FR1471243A - Perfectionnements aux dispositifs semi-conducteurs enrobés dans un revêtement protecteur isolant moulé - Google Patents

Perfectionnements aux dispositifs semi-conducteurs enrobés dans un revêtement protecteur isolant moulé

Info

Publication number
FR1471243A
FR1471243A FR46504A FR46504A FR1471243A FR 1471243 A FR1471243 A FR 1471243A FR 46504 A FR46504 A FR 46504A FR 46504 A FR46504 A FR 46504A FR 1471243 A FR1471243 A FR 1471243A
Authority
FR
France
Prior art keywords
enhancements
semiconductor devices
protective coating
insulating protective
molded insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR46504A
Other languages
English (en)
Inventor
Jean-Pierre Rioult
Dominique Henri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique SA
Original Assignee
Radiotechnique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique SA filed Critical Radiotechnique SA
Priority to FR46504A priority Critical patent/FR1471243A/fr
Application granted granted Critical
Publication of FR1471243A publication Critical patent/FR1471243A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
FR46504A 1966-01-19 1966-01-19 Perfectionnements aux dispositifs semi-conducteurs enrobés dans un revêtement protecteur isolant moulé Expired FR1471243A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR46504A FR1471243A (fr) 1966-01-19 1966-01-19 Perfectionnements aux dispositifs semi-conducteurs enrobés dans un revêtement protecteur isolant moulé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR46504A FR1471243A (fr) 1966-01-19 1966-01-19 Perfectionnements aux dispositifs semi-conducteurs enrobés dans un revêtement protecteur isolant moulé

Publications (1)

Publication Number Publication Date
FR1471243A true FR1471243A (fr) 1967-03-03

Family

ID=8599189

Family Applications (1)

Application Number Title Priority Date Filing Date
FR46504A Expired FR1471243A (fr) 1966-01-19 1966-01-19 Perfectionnements aux dispositifs semi-conducteurs enrobés dans un revêtement protecteur isolant moulé

Country Status (1)

Country Link
FR (1) FR1471243A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2429494A1 (fr) * 1978-06-21 1980-01-18 Materiel Telephonique Microboitier pour dispositif semi-conducteur, son procede de fabrication en serie
EP0794560A2 (fr) * 1996-03-08 1997-09-10 Nec Corporation Procédé pour la production d'un dispositif semi-conducteur isolé

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2429494A1 (fr) * 1978-06-21 1980-01-18 Materiel Telephonique Microboitier pour dispositif semi-conducteur, son procede de fabrication en serie
EP0794560A2 (fr) * 1996-03-08 1997-09-10 Nec Corporation Procédé pour la production d'un dispositif semi-conducteur isolé
EP0794560A3 (fr) * 1996-03-08 1998-03-18 Nec Corporation Procédé pour la production d'un dispositif semi-conducteur isolé

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