FI991509A - Menetelmä lämpöenergiaa generoivan lämmönlähteen asentamiseksi mikrolä mpöputkimoduulille ja mikrolämpöputkimoduuli - Google Patents

Menetelmä lämpöenergiaa generoivan lämmönlähteen asentamiseksi mikrolä mpöputkimoduulille ja mikrolämpöputkimoduuli Download PDF

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Publication number
FI991509A
FI991509A FI991509A FI991509A FI991509A FI 991509 A FI991509 A FI 991509A FI 991509 A FI991509 A FI 991509A FI 991509 A FI991509 A FI 991509A FI 991509 A FI991509 A FI 991509A
Authority
FI
Finland
Prior art keywords
micro
pipe module
heat
installing
energy generating
Prior art date
Application number
FI991509A
Other languages
English (en)
Swedish (sv)
Inventor
Timo Heikkilae
Carl Axel Ingemar Kabrell
Reijo Lehtiniemi
Jukka Rantala
Original Assignee
Nokia Networks Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Networks Oy filed Critical Nokia Networks Oy
Priority to FI991509A priority Critical patent/FI991509A/fi
Priority to PCT/FI2000/000596 priority patent/WO2001003484A1/en
Priority to AU58309/00A priority patent/AU5830900A/en
Priority to EP00944073A priority patent/EP1201109A1/en
Publication of FI991509A publication Critical patent/FI991509A/fi
Priority to US10/026,943 priority patent/US20020121359A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0225—Microheat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FI991509A 1999-07-01 1999-07-01 Menetelmä lämpöenergiaa generoivan lämmönlähteen asentamiseksi mikrolä mpöputkimoduulille ja mikrolämpöputkimoduuli FI991509A (fi)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI991509A FI991509A (fi) 1999-07-01 1999-07-01 Menetelmä lämpöenergiaa generoivan lämmönlähteen asentamiseksi mikrolä mpöputkimoduulille ja mikrolämpöputkimoduuli
PCT/FI2000/000596 WO2001003484A1 (en) 1999-07-01 2000-06-29 Method of installing heat source, and micro heat pipe module
AU58309/00A AU5830900A (en) 1999-07-01 2000-06-29 Method of installing heat source, and micro heat pipe module
EP00944073A EP1201109A1 (en) 1999-07-01 2000-06-29 Method of installing heat source, and micro heat pipe module
US10/026,943 US20020121359A1 (en) 1999-07-01 2001-12-27 Method of installing heat source, and micro heat pipe module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI991509A FI991509A (fi) 1999-07-01 1999-07-01 Menetelmä lämpöenergiaa generoivan lämmönlähteen asentamiseksi mikrolä mpöputkimoduulille ja mikrolämpöputkimoduuli

Publications (1)

Publication Number Publication Date
FI991509A true FI991509A (fi) 2001-01-02

Family

ID=8555006

Family Applications (1)

Application Number Title Priority Date Filing Date
FI991509A FI991509A (fi) 1999-07-01 1999-07-01 Menetelmä lämpöenergiaa generoivan lämmönlähteen asentamiseksi mikrolä mpöputkimoduulille ja mikrolämpöputkimoduuli

Country Status (5)

Country Link
US (1) US20020121359A1 (fi)
EP (1) EP1201109A1 (fi)
AU (1) AU5830900A (fi)
FI (1) FI991509A (fi)
WO (1) WO2001003484A1 (fi)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6935409B1 (en) 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
WO2002080270A1 (en) * 2001-03-30 2002-10-10 Thermotek, Inc. Cooling apparatus having low profile extrusion
US6834712B2 (en) 2001-11-27 2004-12-28 Thermotek, Inc. Stacked low profile cooling system and method for making same
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
US20070130769A1 (en) * 2002-09-03 2007-06-14 Moon Seok H Micro heat pipe with pligonal cross-section manufactured via extrusion or drawing
US20040112572A1 (en) * 2002-12-17 2004-06-17 Moon Seok Hwan Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing
DE102007053090B4 (de) * 2007-11-07 2011-12-15 Rohde & Schwarz Gmbh & Co. Kg Kühlkörper und Kühlanordnung für elektrische Komponenten und Verfahren zur Herstellung eines Kühlkörpers und einer Kühlanordnung für elektrische Komponenten
EP2327947B1 (en) 2009-11-30 2012-02-22 ABB Research Ltd Heat exchanger
WO2012106605A2 (en) 2011-02-04 2012-08-09 Lockheed Martin Corporation Staged graphite foam heat exchangers
US9513059B2 (en) 2011-02-04 2016-12-06 Lockheed Martin Corporation Radial-flow heat exchanger with foam heat exchange fins
US9464847B2 (en) 2011-02-04 2016-10-11 Lockheed Martin Corporation Shell-and-tube heat exchangers with foam heat transfer units
US20130146250A1 (en) * 2011-12-08 2013-06-13 Lockheed Martin Corporation System and method for desalination of water using a graphite foam material
US11057983B2 (en) 2019-01-30 2021-07-06 Rohde & Schwarz Gmbh & Co. Kg PCB assembly and method of manufacturing a PCB assembly
DE102021111632A1 (de) * 2021-05-05 2022-11-10 Vacon Oy Verfahren zum Kühlen einer Vorrichtung, wie z.B. eines elektromotorischen Antriebs oder eines allgemeinen Stromwandlers, und Vorrichtung, wie z.B. ein elektromotorischer Antrieb oder ein allgemeiner Stromwandler zur Durchführung des Kühlverfahrens

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5355942A (en) * 1991-08-26 1994-10-18 Sun Microsystems, Inc. Cooling multi-chip modules using embedded heat pipes
JP3311421B2 (ja) * 1993-04-02 2002-08-05 古河電気工業株式会社 高密度放熱型回路基板
JPH0853100A (ja) * 1994-08-10 1996-02-27 Mitsubishi Electric Corp ヒートパイプ埋め込みハニカムサンドイッチパネル
US5598632A (en) * 1994-10-06 1997-02-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for producing micro heat panels
DE29719778U1 (de) * 1997-11-07 1999-04-01 Duewag Ag, 47829 Krefeld Leistungshalbleitermodul

Also Published As

Publication number Publication date
US20020121359A1 (en) 2002-09-05
EP1201109A1 (en) 2002-05-02
WO2001003484A1 (en) 2001-01-11
AU5830900A (en) 2001-01-22

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