FI99029B - Process for doping basic material with doping material for preparing a chemical compound or alloy by means of a sputtering cathode and device for carrying out the process - Google Patents

Process for doping basic material with doping material for preparing a chemical compound or alloy by means of a sputtering cathode and device for carrying out the process

Info

Publication number
FI99029B
FI99029B FI920475A FI920475A FI99029B FI 99029 B FI99029 B FI 99029B FI 920475 A FI920475 A FI 920475A FI 920475 A FI920475 A FI 920475A FI 99029 B FI99029 B FI 99029B
Authority
FI
Finland
Prior art keywords
doping
alloy
preparing
carrying
chemical compound
Prior art date
Application number
FI920475A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI920475A (en
FI920475A0 (en
FI99029C (en
Inventor
Rudolf Latz
Original Assignee
Leybold Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold Ag filed Critical Leybold Ag
Publication of FI920475A0 publication Critical patent/FI920475A0/en
Publication of FI920475A publication Critical patent/FI920475A/en
Application granted granted Critical
Publication of FI99029B publication Critical patent/FI99029B/en
Publication of FI99029C publication Critical patent/FI99029C/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
FI920475A 1991-03-09 1992-02-04 Process for doping basic material with doping material for preparing a chemical compound or alloy by means of a sputtering cathode and device for carrying out the process FI99029C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4107711 1991-03-09
DE19914107711 DE4107711C2 (en) 1991-03-09 1991-03-09 Method and device for depositing doped layers or chemical compounds or alloys using a magnetron cathode

Publications (4)

Publication Number Publication Date
FI920475A0 FI920475A0 (en) 1992-02-04
FI920475A FI920475A (en) 1992-09-10
FI99029B true FI99029B (en) 1997-06-13
FI99029C FI99029C (en) 1997-09-25

Family

ID=6426953

Family Applications (1)

Application Number Title Priority Date Filing Date
FI920475A FI99029C (en) 1991-03-09 1992-02-04 Process for doping basic material with doping material for preparing a chemical compound or alloy by means of a sputtering cathode and device for carrying out the process

Country Status (5)

Country Link
JP (1) JPH0578837A (en)
BE (1) BE1004534A3 (en)
CH (1) CH684950A5 (en)
DE (1) DE4107711C2 (en)
FI (1) FI99029C (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19813075A1 (en) * 1998-03-25 1999-09-30 Leybold Ag Device for coating a substrate
US8357267B2 (en) 2005-10-26 2013-01-22 Sharp Kabushiki Kaisha Film producing method using atmospheric pressure hydrogen plasma, and method and apparatus for producing refined film
JP4750619B2 (en) * 2006-05-09 2011-08-17 株式会社昭和真空 Magnetron cathode and sputtering equipment equipped with it
JP7045177B2 (en) * 2017-12-12 2022-03-31 株式会社アルバック Spattering equipment

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU491734A1 (en) * 1971-11-18 1975-11-15
US4166018A (en) * 1974-01-31 1979-08-28 Airco, Inc. Sputtering process and apparatus
DD118304A1 (en) * 1975-04-08 1976-02-20
SU620513A1 (en) * 1976-12-30 1978-07-12 Предприятие П/Я В-2763 Cathode assembly
DE3248121A1 (en) * 1982-12-24 1984-06-28 Leybold-Heraeus GmbH, 5000 Köln HIGH-PERFORMANCE CATODE ARRANGEMENT FOR THE PRODUCTION OF MULTIPLE LAYERS
US4486287A (en) * 1984-02-06 1984-12-04 Fournier Paul R Cross-field diode sputtering target assembly
EP0246765A3 (en) * 1986-05-15 1988-12-14 Varian Associates, Inc. Apparatus and method for manufacturing planarized aluminium films
JP2566137B2 (en) * 1986-12-25 1996-12-25 ティーディーケイ株式会社 Thin film manufacturing method
US4865710A (en) * 1988-03-31 1989-09-12 Wisconsin Alumni Research Foundation Magnetron with flux switching cathode and method of operation
DE3812379A1 (en) * 1988-04-14 1989-10-26 Leybold Ag SPRAYING CATHODE ACCORDING TO THE MAGNETRON PRINCIPLE
JPH02179871A (en) * 1988-12-28 1990-07-12 Matsushita Electric Ind Co Ltd Formation of thin film and magnetron sputtering device
DE3929695C2 (en) * 1989-09-07 1996-12-19 Leybold Ag Device for coating a substrate

Also Published As

Publication number Publication date
BE1004534A3 (en) 1992-12-08
FI920475A (en) 1992-09-10
DE4107711C2 (en) 1999-11-11
FI920475A0 (en) 1992-02-04
FI99029C (en) 1997-09-25
JPH0578837A (en) 1993-03-30
DE4107711A1 (en) 1992-09-10
CH684950A5 (en) 1995-02-15

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Legal Events

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BB Publication of examined application