AU5830900A - Method of installing heat source, and micro heat pipe module - Google Patents

Method of installing heat source, and micro heat pipe module

Info

Publication number
AU5830900A
AU5830900A AU58309/00A AU5830900A AU5830900A AU 5830900 A AU5830900 A AU 5830900A AU 58309/00 A AU58309/00 A AU 58309/00A AU 5830900 A AU5830900 A AU 5830900A AU 5830900 A AU5830900 A AU 5830900A
Authority
AU
Australia
Prior art keywords
pipe module
installing
heat source
heat pipe
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU58309/00A
Inventor
Timo Heikkila
Carl Kabrell
Reijo Lehtiniemi
Jukka Rantala
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Oyj
Original Assignee
Nokia Networks Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Networks Oy filed Critical Nokia Networks Oy
Publication of AU5830900A publication Critical patent/AU5830900A/en
Abandoned legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0225—Microheat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU58309/00A 1999-07-01 2000-06-29 Method of installing heat source, and micro heat pipe module Abandoned AU5830900A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI991509A FI991509A (en) 1999-07-01 1999-07-01 Method for Installing a Heat Energy Generating Heat Source on a Micro Pipe Module and a Micro Heat Pipe Module
FI991509 1999-07-01
PCT/FI2000/000596 WO2001003484A1 (en) 1999-07-01 2000-06-29 Method of installing heat source, and micro heat pipe module

Publications (1)

Publication Number Publication Date
AU5830900A true AU5830900A (en) 2001-01-22

Family

ID=8555006

Family Applications (1)

Application Number Title Priority Date Filing Date
AU58309/00A Abandoned AU5830900A (en) 1999-07-01 2000-06-29 Method of installing heat source, and micro heat pipe module

Country Status (5)

Country Link
US (1) US20020121359A1 (en)
EP (1) EP1201109A1 (en)
AU (1) AU5830900A (en)
FI (1) FI991509A (en)
WO (1) WO2001003484A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6935409B1 (en) 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
WO2002080270A1 (en) * 2001-03-30 2002-10-10 Thermotek, Inc. Cooling apparatus having low profile extrusion
AU2002351180A1 (en) 2001-11-27 2003-06-10 Roger S. Devilbiss Stacked low profile cooling system and method for making same
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
US20070130769A1 (en) * 2002-09-03 2007-06-14 Moon Seok H Micro heat pipe with pligonal cross-section manufactured via extrusion or drawing
US20040112572A1 (en) * 2002-12-17 2004-06-17 Moon Seok Hwan Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing
DE102007053090B4 (en) * 2007-11-07 2011-12-15 Rohde & Schwarz Gmbh & Co. Kg Heat sink and cooling arrangement for electrical components and method for producing a heat sink and a cooling arrangement for electrical components
ATE546705T1 (en) * 2009-11-30 2012-03-15 Abb Research Ltd HEAT EXCHANGER
US9464847B2 (en) 2011-02-04 2016-10-11 Lockheed Martin Corporation Shell-and-tube heat exchangers with foam heat transfer units
US9951997B2 (en) 2011-02-04 2018-04-24 Lockheed Martin Corporation Staged graphite foam heat exchangers
WO2012106601A2 (en) 2011-02-04 2012-08-09 Lockheed Martin Corporation Radial-flow heat exchanger with foam heat exchange fins
US20130146250A1 (en) * 2011-12-08 2013-06-13 Lockheed Martin Corporation System and method for desalination of water using a graphite foam material
US11057983B2 (en) 2019-01-30 2021-07-06 Rohde & Schwarz Gmbh & Co. Kg PCB assembly and method of manufacturing a PCB assembly
DE102021111632A1 (en) * 2021-05-05 2022-11-10 Vacon Oy Method of cooling a device such as an electromotive drive or a general power converter, and a device such as an electromotive drive or a general power converter for carrying out the cooling method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5355942A (en) * 1991-08-26 1994-10-18 Sun Microsystems, Inc. Cooling multi-chip modules using embedded heat pipes
JP3311421B2 (en) * 1993-04-02 2002-08-05 古河電気工業株式会社 High density heat dissipation type circuit board
JPH0853100A (en) * 1994-08-10 1996-02-27 Mitsubishi Electric Corp Honeycomb sandwhich panel with heat pipe embedded in it
US5598632A (en) * 1994-10-06 1997-02-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for producing micro heat panels
DE29719778U1 (en) * 1997-11-07 1999-04-01 Duewag Ag, 47829 Krefeld Power semiconductor module

Also Published As

Publication number Publication date
EP1201109A1 (en) 2002-05-02
WO2001003484A1 (en) 2001-01-11
FI991509A (en) 2001-01-02
US20020121359A1 (en) 2002-09-05

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase