FR1340092A - Procédé pour assembler un conducteur métallique à un corps semi-conducteur - Google Patents

Procédé pour assembler un conducteur métallique à un corps semi-conducteur

Info

Publication number
FR1340092A
FR1340092A FR917359A FR917359A FR1340092A FR 1340092 A FR1340092 A FR 1340092A FR 917359 A FR917359 A FR 917359A FR 917359 A FR917359 A FR 917359A FR 1340092 A FR1340092 A FR 1340092A
Authority
FR
France
Prior art keywords
assembling
semiconductor body
metallic conductor
conductor
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR917359A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of FR1340092A publication Critical patent/FR1340092A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/485—Material
    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
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    • H01L2224/485—Material
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
FR917359A 1961-12-04 1962-12-03 Procédé pour assembler un conducteur métallique à un corps semi-conducteur Expired FR1340092A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE487257 1961-12-04

Publications (1)

Publication Number Publication Date
FR1340092A true FR1340092A (fr) 1963-10-11

Family

ID=3844623

Family Applications (1)

Application Number Title Priority Date Filing Date
FR917359A Expired FR1340092A (fr) 1961-12-04 1962-12-03 Procédé pour assembler un conducteur métallique à un corps semi-conducteur

Country Status (4)

Country Link
AT (1) AT239854B (fr)
FR (1) FR1340092A (fr)
GB (1) GB1003482A (fr)
NL (1) NL286149A (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3641524A1 (de) * 1985-12-10 1987-06-11 Mitsubishi Electric Corp Verfahren zur herstellung eines halbleiterbauelements
JPH0817189B2 (ja) * 1989-01-13 1996-02-21 三菱電機株式会社 半導体装置の製造方法
JP4551074B2 (ja) * 2003-10-07 2010-09-22 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4913874B2 (ja) * 2010-01-18 2012-04-11 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物および半導体装置

Also Published As

Publication number Publication date
GB1003482A (en) 1965-09-02
AT239854B (de) 1965-04-26
NL286149A (fr) 1900-01-01

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