FR1554956A - - Google Patents
Info
- Publication number
- FR1554956A FR1554956A FR1554956DA FR1554956A FR 1554956 A FR1554956 A FR 1554956A FR 1554956D A FR1554956D A FR 1554956DA FR 1554956 A FR1554956 A FR 1554956A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/122—Polycrystalline
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electroplating Methods And Accessories (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US61609467A | 1967-02-14 | 1967-02-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1554956A true FR1554956A (fr) | 1969-01-24 |
Family
ID=24468006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1554956D Expired FR1554956A (fr) | 1967-02-14 | 1968-01-10 |
Country Status (4)
Country | Link |
---|---|
US (1) | US3506545A (fr) |
DE (1) | DE1696075C3 (fr) |
FR (1) | FR1554956A (fr) |
GB (1) | GB1176889A (fr) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3894893A (en) * | 1968-03-30 | 1975-07-15 | Kyodo Denshi Gijyutsu Kk | Method for the production of monocrystal-polycrystal semiconductor devices |
CA1047654A (fr) * | 1974-10-17 | 1979-01-30 | Norman Rain | Electro-deposition sur semi-conducteurs |
JPS5950113B2 (ja) * | 1975-11-05 | 1984-12-06 | 株式会社東芝 | 半導体装置 |
US4379022A (en) * | 1979-05-08 | 1983-04-05 | International Business Machines Corporation | Method for maskless chemical machining |
US4217183A (en) * | 1979-05-08 | 1980-08-12 | International Business Machines Corporation | Method for locally enhancing electroplating rates |
US4803528A (en) * | 1980-07-28 | 1989-02-07 | General Electric Company | Insulating film having electrically conducting portions |
US4519876A (en) * | 1984-06-28 | 1985-05-28 | Thermo Electron Corporation | Electrolytic deposition of metals on laser-conditioned surfaces |
US4578157A (en) * | 1984-10-02 | 1986-03-25 | Halliwell Michael J | Laser induced deposition of GaAs |
US4578155A (en) * | 1985-03-19 | 1986-03-25 | Halliwell Michael J | Laser induced deposition on polymeric substrates |
DE3517729A1 (de) * | 1985-05-17 | 1986-11-20 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe | Verfahren zum herstellen von spinnduesenplatten |
DE3517730A1 (de) * | 1985-05-17 | 1986-11-20 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe | Verfahren zum herstellen von spinnduesenplatten |
GB2188774B (en) * | 1986-04-02 | 1990-10-31 | Westinghouse Electric Corp | Method of forming a conductive pattern on a semiconductor surface |
US4919971A (en) * | 1988-09-23 | 1990-04-24 | International Business Machines Corporation | Self-induced repairing of conductor lines |
US5162295A (en) * | 1989-04-10 | 1992-11-10 | Allied-Signal Inc. | Superconducting ceramics by sequential electrodeposition of metals, followed by oxidation |
US4994154A (en) * | 1990-02-06 | 1991-02-19 | International Business Machines Corporation | High frequency electrochemical repair of open circuits |
US5098526A (en) * | 1991-04-08 | 1992-03-24 | The United States Of America As Represented By The United States Department Of Energy | Process for preparation of a seed layer for selective metal deposition |
US5264108A (en) * | 1992-09-08 | 1993-11-23 | The United States Of America As Represented By The United States Department Of Energy | Laser patterning of laminated structures for electroplating |
GB2336161B (en) * | 1998-04-06 | 2003-03-26 | John Michael Lowe | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
US6939447B2 (en) * | 1998-04-06 | 2005-09-06 | Tdao Limited | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
TW492103B (en) * | 2000-06-02 | 2002-06-21 | Koninkl Philips Electronics Nv | Electronic device, and method of patterning a first layer |
GB0303397D0 (en) * | 2003-02-14 | 2003-03-19 | Technology Dev Associate Opera | Electro-plating method and apparatus |
US8278220B2 (en) * | 2008-08-08 | 2012-10-02 | Fei Company | Method to direct pattern metals on a substrate |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3013955A (en) * | 1959-04-29 | 1961-12-19 | Fairchild Camera Instr Co | Method of transistor manufacture |
FR1295071A (fr) * | 1960-07-05 | 1962-06-01 | Siemens Ag | Procédé pour déposer par électrolyse des couches minces sur des supports |
NL284599A (fr) * | 1961-05-26 | 1900-01-01 | ||
US3345274A (en) * | 1964-04-22 | 1967-10-03 | Westinghouse Electric Corp | Method of making oxide film patterns |
GB1138401A (en) * | 1965-05-06 | 1969-01-01 | Mallory & Co Inc P R | Bonding |
-
1967
- 1967-02-14 US US616094A patent/US3506545A/en not_active Expired - Lifetime
-
1968
- 1968-01-10 FR FR1554956D patent/FR1554956A/fr not_active Expired
- 1968-01-23 GB GB3382/68A patent/GB1176889A/en not_active Expired
- 1968-02-12 DE DE1696075A patent/DE1696075C3/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB1176889A (en) | 1970-01-07 |
DE1696075C3 (de) | 1975-11-27 |
US3506545A (en) | 1970-04-14 |
DE1696075A1 (de) | 1971-11-18 |
DE1696075B2 (de) | 1975-04-03 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |