FR1553301A - - Google Patents
Info
- Publication number
- FR1553301A FR1553301A FR1553301DA FR1553301A FR 1553301 A FR1553301 A FR 1553301A FR 1553301D A FR1553301D A FR 1553301DA FR 1553301 A FR1553301 A FR 1553301A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/491—Disposition
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- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/01006—Carbon [C]
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- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6701294A NL6701294A (hr) | 1967-01-27 | 1967-01-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1553301A true FR1553301A (hr) | 1969-01-10 |
Family
ID=19799151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1553301D Expired FR1553301A (hr) | 1967-01-27 | 1968-01-26 |
Country Status (7)
Country | Link |
---|---|
AT (1) | AT286416B (hr) |
BE (1) | BE709891A (hr) |
CH (1) | CH483774A (hr) |
DE (1) | DE1285581C2 (hr) |
FR (1) | FR1553301A (hr) |
GB (1) | GB1211412A (hr) |
NL (1) | NL6701294A (hr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0355424B1 (en) * | 1988-07-25 | 1995-02-15 | Asahi Glass Company Ltd. | Glass antenna device for an automobile |
US4933812A (en) * | 1989-10-11 | 1990-06-12 | Hewlett-Packard Company | Package and circuit arrangement for housing and connecting polarized electrical components and method of manufacture |
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1967
- 1967-01-27 NL NL6701294A patent/NL6701294A/xx unknown
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1968
- 1968-01-18 DE DE1968N0031981 patent/DE1285581C2/de not_active Expired
- 1968-01-24 CH CH115068A patent/CH483774A/de not_active IP Right Cessation
- 1968-01-24 AT AT71268A patent/AT286416B/de not_active IP Right Cessation
- 1968-01-24 GB GB3678/68A patent/GB1211412A/en not_active Expired
- 1968-01-25 BE BE709891D patent/BE709891A/xx unknown
- 1968-01-26 FR FR1553301D patent/FR1553301A/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
BE709891A (hr) | 1968-07-25 |
AT286416B (de) | 1970-12-10 |
NL6701294A (hr) | 1968-07-29 |
DE1285581C2 (de) | 1973-08-23 |
CH483774A (de) | 1969-12-31 |
DE1285581B (de) | 1968-12-19 |
GB1211412A (en) | 1970-11-04 |
Similar Documents
Legal Events
Date | Code | Title | Description |
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ST | Notification of lapse |