FR1454374A - Procédé de fabrication d'un corps comportant une jonction entre deux matériaux différents - Google Patents

Procédé de fabrication d'un corps comportant une jonction entre deux matériaux différents

Info

Publication number
FR1454374A
FR1454374A FR39105A FR39105A FR1454374A FR 1454374 A FR1454374 A FR 1454374A FR 39105 A FR39105 A FR 39105A FR 39105 A FR39105 A FR 39105A FR 1454374 A FR1454374 A FR 1454374A
Authority
FR
France
Prior art keywords
radiation
bonds
parts
semi
vacuo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR39105A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of FR1454374A publication Critical patent/FR1454374A/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/001—Joining in special atmospheres
    • B29C66/0012—Joining in special atmospheres characterised by the type of environment
    • B29C66/0016—Liquid environments, i.e. the parts to be joined being submerged in a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1435—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/001—Joining in special atmospheres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/001—Joining in special atmospheres
    • B29C66/0012—Joining in special atmospheres characterised by the type of environment
    • B29C66/0014—Gaseous environments
    • B29C66/00143—Active gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/03—After-treatments in the joint area
    • B29C66/034—Thermal after-treatments
    • B29C66/0342—Cooling, e.g. transporting through welding and cooling zone
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
    • H10P10/128—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates by direct semiconductor to semiconductor bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1619—Mid infrared radiation [MIR], e.g. by CO or CO2 lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/001—Joining in special atmospheres
    • B29C66/0012—Joining in special atmospheres characterised by the type of environment
    • B29C66/0014—Gaseous environments
    • B29C66/00141—Protective gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/024—Thermal pre-treatments
    • B29C66/0242—Heating, or preheating, e.g. drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/026—Chemical pre-treatments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005—Conductive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/049—Equivalence and options
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/072—Heterojunctions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/093—Laser beam treatment in general

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
FR39105A 1964-11-19 1965-11-19 Procédé de fabrication d'un corps comportant une jonction entre deux matériaux différents Expired FR1454374A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6413441A NL6413441A (OSRAM) 1964-11-19 1964-11-19

Publications (1)

Publication Number Publication Date
FR1454374A true FR1454374A (fr) 1966-09-30

Family

ID=19791470

Family Applications (1)

Application Number Title Priority Date Filing Date
FR39105A Expired FR1454374A (fr) 1964-11-19 1965-11-19 Procédé de fabrication d'un corps comportant une jonction entre deux matériaux différents

Country Status (6)

Country Link
US (1) US3424890A (OSRAM)
JP (1) JPS4825816B1 (OSRAM)
DE (1) DE1540991A1 (OSRAM)
FR (1) FR1454374A (OSRAM)
GB (1) GB1051397A (OSRAM)
NL (1) NL6413441A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0069453A1 (en) * 1981-06-01 1983-01-12 Texas Instruments Incorporated A process for forming semiconductor alloys having a desired bandgap

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1242123A (en) * 1968-11-12 1971-08-11 Nat Res Dev Improvements relating to a method and apparatus for laser beam cutting
US3603847A (en) * 1969-06-11 1971-09-07 Us Air Force Schottky barrier photodiode with a degenerate semiconductor active region
US3751723A (en) * 1972-03-01 1973-08-07 Sprague Electric Co Hot carrier metal base transistor having a p-type emitter and an n-type collector
US4023005A (en) * 1975-04-21 1977-05-10 Raytheon Company Laser welding high reflectivity metals
US4261764A (en) * 1979-10-01 1981-04-14 The United States Of America As Represented By The United States Department Of Energy Laser method for forming low-resistance ohmic contacts on semiconducting oxides
US4318752A (en) * 1980-05-16 1982-03-09 Bell Telephone Laboratories, Incorporated Heterojunction semiconductor laser fabrication utilizing laser radiation
DE3032461A1 (de) * 1980-08-28 1982-04-01 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von legierten metallkontaktschichten auf kristallorientierten halbleiteroberflaechen mittels energiepulsbestrahlung
DE3036260A1 (de) 1980-09-26 1982-04-29 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur herstellung von elektrischen kontakten an einer silizium-solarzelle
US4448632A (en) * 1981-05-25 1984-05-15 Mitsubishi Denki Kabushiki Kaisha Method of fabricating semiconductor devices
US4374678A (en) * 1981-06-01 1983-02-22 Texas Instruments Incorporated Process for forming HgCoTe alloys selectively by IR illumination
US4424435A (en) 1981-09-11 1984-01-03 Itek Corporation Low expansion laser welding arrangement
DE3310373A1 (de) * 1983-03-22 1984-10-11 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von lichtemittierenden dioden
DE3310362A1 (de) * 1983-03-22 1984-10-11 Siemens AG, 1000 Berlin und 8000 München Verfahren zur veraenderung der optischen eigenschaft der grenzflaeche zwischen halbleitermaterial und metallkontakt
US4560853A (en) * 1984-01-12 1985-12-24 Rca Corporation Positioning and bonding a diamond to a stylus shank
JPS60214929A (ja) * 1984-04-09 1985-10-28 Toyota Motor Corp 異種合成樹脂材料の接合方法
EP0159169A3 (en) * 1984-04-09 1987-07-01 Toyota Jidosha Kabushiki Kaisha A process for joining different kinds of synthetic resins
FR2576836B1 (fr) * 1985-02-05 1989-10-27 Dupuy Eng Sa Procede et dispositif pour le rainurage par laser de feuilles de matiere plastique
NL8600216A (nl) * 1986-01-30 1987-08-17 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting.
FR2624041A1 (fr) * 1987-12-02 1989-06-09 Otic Fischer & Porter Procede de soudage au moyen d'un faisceau laser, notamment applicable au soudage de pieces en verre
US5893959A (en) * 1994-03-31 1999-04-13 Marquardt Gmbh Workpiece of plastic and production process for such a workpiece
DE19640594B4 (de) * 1996-10-01 2016-08-04 Osram Gmbh Bauelement
JPH11179565A (ja) * 1997-12-19 1999-07-06 Komatsu Ltd 半導体材料の溶接方法
DE19832168A1 (de) * 1998-07-17 2000-01-20 Lisa Laser Products Ohg Fuhrbe Verfahren und Vorrichtung zum Schweißen von thermoplastischen Kunststoffen mit Laserlicht
US20040056006A1 (en) * 1998-10-01 2004-03-25 The Welding Institute Welding method
DE19919428C2 (de) 1999-04-28 2001-12-06 Tyco Electronics Logistics Ag Kunststoff-Ferrule für einen Lichtwellenleiter und Verfahren zum Befestigen einer Ferrule an einem Lichtwellenleiter
US6220673B1 (en) * 1999-07-12 2001-04-24 Colgate-Palmolive Company Laser joining toothbrush heads to handles
EP1341668A2 (en) * 2000-11-10 2003-09-10 Gentex Corporation Visibly transparent dyes for through-transmission laser welding
FR2822295B1 (fr) * 2001-03-16 2004-06-25 Edouard Serras Generateur thermoelectrique a semi-conducteurs et ses procedes de fabrication
US6752893B2 (en) * 2001-09-28 2004-06-22 Gentex Corporation Rimless spectacles and method for making the same
US7201963B2 (en) * 2002-01-15 2007-04-10 Gentex Corporation Pre-processed workpiece having a surface deposition of absorber dye rendering the workpiece weld-enabled
DE10232727A1 (de) * 2002-07-16 2004-02-05 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Fügen von Kunststoffbauteilen mittels Laserstrahlung
US7538295B2 (en) * 2005-04-21 2009-05-26 Hewlett-Packard Development Company, L.P. Laser welding system
US9787345B2 (en) * 2014-03-31 2017-10-10 Apple Inc. Laser welding of transparent and opaque materials
US10200516B2 (en) 2014-08-28 2019-02-05 Apple Inc. Interlocking ceramic and optical members
DE102020115878A1 (de) 2020-06-16 2021-12-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren und System zum Laserschweißen eines Halbleitermaterials

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2743201A (en) * 1952-04-29 1956-04-24 Hughes Aircraft Co Monatomic semiconductor devices
US3265855A (en) * 1963-04-01 1966-08-09 Gen Electric Method and apparatus for drilling small holes
US3229095A (en) * 1963-05-20 1966-01-11 Ibm Apparatus for obtaining the difference of two incident optical radiations
US3304403A (en) * 1963-10-14 1967-02-14 Texas Instruments Inc Laser welding of contacts
US3369101A (en) * 1964-04-30 1968-02-13 United Aircraft Corp Laser micro-processer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0069453A1 (en) * 1981-06-01 1983-01-12 Texas Instruments Incorporated A process for forming semiconductor alloys having a desired bandgap

Also Published As

Publication number Publication date
JPS4825816B1 (OSRAM) 1973-08-01
DE1540991A1 (de) 1970-02-19
NL6413441A (OSRAM) 1966-05-20
US3424890A (en) 1969-01-28
GB1051397A (OSRAM) 1966-12-14

Similar Documents

Publication Publication Date Title
GB1051397A (OSRAM)
US5185295A (en) Method for dicing semiconductor substrates using a laser scribing and dual etch process
FR2279306B1 (OSRAM)
FR2142073B1 (OSRAM)
EP0028737A3 (en) Method for high efficiency gettering contaminants and defects in a semiconductor body
US3538597A (en) Flatpack lid and method
US2966434A (en) Semi-conductor devices
EP0079484A3 (en) Laser process for gettering defects in semiconductor devices
GB1083172A (en) Semiconductive devices and methods of making them
GB1487201A (en) Method of manufacturing semi-conductor devices
ES354654A1 (es) Metodo para la difusion de cinc en arseniuro de gelio.
US3303549A (en) Method of making semiconductor devices utilizing vacuum welding
GB1383960A (en) Semiconductor laser
GB1006803A (en) Improvements in or relating to semiconductor devices
US3590338A (en) Light activated semiconductor device
GB1295775A (OSRAM)
GB1114367A (en) Attachment of leads to semiconductors
US3680199A (en) Alloying method
US3041509A (en) Semiconductor device
NL6703972A (OSRAM)
FR1457203A (fr) Procédé de fabrication de semi-conducteurs
GB807728A (en) Semi-conductor translating devices and method of manufacturing the same
US2996801A (en) Method of forming an hermetic seal
GB1365403A (en) Method of fabrication of a composite product made up at least two components of different materials
GB1003482A (en) Improvements in and relating to methods of joining a metal conductor to a semiconduct or body