE (2) DE1966650A1 (xx)
ES (2) ES362674A1 (xx)
FR (1) FR2000669B1 (xx)
GB (1) GB1246581A (xx)
LU (1) LU58874A1 (xx)
NL (1) NL6901052A (xx)
NO (1) NO125510B (xx)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3704748A (en) * 1970-02-11 1972-12-05 Ratheon Co Heat transfer structure
CA1044695A (en) * 1970-03-02 1978-12-19 American Standard Inc. Heat exchanger structure for a compact boiler and the like
JPS56146701U (xx) * 1980-04-02 1981-11-05
JPS56170203U (xx) * 1980-05-16 1981-12-16
EP0399813B1 (en) * 1989-05-23 1993-10-06 Kabushiki Kaisha Toshiba Cryogenic refrigerator
US5224657A (en) * 1989-05-23 1993-07-06 Kabushiki Kaisha Toshiba Cryogenic refrigerator
FR2682464A1 (fr) * 1991-10-10 1993-04-16 Elf Aquitaine Procede d'amelioration des transferts de chaleur et de masse vers et/ou a travers une paroi.
DE19834296A1 (de) * 1998-07-29 2000-02-10 Inoevt Beyersdorf Keg Lienz Vorrichtung zum Aufheizen eines Mediums
DE19834295A1 (de) * 1998-07-29 2000-02-10 Inoevt Beyersdorf Keg Lienz Vorrichtung zum Aufheizen wenigstens eines Mediums
US20120125567A1 (en) * 2009-07-09 2012-05-24 Thomas Paul Von Kossakglowczewski Heat exchanger
CZ304277B6 (cs) * 2009-12-07 2014-02-12 Vysoká Škola Báňská - Technická Univerzita Ostrava Tepelný výměník pro kogenerační jednotku s mikroturbínou
EP3339790A1 (en) * 2016-12-21 2018-06-27 L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Heat exchanger and heat exchange method using same
CN110832257B (zh) * 2017-07-07 2021-11-05 贝卡尔特燃烧技术股份有限公司 用于分段式热交换器的铸造段
EP3717840B1 (en) 2017-11-29 2021-06-16 Condevo S.p.A. Heat exchange cell and method
CN109060495B (zh) * 2018-09-11 2024-03-15 四川省机械研究设计院(集团)有限公司 可调节热阻的装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB191017560A (en) * 1910-07-25 1911-06-21 William Arthur Bone Improvements in and relating to Steam Generators.
FR538935A (fr) * 1916-10-14 1922-06-17 Appareil et méthode pour le transfert de chaleur
DE895459C (de) * 1951-12-23 1953-11-02 Metallgesellschaft Ag Laengsrohr-Waermeaustauscher
GB1015306A (en) * 1963-06-05 1965-12-31 Bendix Corp Improvements in and relating to tube type heat exchangers
US3306353A (en) * 1964-12-23 1967-02-28 Olin Mathieson Heat exchanger with sintered metal matrix around tubes

Also Published As

Publication number Publication date
LU58874A1 (xx) 1970-01-14
FR2000669A1 (xx) 1969-09-12
ES362674A1 (es) 1971-02-01
CH514114A (de) 1971-10-15
ATA566069A (de) 1975-04-15
GB1246581A (en) 1971-09-15
AT327244B (de) 1976-01-26
DE1902229A1 (de) 1969-10-16
NL6901052A (nl) 1969-07-28
CA1040025A (en) 1978-10-10
DE1902229B2 (de) 1972-09-07
ES376609A1 (es) 1972-09-16
NO125510B (xx) 1972-09-18
DE6901693U (de) 1970-06-11
JPS5113909B1 (xx) 1976-05-04
BE734306A (xx) 1969-11-17
DE1966650A1 (de) 1973-05-24

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Legal Events

Date Code Title Description
ST Notification of lapse