FR1509407A - Procédé de fabrication de billes de soudure sur des substrats - Google Patents

Procédé de fabrication de billes de soudure sur des substrats

Info

Publication number
FR1509407A
FR1509407A FR8303A FR06008303A FR1509407A FR 1509407 A FR1509407 A FR 1509407A FR 8303 A FR8303 A FR 8303A FR 06008303 A FR06008303 A FR 06008303A FR 1509407 A FR1509407 A FR 1509407A
Authority
FR
France
Prior art keywords
substrates
solder balls
manufacturing solder
manufacturing
balls
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8303A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of FR1509407A publication Critical patent/FR1509407A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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    • H01L2224/05572—Disposition the external layer being disposed in a recess of the surface the external layer extending out of an opening
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    • H01L2224/05644—Gold [Au] as principal constituent
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    • H01L2224/1147—Manufacturing methods using a lift-off mask
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    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
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    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
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    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Coating With Molten Metal (AREA)
  • Ceramic Products (AREA)
FR8303A 1966-01-20 1967-01-16 Procédé de fabrication de billes de soudure sur des substrats Expired FR1509407A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52198866A 1966-01-20 1966-01-20

Publications (1)

Publication Number Publication Date
FR1509407A true FR1509407A (fr) 1968-01-12

Family

ID=24078966

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8303A Expired FR1509407A (fr) 1966-01-20 1967-01-16 Procédé de fabrication de billes de soudure sur des substrats

Country Status (8)

Country Link
US (1) US3458925A (US20030157376A1-20030821-M00001.png)
BE (1) BE692824A (US20030157376A1-20030821-M00001.png)
CH (1) CH447300A (US20030157376A1-20030821-M00001.png)
DE (1) DE1300788C2 (US20030157376A1-20030821-M00001.png)
ES (1) ES335777A1 (US20030157376A1-20030821-M00001.png)
FR (1) FR1509407A (US20030157376A1-20030821-M00001.png)
GB (1) GB1097898A (US20030157376A1-20030821-M00001.png)
NL (1) NL157145B (US20030157376A1-20030821-M00001.png)

Cited By (1)

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US3719981A (en) * 1971-11-24 1973-03-13 Rca Corp Method of joining solder balls to solder bumps
US3894329A (en) * 1972-07-28 1975-07-15 Sperry Rand Corp Method of making high density electronic interconnections in a termination device
US3869787A (en) * 1973-01-02 1975-03-11 Honeywell Inf Systems Method for precisely aligning circuit devices coarsely positioned on a substrate
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US4032058A (en) * 1973-06-29 1977-06-28 Ibm Corporation Beam-lead integrated circuit structure and method for making the same including automatic registration of beam-leads with corresponding dielectric substrate leads
US3881884A (en) * 1973-10-12 1975-05-06 Ibm Method for the formation of corrosion resistant electronic interconnections
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US4505029A (en) * 1981-03-23 1985-03-19 General Electric Company Semiconductor device with built-up low resistance contact
EP0111611B1 (fr) * 1982-10-28 1987-05-13 International Business Machines Corporation Perfectionnements aux procédés et équipements de dépôt par évaporation sous vide mettant en oeuvre un canon à électrons
US4545610A (en) * 1983-11-25 1985-10-08 International Business Machines Corporation Method for forming elongated solder connections between a semiconductor device and a supporting substrate
IT1215268B (it) * 1985-04-26 1990-01-31 Ates Componenti Elettron Apparecchio e metodo per il confezionamento perfezionato di dispositivi semiconduttori.
US4742023A (en) * 1986-08-28 1988-05-03 Fujitsu Limited Method for producing a semiconductor device
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US5198695A (en) * 1990-12-10 1993-03-30 Westinghouse Electric Corp. Semiconductor wafer with circuits bonded to a substrate
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US5316788A (en) * 1991-07-26 1994-05-31 International Business Machines Corporation Applying solder to high density substrates
US5203075A (en) * 1991-08-12 1993-04-20 Inernational Business Machines Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
US5133495A (en) * 1991-08-12 1992-07-28 International Business Machines Corporation Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween
US5186383A (en) * 1991-10-02 1993-02-16 Motorola, Inc. Method for forming solder bump interconnections to a solder-plated circuit trace
US5281684A (en) * 1992-04-30 1994-01-25 Motorola, Inc. Solder bumping of integrated circuit die
JP2796919B2 (ja) * 1992-05-11 1998-09-10 インターナショナル・ビジネス・マシーンズ・コーポレーション メタライゼーション複合体および半導体デバイス
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BE692824A (US20030157376A1-20030821-M00001.png) 1967-07-03
NL6700992A (US20030157376A1-20030821-M00001.png) 1967-07-21
ES335777A1 (es) 1967-12-01
US3458925A (en) 1969-08-05
DE1300788C2 (de) 1974-11-21
DE1300788B (US20030157376A1-20030821-M00001.png) 1974-11-21
GB1097898A (en) 1968-01-03
CH447300A (de) 1967-11-30
NL157145B (nl) 1978-06-15

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