FI991509A - Method for Installing a Heat Energy Generating Heat Source on a Micro Pipe Module and a Micro Heat Pipe Module - Google Patents

Method for Installing a Heat Energy Generating Heat Source on a Micro Pipe Module and a Micro Heat Pipe Module Download PDF

Info

Publication number
FI991509A
FI991509A FI991509A FI991509A FI991509A FI 991509 A FI991509 A FI 991509A FI 991509 A FI991509 A FI 991509A FI 991509 A FI991509 A FI 991509A FI 991509 A FI991509 A FI 991509A
Authority
FI
Finland
Prior art keywords
micro
pipe module
heat
installing
energy generating
Prior art date
Application number
FI991509A
Other languages
Finnish (fi)
Swedish (sv)
Inventor
Timo Heikkilae
Carl Axel Ingemar Kabrell
Reijo Lehtiniemi
Jukka Rantala
Original Assignee
Nokia Networks Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Networks Oy filed Critical Nokia Networks Oy
Priority to FI991509A priority Critical patent/FI991509A/en
Priority to EP00944073A priority patent/EP1201109A1/en
Priority to PCT/FI2000/000596 priority patent/WO2001003484A1/en
Priority to AU58309/00A priority patent/AU5830900A/en
Publication of FI991509A publication Critical patent/FI991509A/en
Priority to US10/026,943 priority patent/US20020121359A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0225—Microheat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FI991509A 1999-07-01 1999-07-01 Method for Installing a Heat Energy Generating Heat Source on a Micro Pipe Module and a Micro Heat Pipe Module FI991509A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI991509A FI991509A (en) 1999-07-01 1999-07-01 Method for Installing a Heat Energy Generating Heat Source on a Micro Pipe Module and a Micro Heat Pipe Module
EP00944073A EP1201109A1 (en) 1999-07-01 2000-06-29 Method of installing heat source, and micro heat pipe module
PCT/FI2000/000596 WO2001003484A1 (en) 1999-07-01 2000-06-29 Method of installing heat source, and micro heat pipe module
AU58309/00A AU5830900A (en) 1999-07-01 2000-06-29 Method of installing heat source, and micro heat pipe module
US10/026,943 US20020121359A1 (en) 1999-07-01 2001-12-27 Method of installing heat source, and micro heat pipe module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI991509A FI991509A (en) 1999-07-01 1999-07-01 Method for Installing a Heat Energy Generating Heat Source on a Micro Pipe Module and a Micro Heat Pipe Module

Publications (1)

Publication Number Publication Date
FI991509A true FI991509A (en) 2001-01-02

Family

ID=8555006

Family Applications (1)

Application Number Title Priority Date Filing Date
FI991509A FI991509A (en) 1999-07-01 1999-07-01 Method for Installing a Heat Energy Generating Heat Source on a Micro Pipe Module and a Micro Heat Pipe Module

Country Status (5)

Country Link
US (1) US20020121359A1 (en)
EP (1) EP1201109A1 (en)
AU (1) AU5830900A (en)
FI (1) FI991509A (en)
WO (1) WO2001003484A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6935409B1 (en) 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
WO2002080270A1 (en) * 2001-03-30 2002-10-10 Thermotek, Inc. Cooling apparatus having low profile extrusion
AU2002351180A1 (en) 2001-11-27 2003-06-10 Roger S. Devilbiss Stacked low profile cooling system and method for making same
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
US20070130769A1 (en) * 2002-09-03 2007-06-14 Moon Seok H Micro heat pipe with pligonal cross-section manufactured via extrusion or drawing
US20040112572A1 (en) * 2002-12-17 2004-06-17 Moon Seok Hwan Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing
DE102007053090B4 (en) * 2007-11-07 2011-12-15 Rohde & Schwarz Gmbh & Co. Kg Heat sink and cooling arrangement for electrical components and method for producing a heat sink and a cooling arrangement for electrical components
ATE546705T1 (en) * 2009-11-30 2012-03-15 Abb Research Ltd HEAT EXCHANGER
US9464847B2 (en) 2011-02-04 2016-10-11 Lockheed Martin Corporation Shell-and-tube heat exchangers with foam heat transfer units
US9951997B2 (en) 2011-02-04 2018-04-24 Lockheed Martin Corporation Staged graphite foam heat exchangers
WO2012106601A2 (en) 2011-02-04 2012-08-09 Lockheed Martin Corporation Radial-flow heat exchanger with foam heat exchange fins
US20130146250A1 (en) * 2011-12-08 2013-06-13 Lockheed Martin Corporation System and method for desalination of water using a graphite foam material
US11057983B2 (en) 2019-01-30 2021-07-06 Rohde & Schwarz Gmbh & Co. Kg PCB assembly and method of manufacturing a PCB assembly
DE102021111632A1 (en) * 2021-05-05 2022-11-10 Vacon Oy Method of cooling a device such as an electromotive drive or a general power converter, and a device such as an electromotive drive or a general power converter for carrying out the cooling method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5355942A (en) * 1991-08-26 1994-10-18 Sun Microsystems, Inc. Cooling multi-chip modules using embedded heat pipes
JP3311421B2 (en) * 1993-04-02 2002-08-05 古河電気工業株式会社 High density heat dissipation type circuit board
JPH0853100A (en) * 1994-08-10 1996-02-27 Mitsubishi Electric Corp Honeycomb sandwhich panel with heat pipe embedded in it
US5598632A (en) * 1994-10-06 1997-02-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for producing micro heat panels
DE29719778U1 (en) * 1997-11-07 1999-04-01 Duewag Ag, 47829 Krefeld Power semiconductor module

Also Published As

Publication number Publication date
EP1201109A1 (en) 2002-05-02
AU5830900A (en) 2001-01-22
WO2001003484A1 (en) 2001-01-11
US20020121359A1 (en) 2002-09-05

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