FR1114786A - Fabrication de corps semi-conducteurs - Google Patents

Fabrication de corps semi-conducteurs

Info

Publication number
FR1114786A
FR1114786A FR1114786DA FR1114786A FR 1114786 A FR1114786 A FR 1114786A FR 1114786D A FR1114786D A FR 1114786DA FR 1114786 A FR1114786 A FR 1114786A
Authority
FR
France
Prior art keywords
manufacture
semiconductor bodies
bodies
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of FR1114786A publication Critical patent/FR1114786A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/223—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/049—Equivalence and options

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Photovoltaic Devices (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
FR1114786D 1954-03-05 1954-12-06 Fabrication de corps semi-conducteurs Expired FR1114786A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US414272A US3015590A (en) 1954-03-05 1954-03-05 Method of forming semiconductive bodies

Publications (1)

Publication Number Publication Date
FR1114786A true FR1114786A (fr) 1956-04-17

Family

ID=23640727

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1114786D Expired FR1114786A (fr) 1954-03-05 1954-12-06 Fabrication de corps semi-conducteurs

Country Status (7)

Country Link
US (1) US3015590A (fr)
JP (1) JPS306984B1 (fr)
BE (1) BE536122A (fr)
CH (1) CH341571A (fr)
FR (1) FR1114786A (fr)
GB (1) GB782662A (fr)
NL (1) NL193073A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1085969B (de) * 1958-09-23 1960-07-28 Siemens Ag Verfahren und Vorrichtung zur Oberflaechenbehandlung von Halbleiterbauelementen mit mehreren Elektroden und mindestens einem pn-UEbergang

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3150999A (en) * 1961-02-17 1964-09-29 Transitron Electronic Corp Radiant energy transducer
US3152926A (en) * 1961-04-18 1964-10-13 Tung Sol Electric Inc Photoelectric transducer
DE1138481C2 (de) * 1961-06-09 1963-05-22 Siemens Ag Verfahren zur Herstellung von Halbleiteranordnungen durch einkristalline Abscheidung von Halbleitermaterial aus der Gasphase
US3298880A (en) * 1962-08-24 1967-01-17 Hitachi Ltd Method of producing semiconductor devices
US3215571A (en) * 1962-10-01 1965-11-02 Bell Telephone Labor Inc Fabrication of semiconductor bodies
NL6407230A (fr) * 1963-09-28 1965-03-29
US3295030A (en) * 1963-12-18 1966-12-27 Signetics Corp Field effect transistor and method
US3418170A (en) * 1964-09-09 1968-12-24 Air Force Usa Solar cell panels from nonuniform dendrites
US3484314A (en) * 1967-02-23 1969-12-16 Itt Water vapor control in vapor-solid diffusion of boron
US4135950A (en) * 1975-09-22 1979-01-23 Communications Satellite Corporation Radiation hardened solar cell
US4360701A (en) * 1981-05-15 1982-11-23 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Heat transparent high intensity high efficiency solar cell
JPH0624200B2 (ja) * 1989-04-28 1994-03-30 信越半導体株式会社 半導体デバイス用基板の加工方法
US4994420A (en) * 1989-10-12 1991-02-19 Dow Corning Corporation Method for forming ceramic materials, including superconductors
US5258077A (en) * 1991-09-13 1993-11-02 Solec International, Inc. High efficiency silicon solar cells and method of fabrication
EP0631301A1 (fr) * 1993-06-21 1994-12-28 eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Procédé pour la fabrication d'un dispositif de puissance à semi-conducteur pour hautes pentes de commutation

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1774410A (en) * 1925-10-05 1930-08-26 Philips Nv Process of precipitating boron
US2441603A (en) * 1943-07-28 1948-05-18 Bell Telephone Labor Inc Electrical translating materials and method of making them
US2528454A (en) * 1946-11-07 1950-10-31 Hermann I Schlesinger Coating process
US2556711A (en) * 1947-10-29 1951-06-12 Bell Telephone Labor Inc Method of producing rectifiers and rectifier material
US2560594A (en) * 1948-09-24 1951-07-17 Bell Telephone Labor Inc Semiconductor translator and method of making it
DE883784C (de) * 1949-04-06 1953-06-03 Sueddeutsche App Fabrik G M B Verfahren zur Herstellung von Flaechengleichrichtern und Kristallverstaerkerschichten aus Elementen
NL82014C (fr) * 1949-11-30
US2671735A (en) * 1950-07-07 1954-03-09 Bell Telephone Labor Inc Electrical resistors and methods of making them
NL99536C (fr) * 1951-03-07 1900-01-01
US2763581A (en) * 1952-11-25 1956-09-18 Raytheon Mfg Co Process of making p-n junction crystals

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1085969B (de) * 1958-09-23 1960-07-28 Siemens Ag Verfahren und Vorrichtung zur Oberflaechenbehandlung von Halbleiterbauelementen mit mehreren Elektroden und mindestens einem pn-UEbergang

Also Published As

Publication number Publication date
BE536122A (fr)
GB782662A (en) 1957-09-11
NL193073A (fr)
US3015590A (en) 1962-01-02
JPS306984B1 (fr) 1955-09-29
CH341571A (de) 1959-10-15

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