FI114607B - Flerskiktsledarplattor och multichipsmodulsubstrat och metod för framställning av dessa - Google Patents

Flerskiktsledarplattor och multichipsmodulsubstrat och metod för framställning av dessa Download PDF

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Publication number
FI114607B
FI114607B FI952427A FI952427A FI114607B FI 114607 B FI114607 B FI 114607B FI 952427 A FI952427 A FI 952427A FI 952427 A FI952427 A FI 952427A FI 114607 B FI114607 B FI 114607B
Authority
FI
Finland
Prior art keywords
layer
multichip
plastic
conductor plates
hard
Prior art date
Application number
FI952427A
Other languages
English (en)
Finnish (fi)
Other versions
FI952427A (sv
FI952427A0 (sv
Inventor
Siegfried Birkle
Albert Hammerschmidt
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of FI952427A0 publication Critical patent/FI952427A0/sv
Publication of FI952427A publication Critical patent/FI952427A/sv
Application granted granted Critical
Publication of FI114607B publication Critical patent/FI114607B/sv

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Chemical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Claims (7)

1. Flerskiktsledarplattor och multichipsmodulsub-strat med ätminstone en skiktformig kombination av högtem-5 peraturstabil plast och metalliska ledarbanor, kanne-tecknade av att plasten är försedd med ett tunt skikt av amorft vätehaltigt koi (a-C:H), vars vattenpermeations-koefficient är < 1,1-lCT13 m2/s, och att a-C:H-skiktet upp-visar en härdhetsgradient.
2. Flerskiktsledarplattor och multischipsmodulsub- strat enligt patentkrav 1, kännetecknade av att det amorfa vätehaltiga kolets skiktgradient är härd-mjuk-härd.
3. Flerskiktsledarplattor och multischipsmodulsub-strat enligt patentkrav 1 eller 2, kännetecknade av 15 att a-C:H-skiktets tjocklek är 0,1 - 5 μιτκ
4. Förfarande för framställning av flerskiktsle darplattor och multichipsmodulsubstrat enligt nägot av pa-tentkraven 1 - 3, kännetecknat av att pä plasten i den skiktformiga plast/ledarbana-kombinationen utfälls med 20 hjälp av högfrekvensplasmautfällning av gasformiga kol-väten ett tunt a-C:H-skikt med en härdhetsgradient.
5. Förfarande enligt patentkrav 4, kännetecknat av att plasmautfällningen sker med hjälp av radio-frekvens. 25
6. Förfarande enligt patentkrav 4 eller 5, kän netecknat av att som kolväten används alkaner eller I aromatiska kolväten.
7. Förfarande enligt nägot av patentkraven 4-6, . - : kännetecknat av att före a-C:H-utfällningen utförs 30 en ytbehandling i ett argon- eller syreplasma. ' i · * » « · Ml
FI952427A 1994-05-20 1995-05-18 Flerskiktsledarplattor och multichipsmodulsubstrat och metod för framställning av dessa FI114607B (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4417775 1994-05-20
DE4417775 1994-05-20

Publications (3)

Publication Number Publication Date
FI952427A0 FI952427A0 (sv) 1995-05-18
FI952427A FI952427A (sv) 1995-11-21
FI114607B true FI114607B (sv) 2004-11-15

Family

ID=6518635

Family Applications (1)

Application Number Title Priority Date Filing Date
FI952427A FI114607B (sv) 1994-05-20 1995-05-18 Flerskiktsledarplattor och multichipsmodulsubstrat och metod för framställning av dessa

Country Status (5)

Country Link
US (1) US5601902A (sv)
EP (1) EP0683516B1 (sv)
JP (1) JPH0864967A (sv)
DE (1) DE59511037D1 (sv)
FI (1) FI114607B (sv)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5736448A (en) * 1995-12-04 1998-04-07 General Electric Company Fabrication method for thin film capacitors
US5942328A (en) * 1996-02-29 1999-08-24 International Business Machines Corporation Low dielectric constant amorphous fluorinated carbon and method of preparation
US6150719A (en) * 1997-07-28 2000-11-21 General Electric Company Amorphous hydrogenated carbon hermetic structure and fabrication method
US6218078B1 (en) * 1997-09-24 2001-04-17 Advanced Micro Devices, Inc. Creation of an etch hardmask by spin-on technique
FR2845204A1 (fr) * 2003-01-07 2004-04-02 Thomson Licensing Sa Panneau electroluminescent organique a couche d'encapsulation a base de carbone amorphe.
JP4896729B2 (ja) * 2003-11-13 2012-03-14 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 保護障壁積層を有する電子デバイス
JP4839723B2 (ja) * 2005-08-10 2011-12-21 富士電機株式会社 保護膜形成方法およびその保護膜を備えた磁気記録媒体
US8278139B2 (en) * 2009-09-25 2012-10-02 Applied Materials, Inc. Passivating glue layer to improve amorphous carbon to metal adhesion
JP5648523B2 (ja) * 2011-02-16 2015-01-07 富士通株式会社 半導体装置、電源装置、増幅器及び半導体装置の製造方法
DE102014211713A1 (de) * 2014-06-18 2015-12-24 Siemens Aktiengesellschaft Vorrichtung zur Plasmabeschichtung und Verfahren zum Beschichten einer Platine
JP6511126B1 (ja) * 2017-12-27 2019-05-15 株式会社リケン 摺動部材およびピストンリング

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4977008A (en) * 1981-08-20 1990-12-11 E. I Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
US5147822A (en) * 1988-08-26 1992-09-15 Semiconductor Energy Laboratory Co., Ltd. Plasma processing method for improving a package of a semiconductor device
EP0381109A3 (de) * 1989-02-01 1990-12-12 Siemens Aktiengesellschaft Feuchtesperre für organische Dielektrika
US5139906A (en) * 1989-11-30 1992-08-18 Minolta Camera Kabushiki Kaisha Photosensitive medium with a protective layer of amorphous hydrocarbon having an absorption coefficient greater than 10,000 cm-1
JP3185293B2 (ja) * 1990-12-27 2001-07-09 日本ゼオン株式会社 アルキリデンノルボルネン系重合体およびその製造方法
ATE125666T1 (de) * 1991-02-07 1995-08-15 Siemens Ag Mikromehrlagenverdrahtung.

Also Published As

Publication number Publication date
US5601902A (en) 1997-02-11
EP0683516B1 (de) 2006-01-11
EP0683516A3 (de) 1996-11-13
JPH0864967A (ja) 1996-03-08
EP0683516A2 (de) 1995-11-22
FI952427A (sv) 1995-11-21
FI952427A0 (sv) 1995-05-18
DE59511037D1 (de) 2006-04-06

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