FR1230674A - Procédé de fermeture hermétique d'une enveloppe renfermant un corps en matière semi-conductrice - Google Patents

Procédé de fermeture hermétique d'une enveloppe renfermant un corps en matière semi-conductrice

Info

Publication number
FR1230674A
FR1230674A FR793158A FR793158A FR1230674A FR 1230674 A FR1230674 A FR 1230674A FR 793158 A FR793158 A FR 793158A FR 793158 A FR793158 A FR 793158A FR 1230674 A FR1230674 A FR 1230674A
Authority
FR
France
Prior art keywords
semiconductor material
hermetically sealing
envelope containing
envelope
hermetically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR793158A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Edison Swan Ltd
Original Assignee
Siemens Edison Swan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Edison Swan Ltd filed Critical Siemens Edison Swan Ltd
Application granted granted Critical
Publication of FR1230674A publication Critical patent/FR1230674A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/20—Seals between parts of vessels
    • H01J5/22—Vacuum-tight joints between parts of vessel
    • H01J5/28—Vacuum-tight joints between parts of vessel between conductive parts of vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00—Discharge tubes and lamps
    • H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0037—Solid sealing members other than lamp bases
    • H01J2893/0044—Direct connection between two metal elements, in particular via material a connecting material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
FR793158A 1958-04-24 1959-04-24 Procédé de fermeture hermétique d'une enveloppe renfermant un corps en matière semi-conductrice Expired FR1230674A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1305458A GB852555A (en) 1958-04-24 1958-04-24 Improvements relating to the production of hermetically sealed casings for semi-conductor devices

Publications (1)

Publication Number Publication Date
FR1230674A true FR1230674A (fr) 1960-09-19

Family

ID=10015951

Family Applications (1)

Application Number Title Priority Date Filing Date
FR793158A Expired FR1230674A (fr) 1958-04-24 1959-04-24 Procédé de fermeture hermétique d'une enveloppe renfermant un corps en matière semi-conductrice

Country Status (4)

Country Link
DE (1) DE1114252B (enrdf_load_stackoverflow)
FR (1) FR1230674A (enrdf_load_stackoverflow)
GB (1) GB852555A (enrdf_load_stackoverflow)
NL (1) NL238557A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3254402A (en) * 1962-05-09 1966-06-07 Cavitron Ultrasonics Inc Method and apparatus for joining sheet materials

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE932336C (de) * 1943-10-10 1955-08-29 Messerschmitt Boelkow Blohm Verfahren zur Herstellen von Verbundmetallwerkstuecken
BE541624A (enrdf_load_stackoverflow) * 1954-08-23 1900-01-01
DE1048358B (enrdf_load_stackoverflow) * 1955-08-12 1959-01-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3254402A (en) * 1962-05-09 1966-06-07 Cavitron Ultrasonics Inc Method and apparatus for joining sheet materials

Also Published As

Publication number Publication date
DE1114252B (de) 1961-09-28
GB852555A (en) 1960-10-26
NL238557A (enrdf_load_stackoverflow)

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