FI78213B - Elektriskt ytvaogsfilter. - Google Patents

Elektriskt ytvaogsfilter. Download PDF

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Publication number
FI78213B
FI78213B FI822593A FI822593A FI78213B FI 78213 B FI78213 B FI 78213B FI 822593 A FI822593 A FI 822593A FI 822593 A FI822593 A FI 822593A FI 78213 B FI78213 B FI 78213B
Authority
FI
Finland
Prior art keywords
surface wave
housing
wave filter
system body
ytvaogsfilter
Prior art date
Application number
FI822593A
Other languages
English (en)
Other versions
FI822593A0 (fi
FI822593L (fi
Inventor
Albert Jung
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of FI822593A0 publication Critical patent/FI822593A0/fi
Publication of FI822593L publication Critical patent/FI822593L/fi
Application granted granted Critical
Publication of FI78213B publication Critical patent/FI78213B/fi

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10156—Shape being other than a cuboid at the periphery
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

1 78213 Sähköinen pinta-aaltosuodatin
Keksintö koskee sähköistä pinta-aaltosuodatinta, jonka aktiivinen alue on sijoitettu osittain sirualtaaksi muodostetulle järjestelmän rungolle, jolla on liuskan muotoiset ulkoiset, järjestelmän rungosta sähköisesti eristetyt liitoselimet, jonka pinta-aaltosuodattimen aktiivisen alueen ja ulkoisten liitoselimien välillä on lankaliitetyt sähköiset liitokset, ja jolla on kestomuovinen, ruiskutettu kotelon ja järjestelmän rungon kanta, jolla on eristyslevyt ulkoisten liitoselimien ja järjestelmän rungon välillä.
Valmistettaessa pinta-aaltosuodattimia liitetään aktiiviset sirualueet johdinliitosten avulla kotelon liitäntäpisteisiin, so. ulkoisten liitoselimien kotelon sisäosaan päin oleviin liitoskohtiin. Yhdistettävien liitoskohtien väliin asetetaan tällöin johdin kaarimaisesti. Järjestelmän rungoissa, joiden ympärille jo on ruiskutettu kestomuovinen kanta, voi lanka-liitosta tehtäessä, järjestelmän rungon lämpiämisestä johtuen, tapahtua, että johdin liimautuu järjestelmän runkoon tai vast, kotelon kantaan, jolloin johtimen välttämätön kaarimainen muoto vaurioituu. Näissä tapauksissa johdin ei saa tarpeellista etäisyyttä muihin sähköpotentiaaleihin, tai se aiheuttaa oikosulun ja siten kyseisen pinta-aaltosuodattimen vikaantumisen.
Tähän laitteesta riippuvaan ongelmaan voidaan vaikuttaa suotuisasti parannetun koneellisen liitostapahtuman avulla. Esillä olevan keksinnön tehtävänä on saada aikaan laitteesta riippumaton ratkaisu tähän ongelmaan.
Tämän tehtävän ratkaisemiseksi on keksinnölle tunnusomaista, että eristyslevyt on muodostettu yhtenä kappaleena kotelon ja järjestelmän rungon kantaan, ja että erietyslevyjen liitoslan-koihin päin olevilla sivupinnoilla on yhtä kappaletta olevat 2 7821 3 lietat, jolloin kotelon ja järjestelmän rungon kanta, erie-tyelevyt ja edullieimmin noin 0,05-0,1 mm korkeat lietat ovat keetomuovia.
Keksintöä selitetään seuraavassa lähemmin suoritusesimerkin avulla.
Piirustuksessa kuvio 1 esittää päältä nähtynä pinta-aaltosuodattimen kaavio-maisesti, jolloin kotelo on esitetty pistekatkoviivoin, kuvio 2 esittää kuvion 1 mukaisen pinta-aaltosuodattimen sivulta, ja kuvio 3 esittää kuviossa 2 kirjaimella A merkityn yksityiskohdan suuremmassa mittakaavassa.
Kuvioiden 1-3 mukaisessa pinta-aaltosuodattimessa on järjestelmän runko 13, jossa on siruallas 6 pinta-aaltosuodattimen aktiivisen alueen 14 alustana, ulkoiset, valmistuksessa pitkin pietekatkoviivaa B-B' metalliliuskasta 2 irrotettavat sähköiset ja mekaaniset liitoselimet 9, sekä samoin metalli-liuskasta 2 erotettava, yhtä kappaletta jäjestelmän rungon 13 kanssa oleva maadoitus-liitoselin 11. Järjestelmän runkoa 13 ympäröi osittain kotelon ruiskutettua keetomuovia oleva kanta 3 sekä valmiiksi asennettuna, pistekatkoviivoin esitetty mal-jamainen kotelo 10, joka on esim. muovia tai metallia. Ulkoisten liitoselimien 9 ja yksityiskohdissaan esittämättä olevan pinta-aaltosuodattimen aktiivisen alueen 14 liitoskohdat, 1 ja vastaavasti 8, on yhdistetty lankaliitoksi1la, joissa on kaarevasti kulkevat langat 5.
Kuvioiden 1-3 mukaisesti on liitoskohtien 1 ja 8 välillä eristyslevyihin 12 ruiskutetut n. 0,05-0,1 mm korkeat kesto-muovilistat 4, joiden avulla vältetään esim. johtimen oikosulku järjestelmän runkoon tai sen sirualtaaseen 6.
FI822593A 1981-07-23 1982-07-22 Elektriskt ytvaogsfilter. FI78213B (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3129134 1981-07-23
DE19813129134 DE3129134A1 (de) 1981-07-23 1981-07-23 Elektronische bauteile

Publications (3)

Publication Number Publication Date
FI822593A0 FI822593A0 (fi) 1982-07-22
FI822593L FI822593L (fi) 1983-01-24
FI78213B true FI78213B (fi) 1989-02-28

Family

ID=6137586

Family Applications (1)

Application Number Title Priority Date Filing Date
FI822593A FI78213B (fi) 1981-07-23 1982-07-22 Elektriskt ytvaogsfilter.

Country Status (5)

Country Link
US (1) US4507710A (fi)
EP (1) EP0071827B1 (fi)
DE (2) DE3129134A1 (fi)
ES (1) ES274595Y (fi)
FI (1) FI78213B (fi)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5113314A (en) * 1991-01-24 1992-05-12 Hewlett-Packard Company High-speed, high-density chip mounting
JP3622862B2 (ja) * 1994-08-24 2005-02-23 協伸工業株式会社 ワイヤホルダおよびワイヤホルダ組合せ体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1227995A (fi) * 1968-03-21 1971-04-15
FR2044193A5 (fi) * 1969-05-12 1971-02-19 Radiotechnique Compelec
US3760090A (en) * 1971-08-19 1973-09-18 Globe Union Inc Electronic circuit package and method for making same
US3868725A (en) * 1971-10-14 1975-02-25 Philips Corp Integrated circuit lead structure
US4044201A (en) * 1974-09-17 1977-08-23 E. I. Du Pont De Nemours And Company Lead frame assembly
US3981076A (en) * 1974-11-27 1976-09-21 Commissariat A L'energie Atomique Method of connecting electronic microcomponents
US4068910A (en) * 1976-03-23 1978-01-17 Honeywell Inc. Bus board connection apparatus
US4378902A (en) * 1981-02-17 1983-04-05 The Jade Corporation Apparatus for preventing wire sag in the wire bonding process for producing semiconductor devices

Also Published As

Publication number Publication date
ES274595Y (es) 1985-01-01
DE3278380D1 (en) 1988-05-26
DE3129134A1 (de) 1983-02-03
EP0071827A3 (en) 1984-05-30
EP0071827A2 (de) 1983-02-16
US4507710A (en) 1985-03-26
FI822593A0 (fi) 1982-07-22
FI822593L (fi) 1983-01-24
EP0071827B1 (de) 1988-04-20
ES274595U (es) 1984-05-16

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Owner name: SIEMENS AKTIENGESELLSCHAFT