FR1378052A - Manufacturing process of components or groups of electrical or electronic components - Google Patents
Manufacturing process of components or groups of electrical or electronic componentsInfo
- Publication number
- FR1378052A FR1378052A FR940261A FR940261A FR1378052A FR 1378052 A FR1378052 A FR 1378052A FR 940261 A FR940261 A FR 940261A FR 940261 A FR940261 A FR 940261A FR 1378052 A FR1378052 A FR 1378052A
- Authority
- FR
- France
- Prior art keywords
- components
- groups
- electrical
- manufacturing process
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/143—Masks therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1962S0080503 DE1165700C2 (en) | 1962-07-20 | 1962-07-20 | Process for manufacturing components or assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1378052A true FR1378052A (en) | 1964-11-13 |
Family
ID=7508916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR940261A Expired FR1378052A (en) | 1962-07-20 | 1963-07-03 | Manufacturing process of components or groups of electrical or electronic components |
Country Status (5)
Country | Link |
---|---|
CH (1) | CH443427A (en) |
DE (1) | DE1165700C2 (en) |
FR (1) | FR1378052A (en) |
GB (1) | GB978984A (en) |
NL (1) | NL294779A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4100313A (en) * | 1975-10-28 | 1978-07-11 | Rca Corporation | Process for forming an optical waveguide |
US4301191A (en) * | 1974-10-25 | 1981-11-17 | U.S. Philips Corporation | Method of providing a conductor layer pattern having parts which are present at a small separation in the manufacture of semiconductor devices |
EP0118576A1 (en) * | 1983-03-11 | 1984-09-19 | Hitachi, Ltd. | Method for forming thin films |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54103552A (en) * | 1978-02-01 | 1979-08-15 | Hitachi Electronics | Pattern formation method |
US4469719A (en) * | 1981-12-21 | 1984-09-04 | Applied Magnetics-Magnetic Head Divison Corporation | Method for controlling the edge gradient of a layer of deposition material |
US4536419A (en) * | 1983-03-10 | 1985-08-20 | Hitachi, Ltd. | Method for forming tapered films |
DE102017105379A1 (en) | 2017-03-14 | 2018-09-20 | Aixtron Se | Substrate holder arrangement with mask carrier |
DE102017105374A1 (en) * | 2017-03-14 | 2018-09-20 | Aixtron Se | Device for depositing a structured layer on a substrate and method for setting up the device |
US11629430B2 (en) | 2017-12-29 | 2023-04-18 | Microsoft Technology Licensing, Llc | Fabrication process using vapour deposition through a positioned shadow mask |
-
0
- NL NL294779D patent/NL294779A/xx unknown
-
1962
- 1962-07-20 DE DE1962S0080503 patent/DE1165700C2/en not_active Expired
-
1963
- 1963-06-17 CH CH749663A patent/CH443427A/en unknown
- 1963-07-03 FR FR940261A patent/FR1378052A/en not_active Expired
- 1963-07-19 GB GB2867963A patent/GB978984A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4301191A (en) * | 1974-10-25 | 1981-11-17 | U.S. Philips Corporation | Method of providing a conductor layer pattern having parts which are present at a small separation in the manufacture of semiconductor devices |
US4100313A (en) * | 1975-10-28 | 1978-07-11 | Rca Corporation | Process for forming an optical waveguide |
EP0118576A1 (en) * | 1983-03-11 | 1984-09-19 | Hitachi, Ltd. | Method for forming thin films |
Also Published As
Publication number | Publication date |
---|---|
GB978984A (en) | 1965-01-01 |
CH443427A (en) | 1967-09-15 |
DE1165700B (en) | 1964-03-19 |
DE1165700C2 (en) | 1964-09-24 |
NL294779A (en) |
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