FIU990136U0 - Kylelement för ojämnt fördelad värmebelastning - Google Patents
Kylelement för ojämnt fördelad värmebelastningInfo
- Publication number
- FIU990136U0 FIU990136U0 FI990136U FIU990136U FIU990136U0 FI U990136 U0 FIU990136 U0 FI U990136U0 FI 990136 U FI990136 U FI 990136U FI U990136 U FIU990136 U FI U990136U FI U990136 U0 FIU990136 U0 FI U990136U0
- Authority
- FI
- Finland
- Prior art keywords
- heat sink
- thermal load
- unevenly distributed
- distributed thermal
- unevenly
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI990136U FI4044U1 (sv) | 1997-11-21 | 1999-03-22 | Kylelement för ojämnt fördelad värmebelastning |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI974293A FI974293A0 (fi) | 1997-11-21 | 1997-11-21 | Kylelement foer ojaemnt foerdelad vaermebelastning |
FI990136U FI4044U1 (sv) | 1997-11-21 | 1999-03-22 | Kylelement för ojämnt fördelad värmebelastning |
Publications (2)
Publication Number | Publication Date |
---|---|
FIU990136U0 true FIU990136U0 (sv) | 1999-03-22 |
FI4044U1 FI4044U1 (sv) | 1999-07-09 |
Family
ID=8549991
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI974293A FI974293A0 (fi) | 1997-11-21 | 1997-11-21 | Kylelement foer ojaemnt foerdelad vaermebelastning |
FI990136U FI4044U1 (sv) | 1997-11-21 | 1999-03-22 | Kylelement för ojämnt fördelad värmebelastning |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI974293A FI974293A0 (fi) | 1997-11-21 | 1997-11-21 | Kylelement foer ojaemnt foerdelad vaermebelastning |
Country Status (8)
Country | Link |
---|---|
US (1) | US6313399B1 (sv) |
EP (1) | EP1033069A1 (sv) |
JP (1) | JP3075726U (sv) |
CN (1) | CN2443582Y (sv) |
DE (1) | DE29880160U1 (sv) |
FI (2) | FI974293A0 (sv) |
RU (1) | RU17250U1 (sv) |
WO (1) | WO1999027761A1 (sv) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6446707B1 (en) * | 2001-04-17 | 2002-09-10 | Hewlett-Packard Company | Active heat sink structure with directed air flow |
US6698511B2 (en) * | 2001-05-18 | 2004-03-02 | Incep Technologies, Inc. | Vortex heatsink for high performance thermal applications |
US6847525B1 (en) * | 2002-05-24 | 2005-01-25 | Unisys Corporation | Forced convection heat sink system with fluid vector control |
US20030221817A1 (en) * | 2002-05-31 | 2003-12-04 | Racksaver, Inc. | Rack mountable computer component cooling method and device |
TWI267337B (en) * | 2003-05-14 | 2006-11-21 | Inventor Prec Co Ltd | Heat sink |
US7198094B2 (en) * | 2003-06-20 | 2007-04-03 | Hewlett-Packard Development Company, L.P. | Finned device for removing heat from an electronic component |
US6913069B2 (en) * | 2003-08-14 | 2005-07-05 | Hewlett-Packard Development Company, L.P. | Cooling device having fins arranged to funnel air |
US20050063159A1 (en) * | 2003-09-23 | 2005-03-24 | Richard Ma | Heat-dissipating fin module |
TWI228215B (en) * | 2003-09-26 | 2005-02-21 | Quanta Comp Inc | Heat dissipation device |
TWM248226U (en) * | 2003-10-17 | 2004-10-21 | Hon Hai Prec Ind Co Ltd | Heat dissipating device |
GB2407375B (en) * | 2003-10-22 | 2006-06-28 | Motorola Inc | Heat sinks |
US7044014B2 (en) * | 2004-05-25 | 2006-05-16 | Ford Global Technologies, Llc | Dual clutch automatic transaxle |
FR2875672B1 (fr) * | 2004-09-21 | 2007-05-11 | 3D Plus Sa Sa | Dispositif electronique avec repartiteur de chaleur integre |
US7472742B2 (en) * | 2005-12-01 | 2009-01-06 | General Electric Company | Heat sink assembly |
DE102006013017B4 (de) * | 2006-03-20 | 2014-11-06 | R. Stahl Schaltgeräte GmbH | Gehäuse mit Wärmebrücke |
US7495920B2 (en) * | 2006-12-21 | 2009-02-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US8342234B2 (en) * | 2007-06-11 | 2013-01-01 | Chien Ouyang | Plasma-driven cooling heat sink |
KR20100136982A (ko) * | 2008-03-11 | 2010-12-29 | 솔라 이노베이션 아에스 | 광전지 모듈용 자연 냉각 시스템 |
US8453715B2 (en) * | 2008-10-30 | 2013-06-04 | General Electric Company | Synthetic jet embedded heat sink |
TWM363612U (en) * | 2008-11-05 | 2009-08-21 | Power Data Comm Co Ltd | Heat dissipating apparatus of laptop computer |
US20100170657A1 (en) * | 2009-01-06 | 2010-07-08 | United Technologies Corporation | Integrated blower diffuser-fin heat sink |
US8198725B2 (en) * | 2009-12-31 | 2012-06-12 | Star Technologies Inc. | Heat sink and integrated circuit assembly using the same |
US10103089B2 (en) | 2010-03-26 | 2018-10-16 | Hamilton Sundstrand Corporation | Heat transfer device with fins defining air flow channels |
KR101278313B1 (ko) * | 2011-11-04 | 2013-06-25 | 삼성전기주식회사 | 히트 싱크 |
US9730360B2 (en) * | 2011-11-29 | 2017-08-08 | Cooper Technologies Company | Shroud for an electrical enclosure |
US11026347B2 (en) * | 2012-12-21 | 2021-06-01 | Smart Embedded Computing, Inc. | Configurable cooling for rugged environments |
JP6118665B2 (ja) * | 2013-07-01 | 2017-04-19 | 嵯峨電機工業株式会社 | ヒートシンク装置 |
WO2015022032A1 (en) * | 2013-08-16 | 2015-02-19 | Huawei Technologies Co., Ltd. | Enhanced structure for natural cooling heat sink |
DE202013007768U1 (de) * | 2013-08-30 | 2014-12-02 | Liebherr-Elektronik Gmbh | Gehäuse für elektronische Bauteile und Kühlkörper |
US11604035B2 (en) * | 2013-09-29 | 2023-03-14 | Huawei Technologies Co., Ltd. | Support plateheat dissipation apparatus |
FR3016956B1 (fr) * | 2014-01-29 | 2019-04-19 | Safran Aircraft Engines | Echangeur de chaleur d'une turbomachine |
DE102015016260A1 (de) * | 2015-12-15 | 2017-06-22 | Wilo Se | Elektronikgehäuse mit Kühlrippen |
DE102016110779A1 (de) * | 2016-06-13 | 2017-12-14 | Emg Automation Gmbh | Elektrohydraulische Betätigungsvorrichtung mit Kühlmodulen |
EP3510635B1 (en) * | 2016-09-21 | 2024-01-31 | Huawei Technologies Co., Ltd. | Heatsink |
US20190215984A1 (en) * | 2018-01-09 | 2019-07-11 | Aptiv Technologies Limited | Wireless device charger with cooling device |
EP3746730A1 (en) * | 2018-02-02 | 2020-12-09 | Telefonaktiebolaget Lm Ericsson (Publ) | Cooling device for dissipating heat from an object |
US10314203B1 (en) * | 2018-05-10 | 2019-06-04 | Juniper Networks, Inc | Apparatuses, systems, and methods for cooling electronic components |
TWM618207U (zh) * | 2021-05-31 | 2021-10-11 | 和碩聯合科技股份有限公司 | 電子裝置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3105196A1 (de) * | 1981-02-13 | 1982-09-09 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Vorrichtung zum intensiven kuehlen von aktiven halbleiterbauelementen |
US5019880A (en) * | 1988-01-07 | 1991-05-28 | Prime Computer, Inc. | Heat sink apparatus |
US4884630A (en) * | 1988-07-14 | 1989-12-05 | Microelectronics And Computer Technology Corporation | End fed liquid heat exchanger for an electronic component |
US4953634A (en) * | 1989-04-20 | 1990-09-04 | Microelectronics And Computer Technology Corporation | Low pressure high heat transfer fluid heat exchanger |
US5597034A (en) * | 1994-07-01 | 1997-01-28 | Digital Equipment Corporation | High performance fan heatsink assembly |
US5709263A (en) * | 1995-10-19 | 1998-01-20 | Silicon Graphics, Inc. | High performance sinusoidal heat sink for heat removal from electronic equipment |
US5661638A (en) * | 1995-11-03 | 1997-08-26 | Silicon Graphics, Inc. | High performance spiral heat sink |
USD379088S (en) * | 1996-02-08 | 1997-05-06 | Augat Communication Products Inc. | CATV housing with heat sink fins |
IT1294293B1 (it) * | 1997-07-31 | 1999-03-24 | Maurizio Checchetti | Dissipatore di calore |
US6196302B1 (en) * | 1999-03-16 | 2001-03-06 | Wen-Hao Chuang | Heat sink with multi-layer dispersion space |
US6199624B1 (en) * | 1999-04-30 | 2001-03-13 | Molex Incorporated | Folded fin heat sink and a heat exchanger employing the heat sink |
-
1997
- 1997-11-21 FI FI974293A patent/FI974293A0/fi unknown
-
1998
- 1998-11-23 WO PCT/FI1998/000915 patent/WO1999027761A1/en not_active Application Discontinuation
- 1998-11-23 JP JP2000600082U patent/JP3075726U/ja not_active Expired - Fee Related
- 1998-11-23 RU RU2000116144/20U patent/RU17250U1/ru active
- 1998-11-23 US US09/554,797 patent/US6313399B1/en not_active Expired - Fee Related
- 1998-11-23 EP EP98955621A patent/EP1033069A1/en not_active Withdrawn
- 1998-11-23 CN CN98900002U patent/CN2443582Y/zh not_active Expired - Fee Related
- 1998-11-23 DE DE29880160U patent/DE29880160U1/de not_active Expired - Lifetime
-
1999
- 1999-03-22 FI FI990136U patent/FI4044U1/sv active
Also Published As
Publication number | Publication date |
---|---|
FI974293A0 (fi) | 1997-11-21 |
CN2443582Y (zh) | 2001-08-15 |
EP1033069A1 (en) | 2000-09-06 |
DE29880160U1 (de) | 2001-03-29 |
RU17250U1 (ru) | 2001-03-20 |
FI4044U1 (sv) | 1999-07-09 |
JP3075726U (ja) | 2001-03-06 |
WO1999027761A1 (en) | 1999-06-03 |
US6313399B1 (en) | 2001-11-06 |
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