FI920424A - PROCEDURE FOR THE PROCESSING OF METAL PROCESSING AND ANCHORING OF THE PROCEDURE - Google Patents

PROCEDURE FOR THE PROCESSING OF METAL PROCESSING AND ANCHORING OF THE PROCEDURE Download PDF

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Publication number
FI920424A
FI920424A FI920424A FI920424A FI920424A FI 920424 A FI920424 A FI 920424A FI 920424 A FI920424 A FI 920424A FI 920424 A FI920424 A FI 920424A FI 920424 A FI920424 A FI 920424A
Authority
FI
Finland
Prior art keywords
procedure
processing
anchoring
metal
metal processing
Prior art date
Application number
FI920424A
Other languages
Finnish (fi)
Other versions
FI920424A0 (en
FI100540B (en
Inventor
Rudolf Latz
Original Assignee
Leybold Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold Ag filed Critical Leybold Ag
Publication of FI920424A0 publication Critical patent/FI920424A0/en
Publication of FI920424A publication Critical patent/FI920424A/en
Application granted granted Critical
Publication of FI100540B publication Critical patent/FI100540B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
FI920424A 1991-03-08 1992-01-30 Apparatus for using a planar magnetron magnet arrangement for a sputtering plant FI100540B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4107505A DE4107505A1 (en) 1991-03-08 1991-03-08 METHOD FOR OPERATING A SPUTTER, AND DEVICE FOR CARRYING OUT THE METHOD
DE4107505 1991-03-08

Publications (3)

Publication Number Publication Date
FI920424A0 FI920424A0 (en) 1992-01-30
FI920424A true FI920424A (en) 1992-09-09
FI100540B FI100540B (en) 1997-12-31

Family

ID=6426816

Family Applications (1)

Application Number Title Priority Date Filing Date
FI920424A FI100540B (en) 1991-03-08 1992-01-30 Apparatus for using a planar magnetron magnet arrangement for a sputtering plant

Country Status (5)

Country Link
EP (1) EP0503138B1 (en)
JP (1) JPH04329874A (en)
KR (1) KR920018235A (en)
DE (2) DE4107505A1 (en)
FI (1) FI100540B (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5399253A (en) * 1992-12-23 1995-03-21 Balzers Aktiengesellschaft Plasma generating device
DE4415232A1 (en) * 1994-04-30 1995-11-02 Leybold Ag Coating system
US5873989A (en) * 1997-02-06 1999-02-23 Intevac, Inc. Methods and apparatus for linear scan magnetron sputtering
KR100297373B1 (en) * 1998-10-20 2001-08-07 윤종용 Sputtering equipment
US6264804B1 (en) 2000-04-12 2001-07-24 Ske Technology Corp. System and method for handling and masking a substrate in a sputter deposition system
TW574385B (en) * 2002-06-25 2004-02-01 Hannstar Display Corp Method of pre-sputtering with an increased rate of use of sputtering target
DE10234858A1 (en) * 2002-07-31 2004-02-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Device for producing a magnetron discharge, especially for magnetron sputtering, in the coating of substrates has a unit producing a magnetic field having a fixed position relative to the outer target limit in the region of the outer pole
DE102004011583A1 (en) * 2004-03-10 2005-09-29 Audi Ag Coupling device is for circular piston machine and has a coupling body pair comprising first and second coupling bodies with colinear rotary axes
DE102005019101A1 (en) * 2005-04-25 2006-10-26 Steag Hama Tech Ag Magnetron-driven atomization and sputtering coating process predetermines target atomization condition and modifies magnet array rotation
JP2007092136A (en) 2005-09-29 2007-04-12 Shin Meiwa Ind Co Ltd Magnet structure for magnetron sputtering, cathode electrode unit, and magnetron sputtering apparatus
JP2007126722A (en) 2005-11-04 2007-05-24 Shin Meiwa Ind Co Ltd Magnet structure for magnetron sputtering system, cathode electrode unit, and magnetron sputtering system
ATE553495T1 (en) 2005-12-13 2012-04-15 Oerlikon Solar Ag IMPROVED SPUTTER TARGET USAGE
DE102009007156A1 (en) 2008-01-31 2009-08-06 Von Ardenne Anlagentechnik Gmbh Magnetron sputtering assembly has a ceramic cruciform electrical separator between magnetic system and drive
SG10201603937RA (en) * 2011-11-04 2016-08-30 Intevac Inc Linear scanning sputtering system and method
US20140332376A1 (en) * 2011-11-04 2014-11-13 Intevac, Inc. Sputtering system and method using counterweight
US10106883B2 (en) 2011-11-04 2018-10-23 Intevac, Inc. Sputtering system and method using direction-dependent scan speed or power
KR20150027053A (en) * 2012-05-31 2015-03-11 도쿄엘렉트론가부시키가이샤 Magnetron sputtering device, magnetron sputtering method, and storage medium
CN113584449B (en) * 2021-07-30 2023-07-28 北京航空航天大学合肥创新研究院(北京航空航天大学合肥研究生院) Circular planar magnetron sputtering cathode with high target utilization rate
CN116190180B (en) * 2023-01-16 2024-01-30 深圳市矩阵多元科技有限公司 Magnetron device for PVD planar target and magnetron sputtering equipment

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7607473A (en) * 1976-07-07 1978-01-10 Philips Nv SPRAYING DEVICE AND METHOD FOR SPRAYING WITH SUCH A DEVICE
SU711787A1 (en) * 1978-06-17 1980-10-07 Предприятие П/Я В-8851 Electric arc evaporator of metals
DD161138A1 (en) * 1981-05-27 1985-02-20 Mikroelektronik Zt Forsch Tech METHOD AND DEVICE FOR PLASMACHEMICAL APPLICATION OR FOR PLASMA CVD
DD217964A3 (en) * 1981-10-02 1985-01-23 Ardenne Manfred DEVICE FOR HIGH-RATE SCREENING ACCORDING TO THE PLASMATRON PRINCIPLE
US4444643A (en) * 1982-09-03 1984-04-24 Gartek Systems, Inc. Planar magnetron sputtering device
US4552639A (en) * 1984-07-20 1985-11-12 Varian Associates, Inc. Magnetron sputter etching system
EP0169680A1 (en) * 1984-07-20 1986-01-29 Varian Associates, Inc. Magnetron sputter etching system
JPS6247478A (en) * 1985-08-26 1987-03-02 バリアン・アソシエイツ・インコ−ポレイテツド Planer magnetron sputtering apparatus wherein circular motion and radial motion of magnetic field are combined
US4995958A (en) * 1989-05-22 1991-02-26 Varian Associates, Inc. Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile

Also Published As

Publication number Publication date
EP0503138A1 (en) 1992-09-16
FI920424A0 (en) 1992-01-30
FI100540B (en) 1997-12-31
EP0503138B1 (en) 1996-11-20
JPH04329874A (en) 1992-11-18
DE59108370D1 (en) 1997-01-02
KR920018235A (en) 1992-10-21
DE4107505A1 (en) 1992-09-10

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