FI880867A0 - Kotelo optista laitetta varten sekä menetelmä optisen laitteen valmistamiseksi - Google Patents
Kotelo optista laitetta varten sekä menetelmä optisen laitteen valmistamiseksiInfo
- Publication number
- FI880867A0 FI880867A0 FI880867A FI880867A FI880867A0 FI 880867 A0 FI880867 A0 FI 880867A0 FI 880867 A FI880867 A FI 880867A FI 880867 A FI880867 A FI 880867A FI 880867 A0 FI880867 A0 FI 880867A0
- Authority
- FI
- Finland
- Prior art keywords
- optical device
- enclosure
- manufacturing
- optical
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58218964A JPS60110180A (ja) | 1983-11-21 | 1983-11-21 | 光素子用パツケ−ジ |
JP21896483 | 1983-11-21 | ||
JP22302083 | 1983-11-25 | ||
JP58223020A JPS60113978A (ja) | 1983-11-25 | 1983-11-25 | 光素子 |
JP58232341A JPS60124885A (ja) | 1983-12-08 | 1983-12-08 | 受光ダイオードの製造方法 |
JP23234183 | 1983-12-08 | ||
FI844473 | 1984-11-14 | ||
FI844473A FI82999C (fi) | 1983-11-21 | 1984-11-14 | Optisk anordning och foerfarande foer dess framstaellning. |
Publications (4)
Publication Number | Publication Date |
---|---|
FI880867A FI880867A (fi) | 1988-02-24 |
FI880867A0 true FI880867A0 (fi) | 1988-02-24 |
FI91574B FI91574B (fi) | 1994-03-31 |
FI91574C FI91574C (fi) | 1994-07-11 |
Family
ID=27444091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI880867A FI91574C (fi) | 1983-11-21 | 1988-02-24 | Kotelo optista laitetta varten sekä menetelmä optisen laitteen valmistamiseksi |
Country Status (1)
Country | Link |
---|---|
FI (1) | FI91574C (fi) |
-
1988
- 1988-02-24 FI FI880867A patent/FI91574C/fi not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
FI91574B (fi) | 1994-03-31 |
FI880867A (fi) | 1988-02-24 |
FI91574C (fi) | 1994-07-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NO844596L (no) | Optisk innretning samt holder og fremgangsmaate for fremstilling av saadan innretning | |
FI97893B (fi) | Isoelektrinen fokusointimenetelmä ja laite mainitun menetelmän suorittamiseksi | |
KR890700465A (ko) | 공동의 광 전도체와 그 제조 방법 및 장치 | |
BR8107264A (pt) | Aparelho e processo fotometrico | |
KR840008309A (ko) | 유리섬유의 제조방법 및 장치 | |
KR870700375A (ko) | 처방전기신호를 방출하기 위한 방법 및 장치 | |
DK253184A (da) | Beskyttelseshus for et optisk element | |
DK62983D0 (da) | Apparat til vibrationsdaempning samt fremgangsmade til fremstilling af et sadant apparat | |
NO842698L (no) | Anordning for informasjonsbehandling | |
IT1199561B (it) | Dispositivi di misurazione e rilevazione per cavi su pulegge | |
FI832652A (fi) | Metod foer framstaellning av optiska glasfibrer | |
BR8304589A (pt) | Dispositivo de medicao de umidade;metodo de medicao de umidade | |
DE3474725D1 (en) | Integral optical device and method | |
FR2544922B1 (fr) | Dispositif laser | |
FR2525065B1 (fr) | Dispositif de connexion et procedes de fabrication | |
DK460981A (da) | Fremgangsmaade samt apparat til fremstilling af silicium af hoej renhed | |
FI880867A0 (fi) | Kotelo optista laitetta varten sekä menetelmä optisen laitteen valmistamiseksi | |
NO843782L (no) | Fremgangsmaate for fremstilling av en optisk komponent samt saadan fremstilt komponent | |
KR860700064A (ko) | 데이터 처리장치를 감시하는 장치 | |
FI831794L (fi) | 5-oxo-2-pyrrolidin-propansyra och dess derivat samt foerfarande foer deras framstaellning | |
NO169685C (no) | Fremgangsmaate for fremstilling av en optisk innretning | |
SE8304723D0 (sv) | Anordning for optisk centrering | |
SE8301742D0 (sv) | Anordning for optisk centrering | |
SE8206743L (sv) | Forisolerat plastror samt forfarande och anordning for dess tillverkning | |
FI833724A0 (fi) | Foerfarande foer foerpackning av produkter pao underlag samt foerpackningsmaterial och anordning fogenomfoerande av foerfarandet |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
BB | Publication of examined application | ||
MM | Patent lapsed | ||
MM | Patent lapsed |
Owner name: SUMITOMO ELECTRIC INDUSTRIES, LTD. |