ES376609A1 - Un dispositivo de intercambio de calor. - Google Patents

Un dispositivo de intercambio de calor.

Info

Publication number
ES376609A1
ES376609A1 ES376609A ES376609A ES376609A1 ES 376609 A1 ES376609 A1 ES 376609A1 ES 376609 A ES376609 A ES 376609A ES 376609 A ES376609 A ES 376609A ES 376609 A1 ES376609 A1 ES 376609A1
Authority
ES
Spain
Prior art keywords
matrix
fluid
elements
passage
unspecified
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES376609A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of ES376609A1 publication Critical patent/ES376609A1/es
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J19/00Details of vacuum tubes of the types covered by group H01J21/00
    • H01J19/28Non-electron-emitting electrodes; Screens
    • H01J19/32Anodes
    • H01J19/36Cooling of anodes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22STEAM GENERATION
    • F22BMETHODS OF STEAM GENERATION; STEAM BOILERS
    • F22B27/00Instantaneous or flash steam boilers
    • F22B27/14Instantaneous or flash steam boilers built-up from heat-exchange elements arranged within a confined chamber having heat-retaining walls
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24HFLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H1/00Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
    • F24H1/10Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
    • F24H1/12Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium
    • F24H1/14Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium by tubes, e.g. bent in serpentine form
    • F24H1/145Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium by tubes, e.g. bent in serpentine form using fluid fuel
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24HFLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H1/00Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
    • F24H1/10Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
    • F24H1/12Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium
    • F24H1/14Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium by tubes, e.g. bent in serpentine form
    • F24H1/16Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium by tubes, e.g. bent in serpentine form helically or spirally coiled
    • F24H1/165Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium by tubes, e.g. bent in serpentine form helically or spirally coiled using fluid fuel
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209Heat transfer by conduction from internal heat source to heat radiating structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00Discharge tubes and lamps
    • H01J2893/0001Electrodes and electrode systems suitable for discharge tubes or lamps
    • H01J2893/0012Constructional arrangements
    • H01J2893/0027Mitigation of temperature effects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025Base discrete devices, e.g. presspack, disc-type transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dispersion Chemistry (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Laminated Bodies (AREA)
  • Details Of Fluid Heaters (AREA)
  • Gas Burners (AREA)
ES376609A 1968-01-24 1970-02-16 Un dispositivo de intercambio de calor. Expired ES376609A1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70019268A 1968-01-24 1968-01-24
US73713568A 1968-06-14 1968-06-14

Publications (1)

Publication Number Publication Date
ES376609A1 true ES376609A1 (es) 1972-09-16

Family

ID=27106564

Family Applications (2)

Application Number Title Priority Date Filing Date
ES362674A Expired ES362674A1 (es) 1968-01-24 1969-01-18 Un dispositivo de intercambiador de calor.
ES376609A Expired ES376609A1 (es) 1968-01-24 1970-02-16 Un dispositivo de intercambio de calor.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ES362674A Expired ES362674A1 (es) 1968-01-24 1969-01-18 Un dispositivo de intercambiador de calor.

Country Status (12)

Country Link
JP (1) JPS5113909B1 (es)
AT (1) AT327244B (es)
BE (1) BE734306A (es)
CA (1) CA1040025A (es)
CH (1) CH514114A (es)
DE (2) DE6901693U (es)
ES (2) ES362674A1 (es)
FR (1) FR2000669B1 (es)
GB (1) GB1246581A (es)
LU (1) LU58874A1 (es)
NL (1) NL6901052A (es)
NO (1) NO125510B (es)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3704748A (en) * 1970-02-11 1972-12-05 Ratheon Co Heat transfer structure
CA1044695A (en) * 1970-03-02 1978-12-19 American Standard Inc. Heat exchanger structure for a compact boiler and the like
JPS56146701U (es) * 1980-04-02 1981-11-05
JPS56170203U (es) * 1980-05-16 1981-12-16
US5224657A (en) * 1989-05-23 1993-07-06 Kabushiki Kaisha Toshiba Cryogenic refrigerator
DE69003738T2 (de) * 1989-05-23 1994-03-10 Toshiba Kawasaki Kk Kryokälteanlage.
FR2682464A1 (fr) * 1991-10-10 1993-04-16 Elf Aquitaine Procede d'amelioration des transferts de chaleur et de masse vers et/ou a travers une paroi.
DE19834295A1 (de) * 1998-07-29 2000-02-10 Inoevt Beyersdorf Keg Lienz Vorrichtung zum Aufheizen wenigstens eines Mediums
DE19834296A1 (de) * 1998-07-29 2000-02-10 Inoevt Beyersdorf Keg Lienz Vorrichtung zum Aufheizen eines Mediums
CN102472591B (zh) * 2009-07-09 2014-07-23 国际壳牌研究有限公司 换热器
CZ304277B6 (cs) * 2009-12-07 2014-02-12 Vysoká Škola Báňská - Technická Univerzita Ostrava Tepelný výměník pro kogenerační jednotku s mikroturbínou
EP3339790A1 (en) * 2016-12-21 2018-06-27 L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Heat exchanger and heat exchange method using same
CN110832257B (zh) * 2017-07-07 2021-11-05 贝卡尔特燃烧技术股份有限公司 用于分段式热交换器的铸造段
US11644246B2 (en) 2017-11-29 2023-05-09 Condevo S.P.A. Heat exchange cell and method
CN109060495B (zh) * 2018-09-11 2024-03-15 四川省机械研究设计院(集团)有限公司 可调节热阻的装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB191017560A (en) * 1910-07-25 1911-06-21 William Arthur Bone Improvements in and relating to Steam Generators.
FR538935A (fr) * 1916-10-14 1922-06-17 Appareil et méthode pour le transfert de chaleur
DE895459C (de) * 1951-12-23 1953-11-02 Metallgesellschaft Ag Laengsrohr-Waermeaustauscher
GB1015306A (en) * 1963-06-05 1965-12-31 Bendix Corp Improvements in and relating to tube type heat exchangers
US3306353A (en) * 1964-12-23 1967-02-28 Olin Mathieson Heat exchanger with sintered metal matrix around tubes

Also Published As

Publication number Publication date
NO125510B (es) 1972-09-18
CH514114A (de) 1971-10-15
DE1902229B2 (de) 1972-09-07
LU58874A1 (es) 1970-01-14
CA1040025A (en) 1978-10-10
NL6901052A (nl) 1969-07-28
DE1902229A1 (de) 1969-10-16
ES362674A1 (es) 1971-02-01
ATA566069A (de) 1975-04-15
FR2000669B1 (es) 1974-02-22
GB1246581A (en) 1971-09-15
AT327244B (de) 1976-01-26
DE6901693U (de) 1970-06-11
DE1966650A1 (de) 1973-05-24
FR2000669A1 (es) 1969-09-12
JPS5113909B1 (es) 1976-05-04
BE734306A (es) 1969-11-17

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