FR1304958A - Procédé de fabrication d'éléments électriques - Google Patents

Procédé de fabrication d'éléments électriques

Info

Publication number
FR1304958A
FR1304958A FR877851A FR877851A FR1304958A FR 1304958 A FR1304958 A FR 1304958A FR 877851 A FR877851 A FR 877851A FR 877851 A FR877851 A FR 877851A FR 1304958 A FR1304958 A FR 1304958A
Authority
FR
France
Prior art keywords
manufacturing process
electrical elements
electrical
elements
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR877851A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to AT779161A priority Critical patent/AT228301B/de
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Priority to FR877851A priority patent/FR1304958A/fr
Application granted granted Critical
Publication of FR1304958A publication Critical patent/FR1304958A/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K3/00Details of windings
    • H02K3/04Windings characterised by the conductor shape, form or construction, e.g. with bar conductors
    • H02K3/26Windings characterised by the conductor shape, form or construction, e.g. with bar conductors consisting of printed conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0382Continuously deformed conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108Male die used for patterning, punching or transferring
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0369Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0562Details of resist
    • H05K2203/0597Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1476Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
FR877851A 1961-11-03 1961-11-03 Procédé de fabrication d'éléments électriques Expired FR1304958A (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AT779161A AT228301B (de) 1961-11-03 Verfahren zum Herstellen von Bauelementen mit elektrischen Leiterzügen
FR877851A FR1304958A (fr) 1961-11-03 1961-11-03 Procédé de fabrication d'éléments électriques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR877851A FR1304958A (fr) 1961-11-03 1961-11-03 Procédé de fabrication d'éléments électriques

Publications (1)

Publication Number Publication Date
FR1304958A true FR1304958A (fr) 1962-09-28

Family

ID=8765958

Family Applications (1)

Application Number Title Priority Date Filing Date
FR877851A Expired FR1304958A (fr) 1961-11-03 1961-11-03 Procédé de fabrication d'éléments électriques

Country Status (2)

Country Link
AT (1) AT228301B (fr)
FR (1) FR1304958A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2213614A2 (fr) * 1973-01-05 1974-08-02 Ragonot Ets

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014119386B4 (de) * 2014-12-22 2019-04-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines Metall-Keramik-Substrates und zugehöriges Metall-Keramik-Substrat

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2213614A2 (fr) * 1973-01-05 1974-08-02 Ragonot Ets

Also Published As

Publication number Publication date
AT228301B (de)

Similar Documents

Publication Publication Date Title
BE625351A (fr) Procédé de fabrication de polyuréthanes
FR1312868A (fr) Microcapsules et leur procédé de fabrication
FR1241461A (fr) Procédé de fabrication d'électrodes frittées
BE613596A (fr) Procédé de fabrication d'éléments conducteurs de l'électricité
FR1509909A (fr) Procédé de fabrication de 3-hydroxy-benzisoxazoles
FR1512313A (fr) Procédé de fabrication de fluorostéroïdes
FR1304958A (fr) Procédé de fabrication d'éléments électriques
CH415590A (fr) Procédé de fabrication d'un anti-oxygène
FR1309935A (fr) Procédé de fabrication d'éléments tubulaires extrudés
FR1316069A (fr) Procédé de fabrication d'éléments conducteurs de l'électricité
FR1344345A (fr) Procédé de fabrication d'oxiranes
FR1395525A (fr) Procédé de fabrication de nu, nu-dialcoyl-2-éthyl-3, 3-diphénylpropène-(2)-yl-amnes
FR1300998A (fr) Procédé de fabrication d'éléments en béton
BE613546A (fr) Procédé de fabrication d'éléments superconducteurs
FR1303108A (fr) Procédé de fabrication d'organes électriques
FR1288301A (fr) Procédé de fabrication d'éponges artificielles
FR1268691A (fr) Procédé de fabrication d'éléments semi-conducteurs
FR1458907A (fr) Procédé de fabrication de n-arylsulfonyl-n'-hexaméthylèneiminourée
FR82949E (fr) Procédé de fabrication d'éléments électriques
FR1314500A (fr) Procédé de fabrication d'acylhydrazinonaphtalènes
BE610867A (fr) Procédé de fabrication d'acylhydrazinonaphtalènes
FR1284985A (fr) Procédé de fabrication d'électrodes
FR1357894A (fr) Procédé de fabrication d'oxathiazolinones
FR78029E (fr) Procédé de fabrication d'électrodes frittées
FR1345001A (fr) Procédé de fabrication des n-chloroalkyloxazolidones-(2)