FR1378052A - Procédé de fabrication de composants ou de groupes de composants électriques ou électroniques - Google Patents

Procédé de fabrication de composants ou de groupes de composants électriques ou électroniques

Info

Publication number
FR1378052A
FR1378052A FR940261A FR940261A FR1378052A FR 1378052 A FR1378052 A FR 1378052A FR 940261 A FR940261 A FR 940261A FR 940261 A FR940261 A FR 940261A FR 1378052 A FR1378052 A FR 1378052A
Authority
FR
France
Prior art keywords
components
groups
electrical
manufacturing process
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR940261A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens and Halske AG
Siemens Corp
Original Assignee
Siemens and Halske AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens and Halske AG, Siemens Corp filed Critical Siemens and Halske AG
Application granted granted Critical
Publication of FR1378052A publication Critical patent/FR1378052A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H10P95/00—
    • H10W20/40—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Vapour Deposition (AREA)
FR940261A 1962-07-20 1963-07-03 Procédé de fabrication de composants ou de groupes de composants électriques ou électroniques Expired FR1378052A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1962S0080503 DE1165700C2 (de) 1962-07-20 1962-07-20 Verfahren zum Herstellen von Bauelementen oder Baugruppen

Publications (1)

Publication Number Publication Date
FR1378052A true FR1378052A (fr) 1964-11-13

Family

ID=7508916

Family Applications (1)

Application Number Title Priority Date Filing Date
FR940261A Expired FR1378052A (fr) 1962-07-20 1963-07-03 Procédé de fabrication de composants ou de groupes de composants électriques ou électroniques

Country Status (5)

Country Link
CH (1) CH443427A (enExample)
DE (1) DE1165700C2 (enExample)
FR (1) FR1378052A (enExample)
GB (1) GB978984A (enExample)
NL (1) NL294779A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4100313A (en) * 1975-10-28 1978-07-11 Rca Corporation Process for forming an optical waveguide
US4301191A (en) * 1974-10-25 1981-11-17 U.S. Philips Corporation Method of providing a conductor layer pattern having parts which are present at a small separation in the manufacture of semiconductor devices
EP0118576A1 (en) * 1983-03-11 1984-09-19 Hitachi, Ltd. Method for forming thin films

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54103552A (en) * 1978-02-01 1979-08-15 Hitachi Electronics Pattern formation method
US4469719A (en) * 1981-12-21 1984-09-04 Applied Magnetics-Magnetic Head Divison Corporation Method for controlling the edge gradient of a layer of deposition material
US4536419A (en) * 1983-03-10 1985-08-20 Hitachi, Ltd. Method for forming tapered films
DE102017105379A1 (de) 2017-03-14 2018-09-20 Aixtron Se Substrathalteranordnung mit Maskenträger
DE102017105374A1 (de) * 2017-03-14 2018-09-20 Aixtron Se Vorrichtung zum Abscheiden einer strukturierten Schicht auf einem Substrat sowie Verfahren zum Einrichten der Vorrichtung
CN111479947A (zh) * 2017-12-29 2020-07-31 微软技术许可有限责任公司 使用通过被定位的阴影掩模进行气相沉积的制造工艺

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4301191A (en) * 1974-10-25 1981-11-17 U.S. Philips Corporation Method of providing a conductor layer pattern having parts which are present at a small separation in the manufacture of semiconductor devices
US4100313A (en) * 1975-10-28 1978-07-11 Rca Corporation Process for forming an optical waveguide
EP0118576A1 (en) * 1983-03-11 1984-09-19 Hitachi, Ltd. Method for forming thin films

Also Published As

Publication number Publication date
NL294779A (enExample)
GB978984A (en) 1965-01-01
DE1165700B (de) 1964-03-19
DE1165700C2 (de) 1964-09-24
CH443427A (de) 1967-09-15

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