FR1553375A - - Google Patents

Info

Publication number
FR1553375A
FR1553375A FR1553375DA FR1553375A FR 1553375 A FR1553375 A FR 1553375A FR 1553375D A FR1553375D A FR 1553375DA FR 1553375 A FR1553375 A FR 1553375A
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1553375A publication Critical patent/FR1553375A/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
FR1553375D 1967-02-03 1968-02-02 Expired FR1553375A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DESC040172 1967-02-03

Publications (1)

Publication Number Publication Date
FR1553375A true FR1553375A (fr) 1969-01-10

Family

ID=7435543

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1553375D Expired FR1553375A (fr) 1967-02-03 1968-02-02

Country Status (3)

Country Link
DE (1) DE1621352C3 (fr)
FR (1) FR1553375A (fr)
GB (1) GB1203131A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2124331A1 (de) * 1970-05-21 1971-12-02 Shipley Co Wäßrige Lösung zum stromlosen Abscheiden von Kupfer
US3663242A (en) * 1970-09-25 1972-05-16 Shipley Co Stabilized electroless plating solutions

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4167601A (en) 1976-11-15 1979-09-11 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4228213A (en) 1979-08-13 1980-10-14 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
CN1003524B (zh) * 1985-10-14 1989-03-08 株式会社日立制作所 无电浸镀金溶液
AU579776B2 (en) * 1986-11-06 1988-12-08 Nippondenso Co. Ltd. Electroless copper plating solution and process for electrolessly plating copper
DE4202842C1 (en) * 1992-01-30 1993-01-14 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De Stable aq. copper complex for non-electrolytic deposition of copper@ - comprises copper(II) salt, 3-(bis(carboxy methyl)amino) propanoic acid as complexing agent, buffer and reducing agent

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2124331A1 (de) * 1970-05-21 1971-12-02 Shipley Co Wäßrige Lösung zum stromlosen Abscheiden von Kupfer
US3663242A (en) * 1970-09-25 1972-05-16 Shipley Co Stabilized electroless plating solutions

Also Published As

Publication number Publication date
DE1621352A1 (de) 1971-05-13
DE1621352C3 (de) 1975-05-28
GB1203131A (en) 1970-08-26
DE1621352B2 (de) 1974-10-03

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