FI952427A - Flerskiktledarplattor och multichipmodulsubstrat - Google Patents

Flerskiktledarplattor och multichipmodulsubstrat Download PDF

Info

Publication number
FI952427A
FI952427A FI952427A FI952427A FI952427A FI 952427 A FI952427 A FI 952427A FI 952427 A FI952427 A FI 952427A FI 952427 A FI952427 A FI 952427A FI 952427 A FI952427 A FI 952427A
Authority
FI
Finland
Prior art keywords
plastic
chip module
layer conductor
conductor plates
module substrates
Prior art date
Application number
FI952427A
Other languages
English (en)
Finnish (fi)
Other versions
FI114607B (sv
FI952427A0 (sv
Inventor
Albert Hammerschmidt
Siegfried Birkle
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of FI952427A0 publication Critical patent/FI952427A0/sv
Publication of FI952427A publication Critical patent/FI952427A/sv
Application granted granted Critical
Publication of FI114607B publication Critical patent/FI114607B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Chemical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
FI952427A 1994-05-20 1995-05-18 Flerskiktsledarplattor och multichipsmodulsubstrat och metod för framställning av dessa FI114607B (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4417775 1994-05-20
DE4417775 1994-05-20

Publications (3)

Publication Number Publication Date
FI952427A0 FI952427A0 (sv) 1995-05-18
FI952427A true FI952427A (sv) 1995-11-21
FI114607B FI114607B (sv) 2004-11-15

Family

ID=6518635

Family Applications (1)

Application Number Title Priority Date Filing Date
FI952427A FI114607B (sv) 1994-05-20 1995-05-18 Flerskiktsledarplattor och multichipsmodulsubstrat och metod för framställning av dessa

Country Status (5)

Country Link
US (1) US5601902A (sv)
EP (1) EP0683516B1 (sv)
JP (1) JPH0864967A (sv)
DE (1) DE59511037D1 (sv)
FI (1) FI114607B (sv)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5736448A (en) * 1995-12-04 1998-04-07 General Electric Company Fabrication method for thin film capacitors
US5942328A (en) * 1996-02-29 1999-08-24 International Business Machines Corporation Low dielectric constant amorphous fluorinated carbon and method of preparation
US6150719A (en) * 1997-07-28 2000-11-21 General Electric Company Amorphous hydrogenated carbon hermetic structure and fabrication method
US6218078B1 (en) * 1997-09-24 2001-04-17 Advanced Micro Devices, Inc. Creation of an etch hardmask by spin-on technique
FR2845204A1 (fr) * 2003-01-07 2004-04-02 Thomson Licensing Sa Panneau electroluminescent organique a couche d'encapsulation a base de carbone amorphe.
JP4896729B2 (ja) * 2003-11-13 2012-03-14 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 保護障壁積層を有する電子デバイス
JP4839723B2 (ja) * 2005-08-10 2011-12-21 富士電機株式会社 保護膜形成方法およびその保護膜を備えた磁気記録媒体
US8278139B2 (en) * 2009-09-25 2012-10-02 Applied Materials, Inc. Passivating glue layer to improve amorphous carbon to metal adhesion
JP5648523B2 (ja) * 2011-02-16 2015-01-07 富士通株式会社 半導体装置、電源装置、増幅器及び半導体装置の製造方法
DE102014211713A1 (de) * 2014-06-18 2015-12-24 Siemens Aktiengesellschaft Vorrichtung zur Plasmabeschichtung und Verfahren zum Beschichten einer Platine
JP6511126B1 (ja) * 2017-12-27 2019-05-15 株式会社リケン 摺動部材およびピストンリング

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4977008A (en) * 1981-08-20 1990-12-11 E. I Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US5147822A (en) * 1988-08-26 1992-09-15 Semiconductor Energy Laboratory Co., Ltd. Plasma processing method for improving a package of a semiconductor device
EP0381109A3 (de) * 1989-02-01 1990-12-12 Siemens Aktiengesellschaft Feuchtesperre für organische Dielektrika
US5139906A (en) * 1989-11-30 1992-08-18 Minolta Camera Kabushiki Kaisha Photosensitive medium with a protective layer of amorphous hydrocarbon having an absorption coefficient greater than 10,000 cm-1
JP3185293B2 (ja) * 1990-12-27 2001-07-09 日本ゼオン株式会社 アルキリデンノルボルネン系重合体およびその製造方法
ATE125666T1 (de) * 1991-02-07 1995-08-15 Siemens Ag Mikromehrlagenverdrahtung.

Also Published As

Publication number Publication date
FI114607B (sv) 2004-11-15
FI952427A0 (sv) 1995-05-18
EP0683516B1 (de) 2006-01-11
EP0683516A3 (de) 1996-11-13
DE59511037D1 (de) 2006-04-06
US5601902A (en) 1997-02-11
JPH0864967A (ja) 1996-03-08
EP0683516A2 (de) 1995-11-22

Similar Documents

Publication Publication Date Title
US4806432A (en) Copper-foiled laminated sheet for flexible printed circuit board
US5112462A (en) Method of making metal-film laminate resistant to delamination
FI952427A (sv) Flerskiktledarplattor och multichipmodulsubstrat
US4713284A (en) Ceramic coated laminate and process for producing the same
MY128039A (en) Printed circuit boards and method of producing the same
US5137791A (en) Metal-film laminate resistant to delamination
DE3485829D1 (de) Verfahren und vorrichtung zur kontinuierlichen herstellung eines isolierten substrates.
DE68923904D1 (de) Verfahren zur Herstellung eines mit einer dünnen Kupferfolie kaschierten Substrats für Schaltungsplatten.
EP0960725A3 (en) Resin-coated composite foil, production and use thereof
ATE227887T1 (de) Verfahren zur herstellung eines elektronischen schaltungsmoduls mit hoher integrationsdichte
DE60000315D1 (de) Verfahren zur herstellung einer mehrschichtigen gedruckten leiterplatte und verbundfolie zur verwendung darin
DE69926939D1 (de) Verfahren zur Herstellung einer mehrschichtigen gedruckten Leiterplatte
CA2053448A1 (en) Multilayer printed wiring board and process for manufacturing the same
DE69617753D1 (de) Verfahren zur herstellung von gedruckten schaltungen sowie nach diesem verfahren hergestellte gedruckte schaltung
KR20010013051A (ko) 폴리머 필름 생성물상의 다층 금속화 복합체 및 방법
CA2055982A1 (en) Thermoplastic film, reinforced hollow glass microsphere reinforced laminates for thin low dielectric constant substrates
CA2073211A1 (en) Method of manufacturing a rigid-flex printed wiring board
TW362340B (en) Prepreg for laminate and process for producing printed wiring-board using the same
DE69220588D1 (de) Verfahren zur Herstellung eines mit einer dünnen Kupferfolie kaschierten Substrats für Leiterplatten
ATE150585T1 (de) Verfahren zur herstellung einer halbleitervorrichtung mit einer verdrahtungsstruktur hoher dichte
MY116494A (en) Copper foils and high-density multilayer printed circuit board using the copper foils for inner-layer circuit
WO2004021749A3 (en) Manufacture of flexible printed circuit boards
MY114920A (en) Multilayer printed wiring board and process for manufacturing the same
ATE125666T1 (de) Mikromehrlagenverdrahtung.
EP0782376A3 (en) Polyimide-metal foil composite film

Legal Events

Date Code Title Description
FG Patent granted

Ref document number: 114607

Country of ref document: FI