FR1553301A - - Google Patents
Info
- Publication number
- FR1553301A FR1553301A FR1553301DA FR1553301A FR 1553301 A FR1553301 A FR 1553301A FR 1553301D A FR1553301D A FR 1553301DA FR 1553301 A FR1553301 A FR 1553301A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07236—Soldering or alloying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07531—Techniques
- H10W72/07532—Compression bonding, e.g. thermocompression bonding
- H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL6701294A NL6701294A (OSRAM) | 1967-01-27 | 1967-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1553301A true FR1553301A (OSRAM) | 1969-01-10 |
Family
ID=19799151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1553301D Expired FR1553301A (OSRAM) | 1967-01-27 | 1968-01-26 |
Country Status (7)
| Country | Link |
|---|---|
| AT (1) | AT286416B (OSRAM) |
| BE (1) | BE709891A (OSRAM) |
| CH (1) | CH483774A (OSRAM) |
| DE (1) | DE1285581C2 (OSRAM) |
| FR (1) | FR1553301A (OSRAM) |
| GB (1) | GB1211412A (OSRAM) |
| NL (1) | NL6701294A (OSRAM) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0355424B1 (en) * | 1988-07-25 | 1995-02-15 | Asahi Glass Company Ltd. | Glass antenna device for an automobile |
| US4933812A (en) * | 1989-10-11 | 1990-06-12 | Hewlett-Packard Company | Package and circuit arrangement for housing and connecting polarized electrical components and method of manufacture |
-
1967
- 1967-01-27 NL NL6701294A patent/NL6701294A/xx unknown
-
1968
- 1968-01-18 DE DE1968N0031981 patent/DE1285581C2/de not_active Expired
- 1968-01-24 GB GB3678/68A patent/GB1211412A/en not_active Expired
- 1968-01-24 CH CH115068A patent/CH483774A/de not_active IP Right Cessation
- 1968-01-24 AT AT71268A patent/AT286416B/de not_active IP Right Cessation
- 1968-01-25 BE BE709891D patent/BE709891A/xx unknown
- 1968-01-26 FR FR1553301D patent/FR1553301A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE1285581B (de) | 1968-12-19 |
| GB1211412A (en) | 1970-11-04 |
| AT286416B (de) | 1970-12-10 |
| DE1285581C2 (de) | 1973-08-23 |
| BE709891A (OSRAM) | 1968-07-25 |
| CH483774A (de) | 1969-12-31 |
| NL6701294A (OSRAM) | 1968-07-29 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |